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    Multiple wireless sensors for dialysis application
    2.
    发明授权
    Multiple wireless sensors for dialysis application 有权
    多个无线传感器用于透析应用

    公开(公告)号：US07219021B2

    公开(公告)日：2007-05-15

    申请号：US11317706

    申请日：2005-12-24

    申请人： James Z T Liu ,  Gautham Ramamurthy ,  Alistair D. Bradley ,  James D. Cook ,  Stephen R. Shiffer

    发明人： James Z T Liu ,  Gautham Ramamurthy ,  Alistair D. Bradley ,  James D. Cook ,  Stephen R. Shiffer

    IPC分类号： G01F17/00

    CPC分类号： A61M1/3639 ,  A61M1/14 ,  A61M2205/3569 ,  A61M2205/3592

    摘要： A sensor system for dialysis applications includes a plurality of pressure sensors, wherein each pressure sensor can be provided as an LC type sensor, and/or an RLC type sensor. Each sensor among the plurality of pressure sensors can be inductively coupled with a respective antenna among a plurality of antennas for the wireless transmission of pressure data. A dialysis machine is generally connected to the plurality of antennas, wherein the plurality of pressure sensors monitors pressure during operation of the dialysis machine to generate pressure data that is wirelessly transmitted to at least one antenna among the plurality of antennas.

    摘要翻译： 用于透析应用的传感器系统包括多个压力传感器，其中每个压力传感器可以被提供为LC型传感器和/或RLC型传感器。 多个压力传感器中的每个传感器可以与多个天线中的相应天线感应耦合，用于压力数据的无线传输。 透析机通常连接到多个天线，其中多个压力传感器在透析机的操作期间监测压力，以产生无线传输到多个天线中的至少一个天线的压力数据。

    DISPOSABLE PRESSURE SENSOR SYSTEMS AND PACKAGES THEREFOR
    3.
    发明申请
    DISPOSABLE PRESSURE SENSOR SYSTEMS AND PACKAGES THEREFOR 审中-公开
    可配置的压力传感器系统及其包装

    公开(公告)号：US20110214504A1

    公开(公告)日：2011-09-08

    申请号：US13107622

    申请日：2011-05-13

    申请人： Alistair D. Bradley ,  Stephen R. Shiffer

    发明人： Alistair D. Bradley ,  Stephen R. Shiffer

    IPC分类号： G01L9/00

    CPC分类号： G01L19/0023 ,  A61M1/3639 ,  A61M1/3641 ,  A61M39/08 ,  A61M2205/0244 ,  A61M2205/3331 ,  G01L15/00 ,  G01L19/14

    摘要： A disposable pressure sensor system includes a disposable sensor assembly having at least one sensing element, carried on a housing or frame, and at least one electrical connector and/or mechanical connector for connecting the sensing element(s) to an external apparatus or device. The mechanical and/or electrical connectors are integrated in the housing or frame so that both the connector(s) and sensing element(s) are packaged in a single part. The assembly can be integrated in or attachable to a fluid carrying module, such as a dialysis cartridge, such that the sensing element(s) can sense the fluid in the module.

    摘要翻译： 一次性压力传感器系统包括具有承载在壳体或框架上的至少一个感测元件和用于将感测元件连接到外部设备或装置的至少一个电连接器和/或机械连接器的一次性传感器组件。 机械和/或电连接器集成在壳体或框架中，使得连接器和感测元件都被包装在单个部件中。 组件可以集成在流体承载模块（例如透析盒）中或可附接到流体承载模块，使得感测元件可以感测模块中的流体。

    Wireless capacitance pressure sensor
    4.
    发明授权
    Wireless capacitance pressure sensor 失效
    无线电容压力传感器

    公开(公告)号：US07181975B1

    公开(公告)日：2007-02-27

    申请号：US11226085

    申请日：2005-09-13

    申请人： Alistair D. Bradley ,  Stephen R. Shiffer

    发明人： Alistair D. Bradley ,  Stephen R. Shiffer

    IPC分类号： G01L9/12

    CPC分类号： G01L9/0072 ,  A61B5/0002 ,  A61B5/0215

    摘要： A wireless pressure sensor system has a pressure sensing capacitor and an inductor mounted on a common housing. The pressure sensing capacitor has a conductive diaphragm, a dielectric layer and a fixed electrode separated at least in part from the diaphragm by a gap formed in the housing. The electrode is arranged with a protrusion such that displacement of the diaphragm varies the area of capacitive contact with the electrode by rolling along the protrusion. The inductor coil and pressure sensing capacitor are connected to form a passive inductive-capacitive (LC) tank circuit. A remote interrogation circuit, inductively coupled to the pressure sensor inductor coil can be utilized to detect the resonant frequency of the LC tank which varies as a function of pressure sensed by the diaphragm.

