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    Complementary depletion switch body stack off-chip driver
    3.
    发明授权
    Complementary depletion switch body stack off-chip driver 失效
    互补耗尽开关体堆栈片外驱动

    公开(公告)号：US06177818B1

    公开(公告)日：2001-01-23

    申请号：US09303508

    申请日：1999-04-30

    申请人： Claude L. Bertin ,  Anthony R. Bonaccio ,  Howard L. Kalter ,  Thomas M. Maffitt ,  Jack A. Mandelman ,  William R. Tonti

    发明人： Claude L. Bertin ,  Anthony R. Bonaccio ,  Howard L. Kalter ,  Thomas M. Maffitt ,  Jack A. Mandelman ,  William R. Tonti

    IPC分类号： H03B2100

    CPC分类号： H03K19/09482 ,  H03K19/00361 ,  H03K19/018521

    摘要： An off-chip driver circuit including an enhancement PFET, a depletion PFET, a depletion NFET and an enhancement NFET connected in series. The large enhancement PFET and large enhancement NFET turn off the OCD in tri-state and to turn off the unused half of the OCD to prevent overlap current when driving a ‘0’ or a ‘1’. A first gate signal is applied to the gate of the enhancement PFET and a second gate signal is applied to the enhancement NFET. A fixed voltage is connected to the gate of the depletion NFET and ground to gate of the depletion PFET. An output signal is obtained from a node between the depletion PFET and depletion NFET devices. In another embodiment, a reflection/overshoot sensor 60 is added. The output of sensor is connected to the body of a depletion PFET and an NFET. The feedback from sensor is such that the threshold voltage of the depletion devices are made more positive if the sensor detects that the output is being over-driven. A more positive threshold voltage will reduce the driver's IDS, but leaves the device in the linear mode.

    摘要翻译： 包括增强型PFET，耗尽型PFET，耗尽型NFET和增强型NFET的片外驱动电路。 大增强型PFET和大增强型NFET在三态关闭OCD并关闭OCD的未使用的一半以防止在驱动“0”或“1”时重叠电流。 第一栅极信号被施加到增强PFET的栅极，并且第二栅极信号被施加到增强NFET。 固定电压连接到耗尽型NFET的栅极，并连接到耗尽PFET的栅极。 从耗尽PFET和耗尽NFET器件之间的节点获得输出信号。 在另一个实施例中，添加了反射/过冲传感器60。 传感器的输出连接到耗尽PFET和NFET的主体。 来自传感器的反馈使得如果传感器检测到输出被过驱动，则耗尽装置的阈值电压变得更为正。 更正的阈值电压将减少驾驶员的IDS，但使设备处于线性模式。

    Redundant input/output driver circuit
    4.
    发明授权
    Redundant input/output driver circuit 失效
    冗余输入/输出驱动电路

    公开(公告)号：US06177809B1

    公开(公告)日：2001-01-23

    申请号：US09322470

    申请日：1999-05-28

    申请人： William R. Tonti ,  Jack A. Mandelman ,  Anthony R. Bonaccio ,  Claude L. Bertin ,  Howard L. Kalter ,  John A. Fifield

    发明人： William R. Tonti ,  Jack A. Mandelman ,  Anthony R. Bonaccio ,  Claude L. Bertin ,  Howard L. Kalter ,  John A. Fifield

    IPC分类号： H03K19094

    CPC分类号： H03K19/00384 ,  H03K19/0005

    摘要： A first, “known good” reference off-chip driver circuit actuated by an initial logic program (IPL) input signal has an output lead connected as one of the inputs to a comparator circuit for providing a reference off-chip driver output signal. A second off-chip driver circuit including a plurality of “n” separate driver circuit paths connected to input signal and produces output signals connected to a common node to provide output driver signals to the common node. The common node is connected to the second input of the comparator circuit for comparison with the reference off-chip driver output signal from the first off-chip driver circuit to determine the operating state of the second off-chip driver circuit with respect to the operating state of the first off-chip driver circuit.

    摘要翻译： 由初始逻辑程序（IPL）输入信号驱动的第一个“已知的良好”参考芯片外驱动电路具有作为输入端之一的输出引线连接到比较器电路，用于提供参考片外驱动器输出信号。 包括连接到输入信号的多个“n”个分离的驱动器电路路径并产生连接到公共节点的输出信号以向公共节点提供输出驱动器信号的第二片外驱动器电路。 公共节点连接到比较器电路的第二输入，用于与来自第一片外驱动器电路的参考芯片外驱动器输出信号进行比较，以确定第二片外驱动器电路相对于操作的运行状态 状态的第一个片外驱动电路。

    Structures for wafer level test and burn-in
    5.
    发明授权
    Structures for wafer level test and burn-in 失效
    晶圆级测试和老化的结构

