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    Electrically connecting terminal structure of circuit board and manufacturing method thereof
    3.
    发明授权
    Electrically connecting terminal structure of circuit board and manufacturing method thereof 有权
    电路板的电气连接端子结构及其制造方法

    公开(公告)号：US07719853B2

    公开(公告)日：2010-05-18

    申请号：US11781086

    申请日：2007-07-20

    申请人： Chao-Wen Shih

    发明人： Chao-Wen Shih

    IPC分类号： H05K7/00

    CPC分类号： H05K3/3473 ,  H05K3/244 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09563 ,  H05K2201/0989 ,  H05K2203/043 ,  H05K2203/054

    摘要： An electrically connecting terminal structure of a circuit board and a manufacturing method thereof are disclosed. The method includes: providing a circuit board defined with first and second predetermined areas; forming the first electrically connecting pad in the first predetermined area and the second electrically connecting pad in a portion of the second predetermined area; forming an insulated protecting layer on the circuit board, forming openings on the insulated protecting layer for exposing the first and second electrically connecting pads and a pad-uncovered portion of the second predetermined area; forming a conductive layer on the insulated protecting layer and forming openings of the insulated protecting layer; forming a resist on the conductive layer, forming openings on the resist above the openings of the insulated protecting layer; and forming first and second metals in the openings above the first and second electrically connecting pads and the pad-uncovered portion of the second predetermined area.

    摘要翻译： 公开了一种电路板的电连接端子结构及其制造方法。 该方法包括：提供限定有第一和第二预定区域的电路板; 在所述第二预定区域的一部分中形成所述第一预定区域中的所述第一电连接焊盘和所述第二电连接焊盘; 在所述电路板上形成绝缘保护层，在所述绝缘保护层上形成开口，用于暴露所述第一和第二电连接焊盘和所述第二预定区域的焊盘未覆盖部分; 在绝缘保护层上形成导电层，形成绝缘保护层的开口; 在导电层上形成抗蚀剂，在绝缘保护层的开口上方的抗蚀剂上形成开口; 以及在所述第一和第二电连接焊盘和所述第二预定区域的焊盘未覆盖部分之上的开口中形成第一和第二金属。

    CIRCUIT BOARD AND FABRICATION METHOD THEREOF
    4.
    发明申请
    CIRCUIT BOARD AND FABRICATION METHOD THEREOF 审中-公开
    电路板及其制造方法

    公开(公告)号：US20090090548A1

    公开(公告)日：2009-04-09

    申请号：US12248671

    申请日：2008-10-09

    申请人： Chao-Wen Shih ,  Ya-Lun Yen

    发明人： Chao-Wen Shih ,  Ya-Lun Yen

    IPC分类号： H01R12/04 ,  H01B13/00 ,  H05K3/10

    CPC分类号： H05K3/4661 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/386 ,  H05K2201/09563 ,  H05K2201/09581 ,  Y10T29/49155

    摘要： A circuit board is disclosed, including a core board, wherein at least one surface thereof has a core circuit layer with a plurality of conductive lands; a first dielectric layer disposed on the core board and disposed with a plurality of openings for exposing the conductive lands; a first coupling layer disposed on the first dielectric layer, the first coupling layer having a plurality of openings disposed corresponding to the openings of the first dielectric layer; and a first circuit layer disposed on the first coupling layer and a plurality of first conductive vias disposed in the openings of the first coupling layer for electrically connecting to the conductive lands of the core circuit layer. By the formation of the first coupling layer that connects the first circuit layer and the first dielectric layer, the bond strength between the first circuit layer and the first dielectric layer is enhanced, thereby preventing detachment and delamination as encountered in the prior art. The invention further provides a fabrication method of the circuit board described above.

    摘要翻译： 公开了一种电路板，包括芯板，其中至少一个表面具有具有多个导电焊盘的芯电路层; 第一电介质层，设置在所述芯板上并且设置有用于暴露所述导电焊盘的多个开口; 设置在所述第一介电层上的第一耦合层，所述第一耦合层具有对应于所述第一介电层的开口设置的多个开口; 以及设置在第一耦合层上的第一电路层和设置在第一耦合层的开口中的多个第一导电通孔，用于电连接到芯电路层的导电焊盘。 通过形成连接第一电路层和第一电介质层的第一耦合层，增强了第一电路层和第一介电层之间的结合强度，从而防止了现有技术中遇到的分离和分层。 本发明还提供了上述电路板的制造方法。

    Flip-chip substrate
    5.
    发明申请
    Flip-chip substrate 审中-公开
    倒装芯片

    公开(公告)号：US20080230260A1

    公开(公告)日：2008-09-25

    申请号：US12076678

    申请日：2008-03-21

    申请人： Chao-Wen SHIH

    发明人： Chao-Wen SHIH

    IPC分类号： H05K1/09

    CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/423 ,  H05K3/4605 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H01L2924/00

    摘要： A flip-chip substrate is disclosed, which comprises a core substrate including an aluminum oxide substrate and a first circuit layer, wherein the aluminum oxide substrate has a top surface, a bottom surface, and a plurality of conductive through holes, the conductive through holes connect the top surface and the bottom surface the first circuit layer disposed on the top surface and the bottom surface and electrically connects to the conductive through holes; and a built-up structure disposed on the top surface and the bottom surface and electrically connecting to the first circuit layer. Moreover, the conductive through holes are formed by forming plural through holes through electrolyzing, and then forming a first seed layer and a first metal layer inside the through holes. Therefore, the problem of substrate warpage can be prevented, and the wiring density of the flip-chip substrate can be improved.