    摘要翻译： 无线压力传感器系统具有压力感测电容器和安装在公共壳体上的电感器。 压力感测电容器具有导电隔膜，电介质层和固定电极，该电极至少部分地通过形成在壳体中的间隙与隔膜隔开。 电极布置有突起，使得隔膜的位移通过沿着突起滚动而改变与电极的电容性接触的面积。 电感线圈和压力感应电容器连接形成无源感性电容（LC）电路。 感应耦合到压力传感器电感线圈的远程询问电路可用于检测作为由隔膜感测的压力的函数而变化的LC箱的谐振频率。

    Sensor geometry for improved package stress isolation
    5.
    发明授权
    Sensor geometry for improved package stress isolation 有权
    传感器几何形状，用于改进封装应力隔离

    公开(公告)号：US08082798B2

    公开(公告)日：2011-12-27

    申请号：US12857380

    申请日：2010-08-16

    申请人： Gilberto Morales ,  Carl E. Stewart ,  Richard A. Davis ,  Alistair D. Bradley

    发明人： Gilberto Morales ,  Carl E. Stewart ,  Richard A. Davis ,  Alistair D. Bradley

    IPC分类号： G01L1/00

    CPC分类号： G01L19/146 ,  G01L19/04 ,  H01L2924/15151

    摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.

    摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。

    SENSOR GEOMETRY FOR IMPROVED PACKAGE STRESS ISOLATION
    6.
    发明申请
    SENSOR GEOMETRY FOR IMPROVED PACKAGE STRESS ISOLATION 有权
    传感器几何改进包装应力隔离

    公开(公告)号：US20100301435A1

    公开(公告)日：2010-12-02

    申请号：US12857380

    申请日：2010-08-16

    申请人： Gilberto Morales ,  Carl E. Stewart ,  Richard A. Davis ,  Alistair D. Bradley

    发明人： Gilberto Morales ,  Carl E. Stewart ,  Richard A. Davis ,  Alistair D. Bradley

    IPC分类号： H01L29/84 ,  H01L21/02 ,  H01L23/12

    CPC分类号： G01L19/146 ,  G01L19/04 ,  H01L2924/15151

    摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.

    摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。

    Sensor geometry for improved package stress isolation
    7.
    发明授权
    Sensor geometry for improved package stress isolation 有权
    传感器几何形状，用于改进封装应力隔离

    公开(公告)号：US07798010B2

    公开(公告)日：2010-09-21

    申请号：US11973966

    申请日：2007-10-11

    申请人： Gilberto Morales ,  Carl E. Stewart ,  Richard A. Davis ,  Alistair D. Bradley

    发明人： Gilberto Morales ,  Carl E. Stewart ,  Richard A. Davis ,  Alistair D. Bradley

    IPC分类号： G01L1/00

    CPC分类号： G01L19/146 ,  G01L19/04 ,  H01L2924/15151

    摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.

    摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。

    Miniature pressure sensor assembly for catheter
    9.
    发明授权
    Miniature pressure sensor assembly for catheter 有权
    用于导管的微型压力传感器组件

    公开(公告)号：US07911315B2

    公开(公告)日：2011-03-22

    申请号：US11496533

    申请日：2006-07-28

    申请人： Alistair D. Bradley

    发明人： Alistair D. Bradley

    IPC分类号： A61B5/103 ,  A61B5/117 ,  G01B5/30 ,  G01B7/16 ,  H01L27/108 ,  H01L29/94 ,  G01L1/22 ,  H01C10/10

    CPC分类号： A61B5/0215 ,  A61B5/03 ,  A61B5/6874 ,  A61B2562/028 ,  A61M2025/0002

    摘要： A pressure sensor assembly configured for use with a catheter. In one illustrative embodiment, the pressure sensor assembly may include a multi-layer co-fired ceramic (MLCC) package. The MLCC package may include two or more ceramic layers that are co-fired together, with a cavity defined by at least some of the ceramic layers. At least one internal bond pad is provided within the cavity, and at least one external connection point is provided on the MLCC package exterior. A sensor, such as a pressure sensor, may be positioned and attached within the cavity. The sensor may be electrically connected to at least one of the internal bond pads. In some cases, a sealant may be used to encapsulate the sensor within the cavity. Once fabricated, the MLCC sensor assembly may be provided in a sensor lumen of a catheter.

    摘要翻译： 构造成与导管一起使用的压力传感器组件。 在一个说明性实施例中，压力传感器组件可以包括多层共烧陶瓷（MLCC）封装。 MLCC封装可以包括两个或更多个共同烧结的陶瓷层，其中空腔由至少一些陶瓷层限定。 在空腔内设置至少一个内部接合焊盘，并且至少一个外部连接点设置在MLCC封装外部。 诸如压力传感器的传感器可以被定位并附接在空腔内。 传感器可以电连接到至少一个内部接合焊盘。 在一些情况下，可以使用密封剂将传感器封装在空腔内。 一旦制造，MLCC传感器组件可以设置在导管的传感器腔中。