Inductance element and case
    1.
    发明申请

    公开(公告)号:US20070040640A1

    公开(公告)日:2007-02-22

    申请号:US11586498

    申请日:2006-10-26

    IPC分类号: H01F27/02

    摘要: An inductance element and a case; the inductance element, comprising a winding type magnetic core having a hollow part formed by winding a magnetic ribbon thereon and a lead having a cross sectional dimension smaller than the inner diameter of the hollow part of the magnetic core and passing the hollow part, wherein a clearance is provided between the magnetic core and the lead; the case, comprising a plurality of members combined with each other, wherein the members are connected to each other in a surface including one or more case ridge lines.

    Inductance element and case
    2.
    发明授权
    Inductance element and case 有权
    电感元件和外壳

    公开(公告)号:US07196605B2

    公开(公告)日:2007-03-27

    申请号:US10670571

    申请日:2003-09-26

    IPC分类号: H01F27/02

    摘要: An inductance element and a case; the inductance element, comprising a winding type magnetic core having a hollow part formed by winding a magnetic ribbon thereon and a lead having a cross sectional dimension smaller than the inner diameter of the hollow part of the magnetic core and passing the hollow part, wherein a clearance is provided between the magnetic core and the lead; the case, comprising a plurality of members combined with each other, wherein the members are connected to each other in a surface including one or more case ridge lines.

    摘要翻译: 电感元件和外壳; 所述电感元件包括具有通过在其上卷绕磁性体而形成的中空部分的绕组型磁芯和具有小于所述磁芯的中空部分的内径的横截面尺寸的引线,并且使所述中空部分通过,其中, 在磁芯和引线之间提供间隙; 所述壳体包括彼此组合的多个构件,其中所述构件在包括一个或多个壳体脊线的表面中彼此连接。

    Inductance element and case
    3.
    发明授权
    Inductance element and case 有权
    电感元件和外壳

    公开(公告)号:US07362202B2

    公开(公告)日:2008-04-22

    申请号:US11586498

    申请日:2006-10-26

    IPC分类号: H01F27/02

    摘要: An inductance element and a case; the inductance element, comprising a winding type magnetic core having a hollow part formed by winding a magnetic ribbon thereon and a lead having a cross sectional dimension smaller than the inner diameter of the hollow part of the magnetic core and passing the hollow part, wherein a clearance is provided between the magnetic core and the lead; the case, comprising a plurality of members combined with each other, wherein the members are connected to each other in a surface including one or more case ridge lines.

    摘要翻译: 电感元件和外壳; 所述电感元件包括具有通过在其上卷绕磁性体而形成的中空部分的绕组型磁芯和具有小于所述磁芯的中空部分的内径的横截面尺寸的引线,并且使所述中空部分通过,其中, 在磁芯和引线之间提供间隙; 所述壳体包括彼此组合的多个构件,其中所述构件在包括一个或多个壳体脊线的表面中彼此连接。

    Wafer polishing method, wafer cleaning method and wafer protective film
    4.
    发明授权
    Wafer polishing method, wafer cleaning method and wafer protective film 失效
    晶圆抛光法,晶圆清洗法及晶圆保护膜

    公开(公告)号:US06558233B1

    公开(公告)日:2003-05-06

    申请号:US09719564

    申请日:2000-12-28

    IPC分类号: B24B100

    CPC分类号: H01L21/02052 H01L21/02024

    摘要: Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning. In a wafer polishing method in which a wafer holding surface of one side surface of a wafer is held and a wafer polishing surface of the other side surface thereof is polished while dripping a polishing agent, the wafer polishing surface is polished while covering the wafer holding surface with a synthetic resin protective film of etching resistance against the polishing agent, good adhesiveness to the wafer and a property easy to peel off from the wafer after polishing.

    摘要翻译: 提供一种晶片抛光方法,其中在单面抛光中,用保护膜覆盖晶片保持表面(一个侧表面),抛光晶片抛光表面(另一侧表面),使得晶片保持表面可以 防止被抛光剂蚀刻和污染; 可以有效地除去在抛光后保留在晶片保持面上的保护膜的晶片清洗方法,并且容易地处理废物清洁溶液; 以及晶片保护膜,其在抛光中充分地覆盖晶片保持表面,但在清洁中被有效地去除。 在晶片抛光方法中,晶片的一个侧表面的晶片保持表面和其另一侧表面的晶片抛光表面被抛光抛光剂,抛光晶片抛光表面,同时覆盖晶片保持 表面具有对抛光剂的耐蚀刻性的合成树脂保护膜,对晶片的良好粘合性和抛光后容易从晶片剥离的性质。

