-
公开(公告)号：US09312435B2
公开(公告)日：2016-04-12
申请号：US13995801
申请日：2011-12-01
CPC分类号： H01L33/08 , H01L25/0753 , H01L27/3211 , H01L33/50 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor device includes a first light source that emits green, white or white-green light and includes a semiconductor chip that emits in the blue spectral range, and a first conversion element attached directly to the semiconductor chip, a second light source that emits red light, having a semiconductor chip, that emits in a blue spectral range, and having a second conversion element attached directly to the semiconductor chip, and/or having a semiconductor chip that emits in a red spectral range, a third light source that emits blue light and has a semiconductor chip emitting in the blue spectral range, and a filler body having a matrix material into which a conversion agent is embedded, wherein the filler body is disposed downstream of the light sources collectively.
摘要翻译： 光电子半导体器件包括发射绿色，白色或白绿色光的第一光源，并且包括在蓝色光谱范围内发射的半导体芯片，以及直接附着到半导体芯片的第一转换元件，第二光源，其发射 具有半导体芯片的红色光，其以蓝色光谱范围发射，并且具有直接附接到半导体芯片的第二转换元件和/或具有以红色光谱范围发射的半导体芯片;发射的第三光源， 蓝色光，并且具有在蓝色光谱范围内发射的半导体芯片，以及填充体，其具有嵌入有转化剂的基质材料，其中填充体集中设置在光源的下游。
-
公开(公告)号：US20130320369A1
公开(公告)日：2013-12-05
申请号：US13995801
申请日：2011-12-01
CPC分类号： H01L33/08 , H01L25/0753 , H01L27/3211 , H01L33/50 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor device includes a first light source that emits green, white or white-green light and includes a semiconductor chip that emits in the blue spectral range, and a first conversion element attached directly to the semiconductor chip, a second light source that emits red light, having a semiconductor chip, that emits in a blue spectral range, and having a second conversion element attached directly to the semiconductor chip, and/or having a semiconductor chip that emits in a red spectral range, a third light source that emits blue light and has a semiconductor chip emitting in the blue spectral range, and a filler body having a matrix material into which a conversion agent is embedded, wherein the filler body is disposed downstream of the light sources collectively.
摘要翻译： 光电子半导体器件包括发射绿色，白色或白绿色光的第一光源，并且包括在蓝色光谱范围内发射的半导体芯片，以及直接附着到半导体芯片的第一转换元件，第二光源，其发射 具有半导体芯片的红色光，其以蓝色光谱范围发射，并且具有直接附接到半导体芯片的第二转换元件和/或具有以红色光谱范围发射的半导体芯片;发射的第三光源， 蓝色光，并且具有在蓝色光谱范围内发射的半导体芯片，以及填充体，其具有嵌入有转化剂的基质材料，其中填充体集中设置在光源的下游。
-
3.发明申请Leadframe for Optoelectronic Components and Method for Producing Optoelectronic Components 有权光电元件的引线框架和光电子元件的制造方法公开(公告)号：US20130309788A1
公开(公告)日：2013-11-21
申请号：US13885912
申请日：2012-01-31
申请人： Martin Brandl , Tobias Gebuhr , Markus Pindl , Albert Schneider
发明人： Martin Brandl , Tobias Gebuhr , Markus Pindl , Albert Schneider
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L21/561 , H01L23/49541 , H01L23/49548 , H01L24/29 , H01L24/83 , H01L24/97 , H01L33/0095 , H01L2224/29191 , H01L2224/32245 , H01L2224/83192 , H01L2924/00013 , H01L2924/12041 , H01L2924/12042 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.
摘要翻译： 指定了用于生产多个光电子部件的引线框架。 至少一个安装区域包括用于多个半导体芯片的多个芯片安装区域。 在引线框架的至少一个主要区域上的安装区域之外，形成用于减小引线框架中的机械应力的一个或多个凹槽。 凹槽不完全穿透引线框架。 进一步规定了在这种类型的引线框上产生多个光电子部件的方法。
-
4.发明申请公开(公告)号：US20130092966A1
公开(公告)日：2013-04-18
申请号：US13636678
申请日：2011-05-04
CPC分类号： H01L33/60 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.
摘要翻译： 光电子部件包括壳体。 至少一个半导体芯片布置在壳体中。 半导体芯片包括适于产生或检测电磁辐射的有源层。 铸造化合物至少部分地围绕半导体芯片。 反射性颗粒嵌入铸塑料中。
-
5.发明申请公开(公告)号：US20100193815A1
公开(公告)日：2010-08-05
申请号：US12595887
申请日：2008-04-14
CPC分类号： B29C45/14655 , B29C33/0038 , B29C33/10 , B29C43/18 , B29C2045/14098 , B29C2045/14663 , B29C2045/14934 , B29K2083/00 , H01L21/565 , H01L24/97 , H01L33/52 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.