    摘要翻译： 公开了一种倒装芯片，其包括具有氧化铝基板和第一电路层的芯基板，其中所述氧化铝基板具有顶表面，底表面和多个导电通孔，所述导电通孔 将顶表面和底表面连接设置在顶表面和底表面上的第一电路层，并电连接到导电通孔; 以及设置在顶表面和底表面上并电连接到第一电路层的积层结构。 此外，通过电解形成多个通孔形成导电通孔，然后在通孔内部形成第一籽晶层和第一金属层。 因此，可以防止基板翘曲的问题，并且可以提高倒装芯片基板的配线密度。

    CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF
    6.
    发明申请
    CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF 有权
    电路板结构及其制造方法

    公开(公告)号：US20080174009A1

    公开(公告)日：2008-07-24

    申请号：US12055546

    申请日：2008-03-26

    申请人： Chao-Wen Shih

    发明人： Chao-Wen Shih

    IPC分类号： H01L23/48

    CPC分类号： H05K3/389 ,  H05K3/28 ,  H05K3/4644 ,  H05K2203/121 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T428/24917

    摘要： A circuit board structure and fabrication method thereof are disclosed, including: a circuit board with a circuit layer thereon; a reactant formed on the surface of the circuit layer, wherein the reactant is an organic metallic polymer having a polymer end and a metal ion end; and a dielectric layer formed above the reactant and the circuit board, thus forming a metallic bond between the metal ion end of the reactant and the circuit layer and forming a chemical bond between the polymer end of the reactant and the dielectric layer. Owing to enhanced bonding between the dielectric layer and the circuit board, electrical performance of the circuit board structure is improved, and the demand for fine circuits is met.

    摘要翻译： 公开了一种电路板结构及其制造方法，包括：电路板，其上具有电路层; 形成在电路层的表面上的反应物，其中反应物是具有聚合物末端和金属离子末端的有机金属聚合物; 以及在反应物和电路板上形成的电介质层，从而在反应物的金属离子端和电路层之间形成金属键，并在反应物的聚合物端和电介质层之间形成化学键。 由于电介质层和电路板之间的接合增强，电路板结构的电气性能得到改善，满足了对精细电路的需求。

    Method for fabricating circuit board with conductive structure
    7.
    发明授权
    Method for fabricating circuit board with conductive structure 有权
    制造导电结构电路板的方法

    公开(公告)号：US07350298B2

    公开(公告)日：2008-04-01

    申请号：US11467629

    申请日：2006-08-28

    申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen Hung Hu ,  Chao Wen Shih

    发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen Hung Hu ,  Chao Wen Shih

    IPC分类号： H01K3/10 ,  H05K3/02 ,  H05K3/34

    CPC分类号： H05K3/3484 ,  H05K1/112 ,  H05K3/1216 ,  H05K3/243 ,  H05K3/3473 ,  H05K2201/0391 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/054 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second surfaces of a circuit board; forming a conductive layer on the first insulating protective layer and the openings; forming first and second resist layers on the conductive layer and the second insulating protective layer respectively; forming first electrically connecting structures by electroplating on the exposed conductive layer over a plurality of first and second electrically connecting pads in openings of the first resist layer; removing the first and the second resist layers and the conductive layer covered by the first resist layer; and forming second electrically connecting structures by stencil printing on the conductive layer over the second electrically connecting pads on the first surface and on a plurality of third electrically connecting pads of the second surface of the circuit board.

    摘要翻译： 公开了一种制造具有导电结构的电路板的方法。 该方法包括：分别在电路板的第一和第二表面上形成第一和第二绝缘保护层; 在所述第一绝缘保护层和所述开口上形成导电层; 分别在导电层和第二绝缘保护层上形成第一和第二抗蚀剂层; 通过在所述第一抗蚀剂层的开口中的多个第一和第二电连接焊盘上的暴露的导电层上电镀来形成第一电连接结构; 去除由第一抗蚀剂层覆盖的第一和第二抗蚀剂层和导电层; 以及通过在第一表面上的第二电连接焊盘和电路板的第二表面的多个第三电连接焊盘上的导电层上的模版印刷形成第二电连接结构。

    Method for fabricating electrical connection structure of circuit board
    10.
    发明申请
    Method for fabricating electrical connection structure of circuit board 有权
    电路板电连接结构的制造方法

    公开(公告)号：US20060079081A1

    公开(公告)日：2006-04-13

    申请号：US11250110

    申请日：2005-10-12

    申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

    发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

    IPC分类号： H01L21/4763

    CPC分类号： H05K3/243 ,  H05K3/108 ,  H05K3/3473 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0574 ,  H05K2203/0723

    摘要： A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.

    摘要翻译： 提出了一种用于制造电路板的电连接结构的方法。 在具有多个导电焊盘的电路板上形成图案化的抗蚀剂层，并且在抗蚀剂层中形成多个开口以露出导电焊盘。 第一导电材料和第二导电材料依次沉积在抗蚀剂层的开口和每个导电焊盘上。 然后，除去抗蚀剂层。 随后，将保护层施加在电路板上并覆盖形成在每个导电焊盘上的第一和第二导电材料。 最后，保护层被稀薄以将与其相对应的第二导电材料暴露于每个导电焊盘。 因此，电路板可以经由第二导电材料电连接到外部装置。