    Pellicle with a filter and method for production thereof
    5.
    发明授权
    Pellicle with a filter and method for production thereof 有权
    具有过滤器的防护薄膜及其制造方法

    公开(公告)号:US06436586B1

    公开(公告)日:2002-08-20

    申请号:US09544333

    申请日:2000-04-06

    IPC分类号: G03F114

    摘要: There is disclosed a pellicle having a pellicle frame with at least one vent for controlling atmospheric pressure and a filter attached so as to cover the vent, wherein it takes 5 minutes to 180 minutes, to restore a pellicle film swelled during a step of attaching the pellicle to the exposure original plate under atmospheric pressure of 760 mmHg followed by reducing atmospheric pressure to 500 mmHg and keeping the pressure, to the original state and a method for producing it, and a pellicle with a filter having a pellicle frame with at least one vent for controlling atmospheric pressure wherein all over the inner surface of the filter attached so as to cover said vent is impregnated with a resin, and 50% by volume or more of the filter is impregnated therewith. There can be provided a pellicle with a filter having both of impurity-trapping performance and ventilating performance, and a method for producing it, and a pellicle with a filter having ventilating performance wherein impurities can be fixed without being released even under violent airflow such as air blow or the like and finer impurities can be trapped, with keeping ventilating performance.

    摘要翻译: 公开了一种防护薄膜组件,其具有至少一个用于控制大气压力的通风口的防护薄膜组件框架和附着以覆盖通风口的过滤器,其中需要5分钟至180分钟,以恢复在附接步骤期间膨胀的防护薄膜组件 将防护薄膜组件暴露在760mmHg的大气压下的原版上,随后将大气压降至500mmHg,并将压力保持在原始状态,及其制备方法,以及具有过滤器的防护薄膜组件,该防护薄膜组件框架具有至少一个 用于控制大气压力的排气口,其中,将覆盖所述通气口的过滤器的内表面全部浸渍在树脂中,并且浸渍50体积%以上的过滤器。 可以提供一种带有具有杂质捕获性能和通气性能的过滤器的防护薄膜及其制造方法,以及具有通风性能的过滤器的防护薄膜组件,其中即使在暴力气流下即使固定也不会释放杂质,例如 吹气等,并且可以捕获更细的杂质,同时保持通风性能。

    Liquid phase diffusion bonding method for dissimilar metal sheets and liquid phase diffusion bonding apparatus for the same
    7.
    发明授权
    Liquid phase diffusion bonding method for dissimilar metal sheets and liquid phase diffusion bonding apparatus for the same 有权
    用于异种金属片的液相扩散接合方法和用于其的液相扩散接合装置

    公开(公告)号:US07119309B2

    公开(公告)日:2006-10-10

    申请号:US11054547

    申请日:2005-02-10

    IPC分类号: B23K13/01

    CPC分类号: B23K20/2275 B23K20/06

    摘要: A liquid phase diffusion bonding method for dissimilar metal sheets by allowing a galvanized steel sheet and an aluminum alloy sheet to come into close contact with each other and pressing both sheets by using a first mold of a liquid phase diffusion bonding apparatus and a second mold of the same; and heating the sheets at approximately the same heat-up rate and at approximately the same temperature to perform liquid phase diffusion bonding of the sheets by using induction heat generated by applying high frequency currents to a first high frequency induction heating coil provided on the first mold and a second high frequency induction heating coil provided on the second mold. The first high frequency induction heating coil and the second high frequency induction heating coil are positioned to sandwich the sheets at predetermined distances from the sheets, respectively.

    摘要翻译: 通过使用镀锌钢板和铝合金板彼此紧密接触并通过使用液相扩散接合装置的第一模具和第二模具来压制两个片材来进行异相金属片的液相扩散接合方法 一样; 并以大致相同的加热速度和大致相同的温度加热片材,以通过使用通过向设置在第一模具上的第一高频感应加热线圈施加高频电流而产生的感应热来进行片材的液相扩散接合 以及设置在第二模具上的第二高频感应加热线圈。 第一高频感应加热线圈和第二高频感应加热线圈分别定位成将片材夹住预定距离的片材。

    Liquid phase diffusion bonding method for dissimilar metal sheets and liquid phase diffusion bonding apparatus for the same
    8.
    发明申请
    Liquid phase diffusion bonding method for dissimilar metal sheets and liquid phase diffusion bonding apparatus for the same 有权
    用于异种金属片的液相扩散接合方法和用于其的液相扩散接合装置

