公开(公告)号：US5320272A

公开(公告)日：1994-06-14

申请号：US42227

申请日：1993-04-02

Applicant: Cynthia Melton ,  Harry Fuerhaupter ,  George Demet

Inventor： Cynthia Melton ,  Harry Fuerhaupter ,  George Demet

IPC: B23K35/00 ,  B23K35/26 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3473 ,  Y02P70/611

Abstract: In an electronic package, a solder connection for bonding faying surfaces is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film of the tertiary metal onto at least one faying surface and thereafter applying tin-bismuth solder paste onto the film. Preferably, a plate of tin-bismuth alloy is first electroplated onto the faying surface, onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

Abstract translation: 在电子封装中，用于焊接接合表面的焊接连接由含有第三金属，优选金或银的锡 - 铋合金形成，其量有效地增加合金的熔融温度并增强连接处的升高的机械性能 操作中通常遇到的温度。 用于形成焊接连接​​的工艺包括将第三金属的膜施加到至少一个引线表面上，然后将锡 - 铋焊膏施加到膜上。 优选地，将锡 - 铋合金板首先电镀在第三金属被电镀的引线表面上。 在加热回流焊料期间，第三金属溶解以产生形成连接的均匀液体。

公开(公告)号：US06436730B1

公开(公告)日：2002-08-20

申请号：US08677755

申请日：1996-07-10

Applicant: Cynthia Melton ,  Theresa L. Baker

Inventor： Cynthia Melton ,  Theresa L. Baker

IPC: H01L2148

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3651 ,  H05K3/3431 ,  H05K3/3457 ,  H01L2224/13099 ,  H01L2924/00014

Abstract: A microelectronic package (10) comprises an integrated circuit component (12) mounted on a substrate (14) by solder bump interconnections (16) formed of a lead-free, tin-base solder alloy that contains a significant copper addition. A preferred solder is composed of a tin alloy containing between about 2 and 8 weight percent copper, preferably between about 3 and 5 weight percent. In the absence of lead, it is found that precipitation of copper-containing intermetallics of the type that adversely affect tin-lead solders is reduced. Moreover, the lead-free copper-tin solder alloy exhibits a high surface tension to reduce collapse of component toward the substrate during solder reflow.

Abstract translation: 微电子封装（10）包括通过由含有显着铜添加的无铅锡基焊料合金形成的焊料凸块互连（16）而安装在基板（14）上的集成电路部件（12）。 优选的焊料由包含约2至8重量％铜，优选约3至5重量％的锡合金组成。 在没有铅的情况下，发现对锡铅焊料有不利影响的含铜金属间化合物的析出减少。 此外，无铅铜锡焊料合金表现出高的表面张力，以减少焊料回流期间部件向衬底的塌陷。

公开(公告)号：US5410184A

公开(公告)日：1995-04-25

申请号：US130830

申请日：1993-10-04

Applicant: Cynthia Melton ,  Theresa L. Baker

Inventor： Cynthia Melton ,  Theresa L. Baker

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01R23/48

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3651 ,  H05K3/3431 ,  H05K3/3457

Abstract: A microelectronic package comprises an integrated circuit component mounted on a substrate by solder bump interconnections formed of a lead-free, tin-base solder alloy that contains a significant copper addition. A preferred solder is composed of a tin alloy containing between about 2 and 8 weight percent copper, preferably between about 3 and 5 weight percent. In the absence of lead, it is found that precipitation of copper-containing intermetallics of the type that adversely affect tin-lead solders is reduced. Moreover, the lead-free copper-tin solder alloy exhibits a high surface tension to reduce collapse of component toward the substrate during solder reflow.

Abstract translation: 微电子封装包括通过由含有显着铜添加的无铅锡基焊料合金形成的焊料凸块互连而安装在基板上的集成电路部件。 优选的焊料由包含约2至8重量％铜，优选约3至5重量％的锡合金组成。 在没有铅的情况下，发现对锡铅焊料有不利影响的含铜金属间化合物的析出减少。 此外，无铅铜锡焊料合金表现出高的表面张力，以减少焊料回流期间部件向衬底的塌陷。

公开(公告)号：US5316205A

公开(公告)日：1994-05-31

申请号：US43102

申请日：1993-04-05

Applicant: Cynthia Melton

Inventor： Cynthia Melton

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H05K3/3463 ,  H05K2201/10681 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K3/3473 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A gold bump contact on an electronic component is solder bonded to a bond pad of a printed circuit board or the like utilizing a solder composed of tin-bismuth alloy. The solder is applied to the bond pad as an electroplate or a paste, after which the gold bump is superposed onto the bond pad. The assembly is heated to a first temperature to melt the solder and thereafter maintained at a temperature less than 150.degree. C. to permit the molten solder to wet the gold surface, after which the assembly is cooled to solidify the solder and complete the connection. Wetting at the relatively low temperature retards dissolution of the gold and thereby reduces formation of unwanted gold tin intermetallic compounds that tend to decrease mechanical properties of the connection.

Abstract translation: 使用由锡 - 铋合金构成的焊料将电子部件上的金凸点接触焊接到印刷电路板等的接合焊盘。 将焊料作为电镀板或糊料施加到接合焊盘，之后将金凸块重叠在接合焊盘上。 将组件加热至第一温度以熔化焊料，然后保持在低于150℃的温度下，以使熔融焊料润湿金表面，之后将组件冷却以固化焊料并完成连接。 在相对低的温度下润湿会延缓金的溶解，从而减少倾向于降低连接的机械性能的不想要的金锡金属间化合物的形成。

公开(公告)号：US5186383A

公开(公告)日：1993-02-16

申请号：US770070

申请日：1991-10-02

Applicant: Cynthia Melton ,  Carl Raleigh ,  Kenneth Cholewczynski ,  Kevin Moore

Inventor： Cynthia Melton ,  Carl Raleigh ,  Kenneth Cholewczynski ,  Kevin Moore

IPC: B23K1/00 ,  H01L21/60 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/81 ,  B23K1/0016 ,  H01L24/17 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14505 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/2036 ,  H05K2203/0723 ,  H05K3/3473 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method for attaching an integrated circuit component to a printed circuit board by a plurality of solder bump interconnections utilizes a printed circuit board comprising a solder-plated circuit trace. The trace includes terminals, each including a terminal pad and a runner section. A solder plate formed of a first solder alloy is applied to the terminal to extend continuously between the pad and the runner section. Solder bumps are affixed to the component and are formed of second compositionally distinct solder alloy having a melting temperature greater than the first alloy. The component and board are then assembled so that the bumps rest against the solder-plated terminal pads, and heated to a temperature effective to melt the solder plate but not the bump alloy. Upon cooling to resolidify the solder, the solder plate is fused to the bumps to form the interconnections.

Abstract translation: 通过多个焊料凸块互连将集成电路部件附接到印刷电路板的方法利用包括焊接电镀电路迹线的印刷电路板。 轨迹包括端子，每个端子包括端子垫和流道部分。 将由第一焊料合金形成的焊盘施加到端子上，以在焊盘和流道部分之间连续延伸。 焊料凸起固定在部件上，并且由具有大于第一合金的熔化温度的第二组成不同的焊料合金形成。 然后将组件和板组装成使得凸块抵靠焊料焊接的端子焊盘，并且被加热到有效熔化焊接板而不是凸块合金的温度。 在冷却以重新固化焊料时，焊料板与凸块熔合以形成互连。