公开(公告)号：US08507934B2

公开(公告)日：2013-08-13

申请号：US13209448

申请日：2011-08-15

申请人： Chao-Hsiung Chang ,  Chieh-Ling Chang ,  Pi-Chiang Hu

发明人： Chao-Hsiung Chang ,  Chieh-Ling Chang ,  Pi-Chiang Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： An exemplary light emitting diode (LED) package includes a substrate having a first electrical portion and a second electrical portion formed thereon, two antioxidation layers formed on and electrically connected to the first electrical portion and the second electrical portion, respectively, and an LED chip disposed on the substrate and electrically connected to the two antioxidation layers.

摘要翻译： 示例性的发光二极管（LED）封装包括具有形成在其上的第一电气部分和第二电气部分的基板，分别形成在第一电气部分和第二电气部分上并电连接到第一电气部分和第二电气部分的两个抗氧化层，以及LED芯片 设置在基板上并电连接到两个抗氧化层。

公开(公告)号：US08410516B2

公开(公告)日：2013-04-02

申请号：US13082406

申请日：2011-04-08

申请人： Chao-Hsiung Chang ,  Pi-Chiang Hu

发明人： Chao-Hsiung Chang ,  Pi-Chiang Hu

IPC分类号： H01L33/00 ,  H01L29/207 ,  H01L29/18 ,  H01L23/00

CPC分类号： H01L33/36 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/09701 ,  H01L2924/00014

摘要： A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.

摘要翻译： 发光二极管（LED）封装包括衬底，第一LED芯片和第二LED芯片。 基板包括第一至第四电极和互连电极。 安装区域被限定在基板的顶表面的中心。 第一至第四电极分别位于安装区域外的基板的四个角中。 第一互连电极嵌入在基板中以电连接第一和第三电极。 第一LED芯片和第二LED芯片布置在安装区域中。 每个LED芯片包括阳极焊盘和阴极焊盘。 第一至第四电极分别通过多条金属线连接到第一和第二LED芯片的四个焊盘，并且在第一和第二LED芯片之间不形成金属线连接。

公开(公告)号：US08530252B2

公开(公告)日：2013-09-10

申请号：US13216246

申请日：2011-08-24

申请人： Chao-Hsiung Chang ,  Chieh-Ling Chang

发明人： Chao-Hsiung Chang ,  Chieh-Ling Chang

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for manufacturing light emitting diodes includes steps of: providing a base have an upper conductive layer and a lower conductive layer on a top face and a bottom face thereof, respectively; forming a plurality of through holes in the base; defining a plurality of grooves to divide the upper and lower conductive layers into discrete strips; forming a connection layer on an inner circumferential face of each hole to connect the opposite strips of the upper and lower conductive layers; filling a supporting layer in an upper portion of each hole; forming a reinforcing layer on the supporting layer and the upper conductive layer; fixing chips on the reinforcing layer and electrically connecting the chips with the strips of the upper conductive layer; forming an encapsulant on the reinforcing layer; and cutting the base into individual LEDs along the holes.

摘要翻译： 一种制造发光二极管的方法包括以下步骤：分别在其顶面和底面上设置基底，具有上导电层和下导电层; 在基座中形成多个通孔; 限定多个凹槽以将上导电层和下导电层分成离散的条带; 在每个孔的内周面上形成连接层，以连接上导电层和下导电层的相对的条带; 在每个孔的上部填充支撑层; 在所述支撑层和所述上导电层上形成增强层; 将芯片固定在加强层上并将芯片与上导电层的条带电连接; 在加强层上形成密封剂; 并将基座切割成沿着孔的各个LED。

公开(公告)号：US08436392B2

公开(公告)日：2013-05-07

申请号：US13031582

申请日：2011-02-21

申请人： Chao-Hsiung Chang ,  Chieh-Ling Chang ,  Shen-Bo Lin

发明人： Chao-Hsiung Chang ,  Chieh-Ling Chang ,  Shen-Bo Lin

IPC分类号： H01L33/48 ,  H01L33/08

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode package comprises a substrate with a first surface and a second surface opposite to each other, a circuit on the substrate, a support on the substrate for reinforcing strength of the substrate, a plurality of light emitting diodes on the substrate and electrically connected to the circuit, and a cover layer on the plurality of light emitting diodes. A method for manufacturing a light-emitting diode package is further provided.