摘要翻译： 公开了用于制造光电子部件的方法。 基板具有与第一主面相对的第一主面和第二主面。 能够从前侧发射电磁辐射的半导体本体被安装在基板的第一主面上。 至少对半导体本体的前侧施加对来自光电半导体本体的辐射透明的覆盖物。 通过使用与光学元件的轮廓成形的封闭空腔，将覆盖物赋予光学元件的形式。
-
公开(公告)号：US07612010B2
公开(公告)日：2009-11-03
申请号：US11901660
申请日：2007-09-18
申请人： Gunther Schlingloff , Torsten Wieprecht , Uwe Heinz , Albert Schneider , Marie-Josée Dubs , Frank Bachmann , Menno Hazenkamp , Thomas Ehlis , Cornelia Vincenzi , Josef Dannacher
发明人： Gunther Schlingloff , Torsten Wieprecht , Uwe Heinz , Albert Schneider , Marie-Josée Dubs , Frank Bachmann , Menno Hazenkamp , Thomas Ehlis , Cornelia Vincenzi , Josef Dannacher
CPC分类号： C07D401/14 , C11D3/168 , C11D3/3932
摘要： Use of metal complex compounds of formula (1) and/or (1′) [LnMemXp]zYq (1), [L′nMemXp]zYq (1′), wherein all substituents are as defined in the claims, as catalysts for oxidation reactions, and also novel metal complex compounds and novel ligands.
摘要翻译： 使用式（1）和/或（1'）[LnMemXp] zYq（1），[L'nMemXp] zYq（1'）的金属配合物化合物，其中所有取代基如权利要求中所定义，作为氧化催化剂 反应，还有新型金属络合物和新配体。
-
公开(公告)号：USD445063S1
公开(公告)日：2001-07-17
申请号：US29123817
申请日：2000-05-25
-
8.发明授权公开(公告)号：US08692275B2
公开(公告)日：2014-04-08
申请号：US13636678
申请日：2011-05-04
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.
摘要翻译： 光电子部件包括壳体。 至少一个半导体芯片布置在壳体中。 半导体芯片包括适于产生或检测电磁辐射的有源层。 铸造化合物至少部分地围绕半导体芯片。 反射性颗粒嵌入铸塑料中。
-
9.发明授权公开(公告)号：US08435806B2
公开(公告)日：2013-05-07
申请号：US12595887
申请日：2008-04-14
IPC分类号： H01L21/00
CPC分类号： B29C45/14655 , B29C33/0038 , B29C33/10 , B29C43/18 , B29C2045/14098 , B29C2045/14663 , B29C2045/14934 , B29K2083/00 , H01L21/565 , H01L24/97 , H01L33/52 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.
摘要翻译： 公开了用于制造光电子部件的方法。 基板具有与第一主面相对的第一主面和第二主面。 能够从前侧发射电磁辐射的半导体本体被安装在基板的第一主面上。 至少对半导体本体的前侧施加对来自光电半导体本体的辐射透明的覆盖物。 通过使用与光学元件的轮廓成形的封闭空腔，将覆盖物赋予光学元件的形式。
-
公开(公告)号：US20080081908A1
公开(公告)日：2008-04-03
申请号：US11901660
申请日：2007-09-18
申请人： Gunther Schlingloff , Torsten Wieprecht , Uwe Heinz , Albert Schneider , Marie-Josee Dubs , Frank Bachmann , Menno Hazenkamp , Thomas Ehlis , Cornelia Vincenzi , Josef Dannacher
发明人： Gunther Schlingloff , Torsten Wieprecht , Uwe Heinz , Albert Schneider , Marie-Josee Dubs , Frank Bachmann , Menno Hazenkamp , Thomas Ehlis , Cornelia Vincenzi , Josef Dannacher
IPC分类号： C07D403/14
CPC分类号： C07D401/14 , C11D3/168 , C11D3/3932
摘要： Use of metal complex compounds of formula (1) and/or (1′) [LnMemXp]zYq (1), [L′nMemXp]zYq (1′), wherein all substituents are as defined in the claims, as catalysts for oxidation reactions, and also novel metal complex compounds and novel ligands.
摘要翻译： 使用式（1）和/或（1'）的金属络合物化合物<？in-line-formula description =“In-line Formulas”end =“lead”？> [L> n （1），＆lt;＆lt;行内公式描述=“In” -line公式“end =”tail“？> <？in-line-formula description =”In-line Formulas“end =”lead“？> [L' （1'），<？in-line-formula description =“在线公式” 其中所有取代基如权利要求中所定义，作为用于氧化反应的催化剂，以及新型金属络合物和新型配体。
-
-
-
-
-
-
-
-
-
搜索结果
35 条记录 (耗时 0.024 秒)