    公开(公告)号：US06426904B2

    公开(公告)日：2002-07-30

    申请号：US09803500

    申请日：2001-03-09

    申请人： John E. Barth ,  Claude L. Bertin ,  Jeffrey H. Dreibelbis ,  Wayne F. Ellis ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  William R. Tonti ,  Donald L. Wheater

    发明人： John E. Barth ,  Claude L. Bertin ,  Jeffrey H. Dreibelbis ,  Wayne F. Ellis ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  William R. Tonti ,  Donald L. Wheater

    IPC分类号： G11C2900

    CPC分类号： G01R31/2855 ,  G01R31/2806 ,  G01R31/2831 ,  G01R31/31905 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00014

    摘要： Wafer test and burn-in is accomplished with state machine or programmable test engines located on the wafer being tested. Each test engine requires less than 10 connections and each test engine can be connected to a plurality of chips, such as a row or a column of chips on the wafer. Thus, the number of pads of the wafer that must be connected for test is substantially reduced while a large degree of parallel testing is still provided. The test engines also permit on-wafer allocation of redundancy in parallel so that failing chips can be repaired after burn-in is complete. In addition, the programmable test engines can have their code altered so test programs can be modified to account for new information after the wafer has been fabricated. The test engines are used during burn-in to provide high frequency write signals to DRAM arrays that provide a higher effective voltage to the arrays, lowering the time required for burn-in. Connections to the wafer and between test engines and chips are provided along a membrane attached to the wafer. Membrane connectors can be formed or opened after the membrane is connected to the wafer so shorted chips can be disconnected. Preferably the membrane remains on the wafer after test, burn-in and dicing to provide a chip scale package. Thus, the very high cost of TCE matched materials, such as glass ceramic contactors, for wafer burn-in is avoided while providing benefit beyond test and burn-in for packaging.

    摘要翻译： 晶圆测试和老化是通过位于被测晶片上的状态机或可编程测试引擎完成的。 每个测试引擎需要少于10个连接，并且每个测试引擎可以连接到多个芯片，例如晶片上的行或一列芯片。 因此，仍然提供必须连接用于测试的晶片的焊盘数量，同时还提供大量的并行测试。 测试引擎还允许并行的片上分配冗余，以便在老化完成后可以修复故障的芯片。 此外，可编程测试引擎可以对其代码进行更改，因此可以修改测试程序以在晶圆制造之后考虑新的信息。 在老化期间使用测试引擎向DRAM阵列提供高频写入信号，为阵列提供更高的有效电压，从而降低了老化所需的时间。 沿着连接到晶片的膜提供与晶片和测试引擎与芯片之间的连接。 膜连接器可以在膜连接到晶片之后形成或打开，因此短路芯片可以断开。 优选地，膜在测试之后保留在晶片上，老化和切割以提供芯片级封装。 因此，避免了TCE匹配材料（例如玻璃陶瓷接触器）用于晶片老化的非常高的成本，同时提供超出测试和包装封装的优点。

    Structures for wafer level test and burn-in
    6.
    发明授权
    Structures for wafer level test and burn-in 失效
    晶圆级测试和老化的结构

    公开(公告)号：US06233184B1

    公开(公告)日：2001-05-15

    申请号：US09191954

    申请日：1998-11-13

    申请人： John E. Barth ,  Claude L. Bertin ,  Jeffrey H. Dreibelbis ,  Wayne F. Ellis ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  William R. Tonti ,  Donald L. Wheater

    发明人： John E. Barth ,  Claude L. Bertin ,  Jeffrey H. Dreibelbis ,  Wayne F. Ellis ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  William R. Tonti ,  Donald L. Wheater

    IPC分类号： G11C2900

    CPC分类号： G01R31/2855 ,  G01R31/2806 ,  G01R31/2831 ,  G01R31/31905 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00014

    摘要： Wafer test and burn-in is accomplished with state machine or programmable test engines located on the wafer being tested. Each test engine requires less than 10 connections and each test engine can be connected to a plurality of chips, such as a row or a column of chips on the wafer. Thus, the number of pads of the wafer that must be connected for test is substantially reduced while a large degree of parallel testing is still provided. The test engines also permit on-wafer allocation of redundancy in parallel so that failing chips can be repaired after burn-in is complete. In addition, the programmable test engines can have their code altered so test programs can be modified to account for new information after the wafer has been fabricated. The test engines are used during burn-in to provide high frequency write signals to DRAM arrays that provide a higher effective voltage to the arrays, lowering the time required for burn-in. Connections to the wafer and between test engines and chips are provided along a membrane attached to the wafer. Membrane connectors can be formed or opened after the membrane is connected to the wafer so shorted chips can be disconnected. Preferably the membrane remains on the wafer after test, burn-in and dicing to provide a chip scale package. Thus, the very high cost of TCE matched materials, such as glass ceramic contactors, for wafer burn-in is avoided while providing benefit beyond test and burn-in for packaging.

