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公开(公告)号：US20080185671A1
公开(公告)日：2008-08-07
申请号：US12011933
申请日：2008-01-30
CPC分类号： H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L31/0203 , H01L2224/05147 , H01L2224/05166 , H01L2224/05548 , H01L2224/05573 , H01L2224/0558 , H01L2224/05655 , H01L2224/13 , H01L2924/00014
摘要： A sensor semiconductor package and a fabrication method thereof are provided in the present application. The fabrication method comprises steps of: forming a plurality of grooves on a wafer between bond pads on active surfaces of every adjacent chips; forming metal layers in the grooves for electrically connecting with the bond pads of adjacent chips; thinning the non-active surfaces to expose the metal layers therefrom; forming a cover layer on the non-active surfaces with the metal layers are exposed therefrom; forming a solder resist layer on the covering layer and the conductive wirings with terminals of the conductive wirings are exposed therefrom; and cutting along cutting paths between every sensor chips to form a plurality of sensor semiconductor packages. Accordingly, the prior art problems such as misalignment of forming beveled grooves, concentrated stress and breakage can be solved.
摘要翻译： 在本申请中提供了一种传感器半导体封装及其制造方法。 该制造方法包括以下步骤：在每个相邻芯片的有源表面上的接合焊盘之间的晶片上形成多个凹槽; 在所述凹槽中形成用于与相邻芯片的接合焊盘电连接的金属层; 使非活性表面变薄从而使金属层露出; 在金属层的非活性表面上形成覆盖层从其露出; 在覆盖层上形成阻焊层，并且导电布线与导电配线的端子相接触; 并且沿着每个传感器芯片之间的切割路径切割以形成多个传感器半导体封装。 因此，可以解决现有技术的问题，例如形成斜槽的未对准，集中应力和断裂。
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公开(公告)号：US20080203511A1
公开(公告)日：2008-08-28
申请号：US12072369
申请日：2008-02-26
IPC分类号： H01L31/0224 , H01L21/60
CPC分类号： H01L31/0203 , H01L21/6835 , H01L24/19 , H01L24/29 , H01L24/33 , H01L24/83 , H01L24/97 , H01L2221/68359 , H01L2221/68377 , H01L2224/83 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/3512 , H01L2924/00
摘要： The present invention provides a sensor-type semiconductor package and a method for fabricating the same. The method includes the steps of: providing a wafer having a plurality of sensor chips for mounting the wafer on a carrier board having an insulation layer, a plurality of conductive traces, and a substrate; forming a plurality of grooves among the solder pads on the active surfaces of the adjacent sensor chips, so as to expose the conductive traces and form a metal layer in the grooves, to electrically connect to the solder pads on the active surfaces of the adjacent sensor chips and the conductive traces; disposing a transparent medium on the wafer to cover the sensing areas of the sensor chips; removing the substrate, so as to expose the conductive traces and the insulation layer; and cutting the sensor chips along the borders to form a plurality of sensor-type semiconductor packages. This can avoid the formation of slanted grooves on the non-active surface on the wafer and shift in position of the grooves due to failure to align with the cutting lines among the sensor chips, as observed in prior art. Consequently, the problems such as stress concentration and cracking are likely to occur in the contact points of the traces formed in the slanted grooves and the traces in the active surfaces.
摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该方法包括以下步骤：提供具有多个传感器芯片的晶片，用于将晶片安装在具有绝缘层，多个导电迹线和基板的载体板上; 在相邻传感器芯片的有效表面上的焊盘之间形成多个凹槽，以便露出导电迹线并在沟槽中形成金属层，以电连接到邻近传感器的有源表面上的焊盘 芯片和导电迹线; 在晶片上布置透明介质以覆盖传感器芯片的感测区域; 去除衬底，以便露出导电迹线和绝缘层; 并且沿着边界切割传感器芯片以形成多个传感器型半导体封装。 这可以避免在晶片上的非活性表面上形成斜槽，并且由于与现有技术中观察到的传感器芯片中的切割线不对准而使槽的位置移位。 因此，在倾斜槽中形成的迹线和活性表面中的迹线的接触点中可能会出现应力集中和开裂等问题。
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公开(公告)号：US20080105942A1
公开(公告)日：2008-05-08
申请号：US11982516
申请日：2007-11-02
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48247 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00012
摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。
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公开(公告)号：US07858446B2
公开(公告)日：2010-12-28
申请号：US11982516
申请日：2007-11-02
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48247 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00012
摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。
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5.发明授权Package structure having micro-electromechanical element and fabrication method thereof 有权具有微机电元件的封装结构及其制造方法公开(公告)号：US08198689B2
公开(公告)日：2012-06-12
申请号：US12769041
申请日：2010-04-28
IPC分类号： H01L23/485
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。
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公开(公告)号：US20090057799A1
公开(公告)日：2009-03-05
申请号：US12229651
申请日：2008-08-26
CPC分类号： H01L31/0203 , H01L31/02164 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A sensor semiconductor device and a method for fabricating the same are provided. At least one sensor chip is mounted and electrically connected to a lead frame. A first and a second encapsulation molding processes are sequentially performed to form a transparent encapsulant for encapsulating the sensor chip and a part of the lead frame and to form a light-impervious encapsulant for encapsulating the transparent encapsulant. The transparent encapsulant has a light-pervious portion formed at a position corresponding to and above a sensor zone of the sensor chip. The light-pervious portion is exposed from the light-impervious encapsulant. Light may penetrate the light-pervious portion, without using an additional cover board, thereby reducing manufacturing steps and costs. The above arrangement avoids prior-art problems of poor reliability caused by a porous encapsulant and poor signal reception caused by interference of ambient light entering into a conventional chip only encapsulated by a transparent encapsulant.
摘要翻译： 提供一种传感器半导体器件及其制造方法。 至少一个传感器芯片被安装并电连接到引线框架。 依次执行第一和第二封装成型工艺以形成用于封装传感器芯片和引线框架的一部分的透明密封剂，并形成用于封装透明密封剂的不透光密封剂。 透明密封剂具有形成在对应于传感器芯片的传感器区域上方的位置处的透光部分。 透光部分从不透光的密封剂暴露出来。 光可以穿透透光部分，而不使用附加的盖板，从而减少制造步骤和成本。 上述布置避免了由多孔密封剂引起的可靠性差的现有技术问题，以及由仅通过透明密封剂封装的传统芯片的环境光的干扰引起的差信号接收。
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7.发明申请Multi-chip semiconductor device having leads and method for fabricating the same 审中-公开具有引线的多芯片半导体器件及其制造方法公开(公告)号：US20080283982A1
公开(公告)日：2008-11-20
申请号：US12152802
申请日：2008-05-15
IPC分类号： H01L21/58 , H01L23/495
CPC分类号： H05K1/141 , H01L23/3121 , H01L23/49811 , H01L23/49816 , H01L23/49861 , H01L24/48 , H01L24/81 , H01L24/85 , H01L24/97 , H01L25/0655 , H01L2224/48091 , H01L2224/48247 , H01L2224/81801 , H01L2224/85 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/3421 , H05K3/3436 , H05K2201/1034 , H05K2201/10659 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention proposes a multi-chip semiconductor device having leads and a method for fabricating the same. The method includes the steps of: providing a substrate having a plurality of connection pads disposed on a surface thereof; mounting a plurality of semiconductor chips on the surface of the substrate, and electrically connecting the semiconductor chips to the surface of the substrate; forming an encapsulant on the substrate to encapsulate the semiconductor chips and expose the connection pads to form a package unit; and providing a lead frame having a plurality of leads, and electrically connecting the connection pads exposed from the package unit to the leads of the lead frame to form a multi-chip semiconductor device having leads, thereby forming a multi-chip semiconductor device having leads. By the multi-chip semiconductor device and the method for fabricating the same as proposed in the present invention, problems like poor reliability caused by stress induced by several types of materials in a semiconductor package into which a substrate and leads are integrated, moisture absorption by an encapsulated substrate, and cracks developed as a result of moisture absorption by the substrate can be avoided.
