BEOL compatible FET structure
    1.
    发明授权
    BEOL compatible FET structure 有权
    BEOL兼容FET结构

    公开(公告)号:US08441042B2

    公开(公告)日:2013-05-14

    申请号:US12561827

    申请日:2009-09-17

    IPC分类号: H01L21/76

    摘要: This invention provides structures and a fabrication process for incorporating thin film transistors in back end of the line (BEOL) interconnect structures. The structures and fabrication processes described are compatible with processing requirements for the BEOL interconnect structures. The structures and fabrication processes utilize existing processing steps and materials already incorporated in interconnect wiring levels in order to reduce added cost associated with incorporating thin film transistors in the these levels. The structures enable vertical (3D) integration of multiple levels with improved manufacturability and reliability as compared to prior art methods of 3D integration.

    摘要翻译: 本发明提供了用于在线路后端(BEOL)互连结构中并入薄膜晶体管的结构和制造工艺。 所描述的结构和制造工艺与BEOL互连结构的处理要求相兼容。 结构和制造工艺利用已经并入到互连布线层中的现有处理步骤和材料,以便降低与在这些层级中引入薄膜晶体管相关联的附加成本。 与现有技术的3D集成方法相比,该结构能够实现多层次的垂直(3D)集成,具有改进的可制造性和可靠性。

    BEOL compatible FET structrure
    3.
    发明授权
    BEOL compatible FET structrure 有权
    BEOL兼容FET结构

    公开(公告)号:US08569803B2

    公开(公告)日:2013-10-29

    申请号:US13572742

    申请日:2012-08-13

    IPC分类号: H01L29/76

    摘要: This invention provides structures and a fabrication process for incorporating thin film transistors in back end of the line (BEOL) interconnect structures. The structures and fabrication processes described are compatible with processing requirements for the BEOL interconnect structures. The structures and fabrication processes utilize existing processing steps and materials already incorporated in interconnect wiring levels in order to reduce added cost associated with incorporating thin film transistors in the these levels. The structures enable vertical (3D) integration of multiple levels with improved manufacturability and reliability as compared to prior art methods of 3D integration.

    摘要翻译: 本发明提供了用于在线路后端(BEOL)互连结构中并入薄膜晶体管的结构和制造工艺。 所描述的结构和制造工艺与BEOL互连结构的处理要求相兼容。 结构和制造工艺利用已经并入到互连布线层中的现有处理步骤和材料,以便降低与在这些层级中引入薄膜晶体管相关联的附加成本。 与现有技术的3D集成方法相比,该结构能够实现多层次的垂直(3D)集成,具有改进的可制造性和可靠性。

    Inactivity triggered self clocking logic family
    9.
    发明授权
    Inactivity triggered self clocking logic family 有权
    不活动触发自我计时逻辑家族

    公开(公告)号:US08575964B2

    公开(公告)日:2013-11-05

    申请号:US13426776

    申请日:2012-03-22

    IPC分类号: H03K19/00

    CPC分类号: H03K19/0966 H03K19/0013

    摘要: Localized logic regions of a circuit include a local comparator electrically connected to a local resistive voltage circuit, to a local resistive ground circuit, and to a local register structure. The local comparator supplies a clock pulse to the local register structures when the local reference voltage is below a local voltage threshold. Activity in the local combinatorial logic structure causes the local reference voltage to drop below the local reference voltage independently of changes in the global reference voltage causing the comparator to output the clock pulse (with sufficient delay to allow the logic results to be stored in the registers only after setup times have been met in the local logic devices). This eliminates the need for a clock distribution tree, thereby saving power when there is no activity in the local combinatorial logic structure.

    摘要翻译: 电路的局部逻辑区域包括电连接到局部电阻电压电路的本地比较器,局部电阻接地电路和局部寄存器结构。 当本地参考电压低于本地电压阈值时,本地比较器会向本地寄存器结构提供时钟脉冲。 本地组合逻辑结构中的活动导致本地参考电压低于局部参考电压,而与全局参考电压的变化无关,导致比较器输出时钟脉冲(具有足够的延迟以允许逻辑结果存储在寄存器中 只有在本地逻辑设备中已经满足设置时间之后)。 这消除了对时钟分配树的需要,从而在局部组合逻辑结构中没有活动时节省功率。