    公开(公告)号:US20050178819A1

    公开(公告)日:2005-08-18

    申请号:US11054547

    申请日:2005-02-10

    CPC分类号: B23K20/2275 B23K20/06

    摘要: A liquid phase diffusion bonding method for dissimilar metal sheets of the present invention has the steps of: allowing a galvanized steel sheet and an aluminum alloy sheet to come into close contact with each other and pressing both sheets by using a first mold of a liquid phase diffusion bonding apparatus and a second mold of the same; and heating the galvanized steel sheet and the aluminum alloy sheet at approximately the same heat-up rate and at approximately the same temperature to perform liquid phase diffusion bonding of the sheets by using induction heat generated by applying high frequency currents to a first high frequency induction heating coil provided on the first mold and a second high frequency induction heating coil provided on the second mold. The first high frequency induction heating coil and the second high frequency induction heating coil are positioned to sandwich the galvanized steel sheet and the aluminum alloy sheet at predetermined distances from the sheets, respectively. By this method, it is possible to reduce a time for bonding the galvanized steel sheet and the aluminum alloy sheet and to ensure sufficient bonding strength between the sheets.

    摘要翻译: 本发明的异种金属片的液相扩散接合方法具有以下步骤:使镀锌钢板和铝合金板彼此紧密接触并通过使用液相的第一模具来压制两片 扩散接合装置和第二模具; 以大致相同的加热速度和大约相同的温度加热镀锌钢板和铝合金板,通过使用通过将高频电流施加到第一高频感应产生的感应热来进行片的液相扩散接合 设置在第一模具上的加热线圈和设置在第二模具上的第二高频感应加热线圈。 第一高频感应加热线圈和第二高频感应加热线圈分别定位成将预定距离的片材夹在镀锌钢板和铝合金板之间。 通过该方法,可以减少接合镀锌钢板和铝合金板的时间,并且确保片之间的充分的接合强度。

    Sapphire substrate, semiconductor device, electronic component, and crystal growing method
    9.
    发明授权
    Sapphire substrate, semiconductor device, electronic component, and crystal growing method 有权
    蓝宝石基板,半导体器件,电子部件和晶体生长方法

    公开(公告)号:US06586819B2

    公开(公告)日:2003-07-01

    申请号:US09927223

    申请日:2001-08-10

    申请人: Takashi Matsuoka

    发明人: Takashi Matsuoka

    IPC分类号: H01L31036

    摘要: In a sapphire substrate having a heteroepitaxial growth surface, the heteroepitaxial growth surface is parallel to a plane obtained by rotating a (01{overscore (1)}0) plane of the sapphire substrate about a c-axis of the sapphire substrate through 8° to 20° in a crystal lattice of the sapphire substrate. A semiconductor device, electronic component, and crystal growing method are also disclosed.

    摘要翻译: 在具有异质外延生长表面的蓝宝石衬底中,异质外延生长表面平行于通过将蓝宝石衬底的(01)(蓝宝石衬底的超(10)面)围绕蓝宝石衬底的c轴旋转8°至20°而获得的平面 在蓝宝石衬底的晶格中,还公开了半导体器件,电子元件和晶体生长方法。

    Image forming system comprising an image forming device and various
optional devices connected to the image forming device
    10.
    发明授权
    Image forming system comprising an image forming device and various optional devices connected to the image forming device 失效
    图像形成系统包括图像形成装置和连接到图像形成装置的各种可选装置

    公开(公告)号:US5365311A

    公开(公告)日:1994-11-15

    申请号:US964962

    申请日:1992-10-22

    申请人: Takashi Matsuoka

    发明人: Takashi Matsuoka

    CPC分类号: G03G15/65 G06K15/00 G06K15/12

    摘要: An image forming system including a laser printer and optional devices. The laser printer has a control section. The optional devices each have an upper device switch. Status data items are supplied from the optional devices to the control section. The data generated by the upper device switch of the optional device, showing whether or not the optional device is mounted on the device, is also supplied to the control section. Further, data generated by the upper device switch of the device and showing whether or not the optional device is mounted on the device are supplied to the control section. In addition, status data items are supplied from the optional devices to the control section. Based on the various data items received, the control section determines, with high accuracy, whether or not the optional devices are connected to the laser printer.

    摘要翻译: 包括激光打印机和可选设备的图像形成系统。 激光打印机具有控制部分。 每个可选设备都具有上部设备开关。 状态数据项从可选设备提供给控制部分。 由可选设备的上部设备开关产生的数据,显示可选设备是否安装在设备上,也提供给控制部分。 此外,由设备的上部设备开关产生的数据以及显示该可选设备是否安装在设备上的数据被提供给控制部分。 此外,状态数据项从可选设备提供给控制部分。 基于所接收的各种数据项,控制部分高精度地确定可选装置是否连接到激光打印机。