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公开(公告)号：US20090147136A1
公开(公告)日：2009-06-11
申请号：US12015613
申请日：2008-01-17
CPC分类号： H04N5/63 , H04N21/414 , H04N21/436
摘要： A TV card with power-switching function is provided. The TV card comprises a TV card chip module, a power-switching module and a connecting interface. The power switching module is connected to the TV card chip module to transfer or block a power to the TV card chip module; the connecting interface is connected to the power-switching module and a host, wherein the host provides the power to the power-switching module through the connecting interface; the connecting interface further comprises a reserved pin to receive and transfer a switching signal to the power-switching module through the connecting interface to enable the power-switching module to transfer or block the power to the TV card chip module.
摘要翻译： 提供具有电源切换功能的电视卡。 电视卡包括电视卡芯片模块，电源切换模块和连接接口。 电源开关模块连接到电视卡芯片模块，将电源传输到电视卡芯片模块; 连接接口连接到电源切换模块和主机，其中主机通过连接接口向电源切换模块提供电力; 连接接口还包括保留引脚，以通过连接接口将切换信号接收并传送到电源切换模块，以使电源切换模块能够将电力传输或阻断到电视卡芯片模块。
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公开(公告)号：US07857228B2
公开(公告)日：2010-12-28
申请号：US12015613
申请日：2008-01-17
IPC分类号： G06K19/06
CPC分类号： H04N5/63 , H04N21/414 , H04N21/436
摘要： A TV card with power-switching function is provided. The TV card comprises a TV card chip module, a power-switching module and a connecting interface. The power switching module is connected to the TV card chip module to transfer or block a power to the TV card chip module; the connecting interface is connected to the power-switching module and a host, wherein the host provides the power to the power-switching module through the connecting interface; the connecting interface further comprises a reserved pin to receive and transfer a switching signal to the power-switching module through the connecting interface to enable the power-switching module to transfer or block the power to the TV card chip module.
摘要翻译： 提供具有电源切换功能的电视卡。 电视卡包括电视卡芯片模块，电源切换模块和连接接口。 电源开关模块连接到电视卡芯片模块，将电源传输到电视卡芯片模块; 连接接口连接到电源切换模块和主机，其中主机通过连接接口向电源切换模块提供电力; 连接接口还包括保留引脚，以通过连接接口将切换信号接收并传送到电源切换模块，以使电源切换模块能够将电力传送或阻断到电视卡芯片模块。
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公开(公告)号：US20080258306A1
公开(公告)日：2008-10-23
申请号：US12105538
申请日：2008-04-18
IPC分类号： H01L23/538 , H01L21/56
CPC分类号： H01L23/3114 , H01L21/6835 , H01L23/3135 , H01L23/3185 , H01L24/24 , H01L24/48 , H01L24/82 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/02371 , H01L2224/04105 , H01L2224/05001 , H01L2224/05008 , H01L2224/05023 , H01L2224/05026 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05548 , H01L2224/05569 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/12105 , H01L2224/16145 , H01L2224/48091 , H01L2224/82001 , H01L2224/97 , H01L2225/06562 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2224/82 , H01L2924/01028 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a semiconductor device and a method for fabricating the same. The semiconductor device includes a chip having an active surface and an opposing non-active surface, wherein a plurality of bond pads are formed on the active surface, and first metal layers are formed on the bond pads and to edges of the non-active surface; conductive traces disposed on the non-active surface of the chip; a dielectric layer covering sides of the chip and formed with a plurality of openings therein to expose a portion of the conductive traces; and a plurality of second metal layers formed in the openings of the dielectric layer and on the first metal layers, such that the bond pads are electrically connected to the conductive traces via the first and second metal layers.
摘要翻译： 本发明提供一种半导体器件及其制造方法。 半导体器件包括具有活性表面和相对的非活性表面的芯片，其中在有源表面上形成多个接合焊盘，并且第一金属层形成在接合焊盘和非活性表面的边缘上 ; 布置在芯片的非有源表面上的导电迹线; 介电层，其覆盖所述芯片的侧面并在其中形成有多个开口以暴露所述导电迹线的一部分; 以及多个第二金属层，形成在电介质层的开口中和第一金属层上，使得接合焊盘经由第一和第二金属层电连接到导电迹线。
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4.发明授权Semiconductor package device, semiconductor package structure, and fabrication methods thereof 有权半导体封装器件，半导体封装结构及其制造方法公开(公告)号：US08304891B2
公开(公告)日：2012-11-06
申请号：US12315787
申请日：2008-12-04
CPC分类号： H01L23/4334 , H01L21/486 , H01L23/31 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L24/97 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/15311 , H01L2924/157 , H01L2924/3511 , H01L2924/00 , H01L2224/81
摘要： A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.
摘要翻译： 提供了一种半导体封装器件，半导体封装结构及其制造方法，其主要包括在形成有TSV（透硅通孔）的晶片上设置多个半导体芯片，并将半导体芯片与TSV电连接; 用密封剂封装半导体芯片; 并将硬组分设置在密封剂上。 硬组件确保了在焊料凸块工艺期间晶片的平整度，并且在单独化处理期间提供对晶片的支撑，使得晶片可以牢固地位于单个载体上，从而克服现有技术的缺点，即难以安装焊料 碰撞，切割晶片难度大。
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5.发明申请Semiconductor package device, semiconductor package structure, and fabrication methods thereof 有权半导体封装器件，半导体封装结构及其制造方法公开(公告)号：US20090294959A1
公开(公告)日：2009-12-03
申请号：US12315787
申请日：2008-12-04
IPC分类号： H01L23/522 , H01L23/532 , H01L23/28 , H01L23/31
CPC分类号： H01L23/4334 , H01L21/486 , H01L23/31 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L24/97 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/15311 , H01L2924/157 , H01L2924/3511 , H01L2924/00 , H01L2224/81
摘要： A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.
摘要翻译： 提供了一种半导体封装器件，半导体封装结构及其制造方法，其主要包括在形成有TSV（透硅通孔）的晶片上设置多个半导体芯片，并将半导体芯片与TSV电连接; 用密封剂封装半导体芯片; 并将硬组分设置在密封剂上。 硬组件确保了在焊料凸块工艺期间晶片的平整度，并且在单独化处理期间提供对晶片的支撑，使得晶片可以牢固地位于单个载体上，从而克服现有技术的缺点，即难以安装焊料 碰撞，切割晶片难度大。
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公开(公告)号：USD493799S1
公开(公告)日：2004-08-03
申请号：US29195995
申请日：2003-12-18
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公开(公告)号：USD498760S1
公开(公告)日：2004-11-23
申请号：US29196558
申请日：2003-12-30
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