摘要:
A semiconductor structure having a substrate, an insulator above a portion of the substrate, a conductor above the insulator; and at least two contact regions in the substrate on opposite sides of the portion of the substrate, wherein a voltage between the contact regions modulates a capacitance of the conductor.
摘要:
An assembly is provided that includes an interposer having first and second substantially flat, opposed surfaces, and at least one speed critical signal line extending directly through the interposer from the first surface to the second surface. A first IC is coupled to the first surface of the interposer and has a first external connection mechanism coupled to the at least one speed critical signal line. A second IC is coupled to the second surface of the interposer and has a first external connection mechanism coupled to the at least one speed critical signal line. Preferably at least one non-speed critical signal line is provided within the interposer and is coupled to a second external connection mechanism of the first IC and/or the second IC for delivering non-speed critical signals thereto or for receiving such signals therefrom. A chip carrier having a cavity formed therein also may be provided wherein the second surface of the interposer is coupled to the chip carrier and the second IC is disposed within the cavity. One or more carrier signal lines may be provided within the chip carrier and coupled between the interposer and the second IC. The first and/or the second IC also may comprise control logic adapted to select a number of drivers within either IC that drive a particular signal line.
摘要:
An off-chip driver circuit including an enhancement PFET, a depletion PFET, a depletion NFET and an enhancement NFET connected in series. The large enhancement PFET and large enhancement NFET turn off the OCD in tri-state and to turn off the unused half of the OCD to prevent overlap current when driving a ‘0’ or a ‘1’. A first gate signal is applied to the gate of the enhancement PFET and a second gate signal is applied to the enhancement NFET. A fixed voltage is connected to the gate of the depletion NFET and ground to gate of the depletion PFET. An output signal is obtained from a node between the depletion PFET and depletion NFET devices. In another embodiment, a reflection/overshoot sensor 60 is added. The output of sensor is connected to the body of a depletion PFET and an NFET. The feedback from sensor is such that the threshold voltage of the depletion devices are made more positive if the sensor detects that the output is being over-driven. A more positive threshold voltage will reduce the driver's IDS, but leaves the device in the linear mode.
摘要:
Use of different materials for different conductive films forming plates or electrodes of one or more capacitors formed in a trench in a body of semiconductor materials allow connections to be made selectively to the plates. The films may be undercut by different etchants at respective connection apertures to avoid formation of connections or connections made by doped polysilicon of different conductivities forming connections to some plates of similarly doped polysilicon and blocking diode junctions with oppositely doped polysilicon. The blocking diodes may include a compensation implant to adjust reverse breakdown characteristics and provide transient and electrostatic discharge protection.
摘要:
An automatic driver adjuster and methods using the same are provided that modify off-chip drivers based on load characteristics. The preferred embodiments are preferably automatic and require little or no human intervention. Preferred embodiments of the current invention analyze and determine the impedance of a node and adjust a number of output drivers in response to the impedance of the node, or analyze a resultant waveform of the node, caused by an input waveform, and adjust a number of output drivers in response to the resultant waveform of the node.
摘要:
A DC analog circuit which monitors a DRAM sample cell access device and outputs a DC reference voltage to the word line voltage regulation system. The resulting output voltage Vpp from the word line voltage regulation system will then vary in accordance with the cell access device parametrics so as to guarantee a full high level will always be written into the DRAM cell.
摘要:
One embodiment is a non-volatile memory cell with random access read, program, and erase. The memory cell includes a cell transistor that includes a source region, a drain region, a first insulating spacer, and a second insulating spacer. The memory cell also includes a source-side transistor, a drain-side transistor, a source-side multiplexer, a drain-side multiplexer, a source-side sense amplifier, and a drain-side write driver. A first binary value is stored in a first bit in the memory cell by trapping or releasing a first electric charge in the first insulating spacer. The first bit is read by sensing the resistive change in the cell transistor or by sensing the threshold voltage change in the cell transistor.
摘要:
An apparatus for sensing the data state of a multiple level, programmable resistive memory device includes an active clamping device connected to a data leg that is selectively coupled a programmable resistive memory element, the clamping device configured to clamp a fixed voltage, at a first node of the data leg, across the memory element, thereby establishing a fixed current sinking capability thereof; and a plurality of differential amplifiers, each of the differential amplifiers configured to compare a first voltage input, taken at a second node of the data leg, with a second voltage input; wherein the second voltage input for each differential amplifier comprises different reference voltages with respect to one another so as to enable each differential amplifier to detect a different resistance threshold, thereby determining a specific resistance state of the programmable resistive memory element.
摘要:
Disclosed is an across-chip temperature sensing circuit and an associated method that can be used to profile the across-chip temperature gradient. The embodiments incorporate a plurality of phase change elements distributed approximately evenly across the semiconductor chip. These phase change elements are programmed to have essentially the same amorphous resistance. Temperature-dependent behavior exhibited by each of the phase change elements individually is compared to a reference (e.g., generated by a discrete reference phase change element, generated by another one of the phase change elements, or generated by an external reference) in order to profile the temperature gradient across the semiconductor chip. Once profiled, this temperature gradient can be used to redesign and/or relocate functional cores, to set stress limits for qualification of functional cores and/or to adjust operating specifications of functional cores.
摘要:
A precision sense amplifier apparatus includes a current source configured to introduce an adjustable reference current through a reference leg; a current mirror configured to mirror the reference current to a data leg, the data leg selectively coupled to a programmable resistance memory element; an active clamping device coupled to the data leg, and configured to clamp a fixed voltage across the memory element, thereby establishing a fixed current sinking capability thereof; and a differential sense amplifier having a first input thereof coupled to the data leg and a second input thereof coupled to the reference leg; wherein an output of the differential sense amplifier assumes a first logic state whenever the reference current is less than the fixed current sinking capability of the memory element, and assumes a second logic state whenever the reference current exceeds the fixed current sinking capability.