摘要翻译： 本发明提出一种具有引线的多芯片半导体器件及其制造方法。 该方法包括以下步骤：提供具有设置在其表面上的多个连接焊盘的基板; 将多个半导体芯片安装在所述基板的表面上，并且将所述半导体芯片电连接到所述基板的表面; 在衬底上形成密封剂以封装半导体芯片并暴露连接焊盘以形成封装单元; 并且提供具有多个引线的引线框架，并且将从封装单元暴露的连接焊盘电连接到引线框架的引线以形成具有引线的多芯片半导体器件，从而形成具有引线的多芯片半导体器件 。 通过本发明中提出的多芯片半导体器件及其制造方法，由半导体封装中由几种材料引起的应力引起的可靠性差的问题，其中衬底和引线被集成到其中，由于 可以避免被封装的基材和由于基材吸湿而显影的裂纹。
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公开(公告)号：US08653661B2
公开(公告)日：2014-02-18
申请号：US13170424
申请日：2011-06-28
IPC分类号： H01L21/56
CPC分类号： B81C1/00301 , B81B2207/096 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A package structure having an MEMS element is provided, which includes: a protection layer having openings formed therein; conductors formed in the openings, respectively; conductive pads formed on the protection layer and the conductors; a MEMS chip disposed on the conductive pads; and an encapsulant formed on the protection layer for encapsulating the MEMS chip. By disposing the MEMS chip directly on the protection layer to dispense with the need for a carrier, such as a wafer or a circuit board that would undesirably add to the thickness, the present invention reduces the overall thickness of the package to thereby achieve miniaturization.
摘要翻译： 提供了具有MEMS元件的封装结构，其包括：形成有开口的保护层; 导体分别形成在开口中; 形成在保护层和导体上的导电焊盘; 设置在导电焊盘上的MEMS芯片; 以及形成在用于封装MEMS芯片的保护层上的密封剂。 通过将MEMS芯片直接设置在保护层上，以免对不希望地增加厚度的载体（例如晶片或电路板）的需要，本发明减小了封装的整体厚度从而实现小型化。
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公开(公告)号：US20120241937A1
公开(公告)日：2012-09-27
申请号：US13492220
申请日：2012-06-08
IPC分类号： H01L23/498
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。
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公开(公告)号：US20080303111A1
公开(公告)日：2008-12-11
申请号：US12156901
申请日：2008-06-05
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L23/24 , H01L31/18 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention discloses a sensor package and a method for fabricating the same. The sensor package includes: a substrate with an opening; a sensor chip disposed in the opening and electrically connected to the substrate; an encapsulant filling spacing between the sensor chip and the opening so as to secure the sensor chip to the substrate; and a transparent cover attached to the substrate via an adhesive layer, wherein the adhesive layer covers the sensor chip and bonding wires and is formed with an opening for exposing sensor region of the sensor chip. Securing the sensor chip in the opening of the substrate reduces the height of the sensor package, and meanwhile the process cost is reduced by eliminating the need of formation of conductive bumps on the sensor chip or the transparent cover and eliminating the need of specially designed substrate.
摘要翻译： 本发明公开了一种传感器封装及其制造方法。 传感器封装包括：具有开口的基板; 传感器芯片，其布置在所述开口中并电连接到所述基板; 传感器芯片和开口之间的密封剂填充间隔，以将传感器芯片固定到基板上; 以及通过粘合剂层附着到基板的透明盖，其中粘合剂层覆盖传感器芯片和接合线，并且形成有用于暴露传感器芯片的传感器区域的开口。 将传感器芯片固定在基板的开口中，降低传感器封装的高度，同时通过消除在传感器芯片或透明盖上形成导电凸块的需要降低工艺成本，并且不需要特别设计的基板 。
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