摘要翻译： 发光二极管封装包括具有彼此相对的第一表面和第二表面的衬底，衬底上的电路，用于增强衬底强度的衬底上的支撑体，衬底上的多个发光二极管和电 连接到电路，以及多个发光二极管上的覆盖层。 还提供了一种用于制造发光二极管封装的方法。

公开(公告)号：US08642388B2

公开(公告)日：2014-02-04

申请号：US13332380

申请日：2011-12-21

申请人： Chao-Hsiung Chang

发明人： Chao-Hsiung Chang

IPC分类号： H01L21/00 ,  H01L33/00 ,  H01L23/22 ,  H01L23/24 ,  H01L23/52 ,  H01L23/12

CPC分类号： H01L33/52 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0066 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for manufacturing LEDs includes following steps: forming circuit structures on a substrate, each circuit structure having a first metal layer and a second metal layer formed on opposite surfaces of the substrate and a connecting section interconnecting the first and second metal layers; cutting through each circuit structure along a middle of the connecting section to form first and second electrical connecting portions insulated from each other via a gap therebetween; arranging LED chips on the substrate and electrically connecting the LED chips to the first and second electrical connecting portions; forming an encapsulation on the substrate to cover the LED chips; and cutting through the substrate and the encapsulation between the first and second electrical connecting portions of neighboring circuit structures to obtain the LEDs.

摘要翻译： 一种制造LED的方法包括以下步骤：在衬底上形成电路结构，每个电路结构具有形成在衬底的相对表面上的第一金属层和第二金属层以及互连第一和第二金属层的连接部分; 沿着连接部分的中间切割每个电路结构，以形成通过它们之间的间隙彼此绝缘的第一和第二电连接部分; 将LED芯片布置在基板上并将LED芯片电连接到第一和第二电连接部分; 在衬底上形成封装以覆盖LED芯片; 并切割穿过基板和相邻电路结构的第一和第二电连接部分之间的封装以获得LED。

公开(公告)号：US08597964B2

公开(公告)日：2013-12-03

申请号：US13443888

申请日：2012-04-11

申请人： Chih-Hsun Ke ,  Ming-Ta Tsai ,  Chao-Hsiung Chang

发明人： Chih-Hsun Ke ,  Ming-Ta Tsai ,  Chao-Hsiung Chang

IPC分类号： H01L33/60

CPC分类号： H01L33/005 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a plurality of holders each being for an LED package structure includes steps: providing a base, pluralities of through holes being defined in the base to divide the base into a plurality of basic units; etching the base to form a dam at an upper surface of each of the basic units of the base; forming a first electrical portion and a second electrical portion on each basic unit of the base, the first electrical portion and the second electrical portion being separated and insulated from each other by the dam; providing a plurality of reflective cups each on a corresponding basic unit of the base, each of the reflective cups surrounding the corresponding dam; and cutting the base into the plurality of basic units along the through holes to form the plurality of holders.

摘要翻译： 一种用于制造LED封装结构的多个保持器的方法包括以下步骤：提供基座，多个通孔限定在基座中，以将基座划分为多个基本单元; 蚀刻基部以在基部的每个基本单元的上表面处形成坝; 在所述基座的每个基本单元上形成第一电气部分和第二电气部分，所述第一电气部分和所述第二电气部分由所述坝彼此分离和绝缘; 在基座的相应的基本单元上设置多个反射杯，每个反射杯围绕对应的水坝; 以及沿所述通孔将所述基部切割成所述多个基本单元以形成所述多个保持器。