    摘要翻译： 晶圆测试和老化是通过位于被测晶片上的状态机或可编程测试引擎完成的。 每个测试引擎需要少于10个连接，并且每个测试引擎可以连接到多个芯片，例如晶片上的行或一列芯片。 因此，仍然提供必须连接用于测试的晶片的焊盘数量，同时还提供大量的并行测试。 测试引擎还允许并行的片上分配冗余，以便在老化完成后可以修复故障的芯片。 此外，可编程测试引擎可以对其代码进行更改，因此可以修改测试程序以在晶圆制造之后考虑新的信息。 在老化期间使用测试引擎向DRAM阵列提供高频写入信号，为阵列提供更高的有效电压，从而降低老化所需的时间。 沿着连接到晶片的膜提供与晶片和测试引擎与芯片之间的连接。 膜连接器可以在膜连接到晶片之后形成或打开，因此短路芯片可以断开。 优选地，膜在测试之后保留在晶片上，老化和切割以提供芯片级封装。 因此，避免了TCE匹配材料（例如玻璃陶瓷接触器）用于晶片老化的非常高的成本，同时提供超出测试和包装封装的优点。

    Integrated memory cube, structure and fabrication
    7.
    发明授权
    Integrated memory cube, structure and fabrication 失效
    集成存储立方体，结构和制造

    公开(公告)号：US5563086A

    公开(公告)日：1996-10-08

    申请号：US406284

    申请日：1995-03-17

    申请人： Claude L. Bertin ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  Gordon A. Kelley, Jr.

    发明人： Claude L. Bertin ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  Gordon A. Kelley, Jr.

    IPC分类号： G11C5/00 ,  H01L25/065 ,  H01L21/70

    CPC分类号： H01L25/0657 ,  G11C5/06 ,  H01L2224/48091 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/10253

    摘要： An integrated memory cube structure and method of fabrication wherein stacked semiconductor memory chips are integrated by a controlling logic chip such that a more powerful memory architecture is defined with the functional appearance of a single, higher level memory chip. A memory/logic cube is formed having N memory chips and at least one logic chip, with each memory chip of the cube having M memory devices. The controlling logic chip coordinates external communication with the N memory chips such that a single memory chip architecture with N.times.M memory devices appears at the cube's I/O pins. A corresponding fabrication technique includes an approach for facilitating metallization patterning on the side surface of the memory subunit.

    摘要翻译： 一种集成的存储立方体结构和制造方法，其中堆叠的半导体存储器芯片由控制逻辑芯片集成，使得更强大的存储器架构被定义为单个更高级存储器芯片的功能外观。 形成具有N个存储器芯片和至少一个逻辑芯片的存储器/逻辑立方体，其中立方体的每个存储器芯片具有M个存储器件。 控制逻辑芯片协调与N个存储器芯片的外部通信，使得具有NxM存储器件的单个存储器芯片架构出现在立方体的I / O引脚处。 相应的制造技术包括用于在存储器子单元的侧表面上促进金属化图案化的方法。

    Integrated memory cube structure
    8.
    发明授权
    Integrated memory cube structure 失效
    集成内存立方体结构

    公开(公告)号：US5561622A

    公开(公告)日：1996-10-01

    申请号：US120993

    申请日：1993-09-13

    申请人： Claude L. Bertin ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  Gordon A. Kelley, Jr.

    发明人： Claude L. Bertin ,  Wayne J. Howell ,  Erik L. Hedberg ,  Howard L. Kalter ,  Gordon A. Kelley, Jr.

    IPC分类号： G11C5/00 ,  H01L25/065 ,  G11C5/06 ,  H01L23/02

    CPC分类号： H01L25/0657 ,  G11C5/06 ,  H01L2224/48091 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/10253

    摘要： An integrated memory cube structure and method of fabrication wherein stacked semiconductor memory chips are integrated by a controlling logic chip such that a more powerful memory architecture is defined with the functional appearance of a single, higher level memory chip. A memory/logic cube is formed having N memory chips and at least one logic chip, with each memory chip of the cube having M memory devices. The controlling logic chip coordinates external communication with the N memory chips such that a single memory chip architecture with N.times.M memory devices appears at the cube's I/O pins. A corresponding fabrication technique includes an approach for facilitating metallization patterning on the side surface of the memory subunit.