公开(公告)号：US08907371B2

公开(公告)日：2014-12-09

申请号：US13283605

申请日：2011-10-28

申请人： Shiun-Wei Chan ,  Chih-Hsun Ke ,  Chao-Hsiung Chang

发明人： Shiun-Wei Chan ,  Chih-Hsun Ke ,  Chao-Hsiung Chang

IPC分类号： H01L33/54 ,  H01L33/64 ,  H05K1/02 ,  H01L33/48

CPC分类号： H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/1815 ,  H01L2924/18165 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00014

摘要： An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an anode of the LED die, and a negative electrode electrically connected to a cathode of the LED die. The encapsulation includes a light emitting surface opposite to the bottom surface thereof. The LED die includes a front surface for outputting light outward, and a back surface opposite to the front surface. The front surface is covered by the encapsulation and faces the light emitting surface of the encapsulation. The back surface is exposed outside. A light emitting device is provided by mounting the LED package to a circuit board. The circuit board has a heat conductor connecting with the LED die.

摘要翻译： LED封装包括透光封装，嵌入从封装底表面的封装中的LED管芯，与LED管芯的阳极电连接的正电极，以及与LED管芯的阴极电连接的负电极 。 封装包括与其底表面相对的发光表面。 LED管芯包括用于向外输出光的前表面和与前表面相对的后表面。 前表面被封装覆盖，并面向封装的发光表面。 背面暴露在外面。 通过将LED封装安装到电路板来提供发光器件。 电路板具有与LED管芯连接的导热体。

公开(公告)号：US08546833B2

公开(公告)日：2013-10-01

申请号：US13585847

申请日：2012-08-15

申请人： Chao-Hsiung Chang ,  Hou-Te Lin

发明人： Chao-Hsiung Chang ,  Hou-Te Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2924/00014

摘要： An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.

摘要翻译： 示例性的LED封装包括第一和第二电极，LED管芯和封装。 每个第一和第二电极的内壁包括第一斜面。 LED管芯被第一和第二电极包围并电连接。 LED管芯包括输出表面。 该封装件填充在第一电极和第二电极之间并覆盖LED管芯，并且包括相对的第一和第二外表面，其中第二外表面用作LED封装的输出表面。 反射层涂覆在封装的第一外表面上。 电极结构的第一倾斜平面是光反射的，并且从LED芯片的输出表面沿着远离LED管芯的方向向LED封装的输出表面倾斜延伸。

公开(公告)号：US08564003B2

公开(公告)日：2013-10-22

申请号：US13300618

申请日：2011-11-20

申请人： Chih-Hsun Ke ,  Ming-Ta Tsai ,  Chao-Hsiung Chang ,  Shiun-Wei Chan

发明人： Chih-Hsun Ke ,  Ming-Ta Tsai ,  Chao-Hsiung Chang ,  Shiun-Wei Chan

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package comprises a substrate, a reflector, a light-absorbable layer, an encapsulation layer and an LED chip. The reflector comprises a first incline with an inclined angle surrounding the LED chip. The light-absorbable layer comprises a second incline with another inclined angle direct to the LED chip, wherein the inclined angle of the second incline is greater than that of the first incline and the inclined angle of the first incline is between 90 to 150 degrees.

摘要翻译： LED封装包括基板，反射器，光吸收层，封装层和LED芯片。 反射器包括围绕LED芯片的倾斜角的第一倾斜。 光吸收层包括直接连接到LED芯片的另一倾斜角的第二斜面，其中第二倾斜角的倾斜角大于第一倾斜角度，第一斜面的倾斜角度在90度到150度之间。

公开(公告)号：US08536592B2

公开(公告)日：2013-09-17

申请号：US13366374

申请日：2012-02-06

申请人： Chao-Hsiung Chang ,  Hou-Te Lin

发明人： Chao-Hsiung Chang ,  Hou-Te Lin

IPC分类号： H01L33/40

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues.

摘要翻译： 提供了具有位于基板上的坝的LED封装器件，通过该LED封装器件在衬底上限定两个区域。 两个LED模具分别设置在两个区域上并由坝隔开; 因此，LED封装器件具有增强的侧向发光强度和宽的发光角度。 LED封装器件可用于背光单元，以防止光环和热点问题。