    摘要翻译： 一种集成的存储立方体结构和制造方法，其中堆叠的半导体存储器芯片由控制逻辑芯片集成，使得更强大的存储器架构被定义为单个更高级存储器芯片的功能外观。 形成具有N个存储器芯片和至少一个逻辑芯片的存储器/逻辑立方体，其中立方体的每个存储器芯片具有M个存储器件。 控制逻辑芯片协调与N个存储器芯片的外部通信，使得具有NxM存储器件的单个存储器芯片架构出现在立方体的I / O引脚处。 相应的制造技术包括用于在存储器子单元的侧表面上促进金属化图案化的方法。

    High performance, low power vertical integrated CMOS devices
    9.
    发明授权
    High performance, low power vertical integrated CMOS devices 失效

    公开(公告)号：US06518112B2

    公开(公告)日：2003-02-11

    申请号：US09899262

    申请日：2001-07-06

    申请人： Michael D. Armacost ,  Claude L. Bertin ,  Erik L. Hedberg ,  Jack A. Mandelman

    发明人： Michael D. Armacost ,  Claude L. Bertin ,  Erik L. Hedberg ,  Jack A. Mandelman

    IPC分类号： H01L31119

    CPC分类号： H01L27/11 ,  H01L21/823885 ,  H01L21/84 ,  H01L27/1104 ,  H01L27/1203 ,  Y10S257/903

    摘要： A vertical Field Effect Transistor (FET) that may be an N-type FET (NFET) or a P-type FET (PFET); a multi-device vertical structure that may be two or more NFETs or two or more PFETs; logic gates including at least one vertical FET or at least one multi-device vertical; a Static Random Access Memory (SRAM) cell and array including at least one vertical FET; a memory array including at least one such SRAM cell; and the process of forming the vertical FET structure, the vertical multi-device (multi-FET) structure, the logic gates and the SRAM cell. The vertical FETs are epitaxially grown layered stacks of NPN or PNP with the side of a polysilicon gate layer adjacent the device's channel layer. The multi-FET structure may be formed by forming sides of two or more gates adjacent to the same channel layer or, by forming multiple channel layers in the same stack, e.g., PNPNP or NPNPN, each with its own gate, i.e., the side of a polysilicon gate layer. The SRAM cell may be radiation hardened by selectively thickening gate layers to increase storage node capacitance, providing high resistance cell wiring or by including a multi-layered gate oxide layer of NO or ONO, or by any combination thereof.

    High performance direct coupled FET memory cell
    10.
    发明授权
    High performance direct coupled FET memory cell 失效
    高性能直接耦合FET存储单元

    公开(公告)号：US6137129A

    公开(公告)日：2000-10-24

    申请号：US2825

    申请日：1998-01-05

    申请人： Claude L. Bertin ,  John E. Cronin ,  Erik L. Hedberg ,  Jack A. Mandelman

    发明人： Claude L. Bertin ,  John E. Cronin ,  Erik L. Hedberg ,  Jack A. Mandelman

    IPC分类号： H01L21/8244 ,  H01L27/11 ,  H01L27/108 ,  H01L29/74 ,  H01L29/76

    CPC分类号： H01L27/11 ,  Y10S257/903

    摘要： A pair of directly coupled Field Effect transistors (FETs), a latch of directly coupled FETS, a Static Random Access Memory (SRAM) cell including a latch of directly coupled FETs and the process of forming the directly coupled FET structure, latch and SRAM cell. The vertical FETs, which may be both PFETs, NFETs or one of each, are epi-grown NPN or PNP stacks separated by a gate oxide, SiO.sub.2. Each device's gate is the source or drain of the other device of the pair. The preferred embodiment latch includes two such pairs of directly coupled vertical FETs connected together to form cross coupled invertors. A pass gate layer is bonded to one surface of a layer of preferred embodiment latches to form an array of preferred embodiment SRAM cells. The SRAM cell may include one or two pass gates. The preferred embodiment SRAM process has three major steps. First, preferred embodiment latches are formed in an oxide layer on a silicon wafer. Second, the cell pass gates are formed on a pass gate or Input/Output (I/O) layer. Third, the I/O layer is bonded to and connected to the preferred latch layer.

    摘要翻译： 一对直接耦合的场效应晶体管（FET），直接耦合FETS的锁存器，包括直接耦合FET的锁存器的静态随机存取存储器（SRAM）单元和形成直接耦合的FET结构的过程，锁存器和SRAM单元 。 可以是PFET，NFET或者其中之一的垂直FET是由栅极氧化物SiO 2分离的外延生长的NPN或PNP堆叠。 每个设备的门是该对的另一个设备的源或漏极。 优选实施例锁存器包括两对这样的直接耦合的垂直FET对，连接在一起以形成交叉耦合的反相器。 通路栅极层结合到优选实施例锁存器的一个表面上以形成优选实施例SRAM单元的阵列。 SRAM单元可以包括一个或两个传递门。 优选实施例SRAM过程具有三个主要步骤。 首先，优选实施例的锁存器形成在硅晶片上的氧化物层中。 第二，在传输门或输入/输出（I / O）层上形成单元传输门。 第三，I / O层被粘合并连接到优选的锁存层。