公开(公告)号：US20070277998A1

公开(公告)日：2007-12-06

申请号：US11806203

申请日：2007-05-30

申请人： Daigo Suzuki ,  Jun Karasawa ,  Sadahiro Tamai

发明人： Daigo Suzuki ,  Jun Karasawa ,  Sadahiro Tamai

IPC分类号： H05K1/03

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2203/0228

摘要： According to one embodiment, a printed wiring board includes a first layer, a flexible sheet member disposed at a part on a surface of the first layer, and a second layer which is disposed on the first layer and the flexible sheet member, a part of the second layer which corresponds to the flexible sheet member including an opening region.

摘要翻译： 根据一个实施例，印刷电路板包括第一层，设置在第一层的表面上的一部分的柔性片构件，以及设置在第一层和柔性片构件上的第二层， 所述第二层对应于包括开口区域的柔性片构件。

公开(公告)号：US20080149382A1

公开(公告)日：2008-06-26

申请号：US11951055

申请日：2007-12-05

申请人： Jun Karasawa ,  Daigo Suzuki ,  Sadahiro Tamai

发明人： Jun Karasawa ,  Daigo Suzuki ,  Sadahiro Tamai

IPC分类号： G01R31/02 ,  H05K1/02

CPC分类号： G01R31/2805 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/09509 ,  H05K2203/162

摘要： According to one embodiment, in a method of inspecting a printed wiring board, the printed wiring board which is provided with an outer-layer surface and an inner-layer surface is prepared for inspection. The printed wiring board includes a land provided on the outer-layer surface, a via ranging from the land to the inner-layer surface, and an inner layer pattern provided on the inner-layer surface, wherein the inner layer pattern is electrically connected to the via when a via shift in the printed wiring board is within a tolerance range. A conduction state between the land and the inner layer pattern is detected.

摘要翻译： 根据一个实施例，在检查印刷电路板的方法中，准备设置有外层表面和内层表面的印刷电路板用于检查。 印刷电路板包括设置在外层表面上的焊盘，从焊盘到内层表面的通孔以及设置在内层表面上的内层图案，其中内层图案电连接到 当印刷电路板中的通孔偏移在公差范围内时的通孔。 检测陆地和内层图案之间的导通状态。

公开(公告)号：US20130081568A1

公开(公告)日：2013-04-04

申请号：US13463580

申请日：2012-05-03

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： B05C5/02 ,  B05C13/02 ,  B05C11/00

CPC分类号： H05K3/022 ,  H05K1/189 ,  H05K3/0091 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/0191 ,  Y10T156/10

摘要： According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

公开(公告)号：US20130003322A1

公开(公告)日：2013-01-03

申请号：US13407612

申请日：2012-02-28

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H04N5/64 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/1034 ,  H05K2203/0278

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

摘要翻译： 根据一个实施例，电子设备包括壳体和壳体中的柔性印刷线路板。 柔性印刷布线板包括通孔，绝缘体，第一导电图案和第二导电图案。 通孔周围的绝缘体包括第一表面和与第一表面相对的第二表面。 第一导电图案连接到第一表面上的通孔。 第二导电图案连接到第二表面上的通孔。

公开(公告)号：US09155203B2

公开(公告)日：2015-10-06

申请号：US13463580

申请日：2012-05-03

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： B05B7/06 ,  B05C13/02 ,  H01L21/4763 ,  H05K3/02 ,  H05K3/40 ,  H05K1/18 ,  H05K3/28

CPC分类号： H05K3/022 ,  H05K1/189 ,  H05K3/0091 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/0191 ,  Y10T156/10

摘要： According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

摘要翻译： 根据一个实施例，一种装置包括：被配置为部分地在第一导体层的表面上提供第二导体层的器件; 配置为在所述第一导体层的表面上部分地提供第一绝缘层的器件; 在第一导体层和设置在第一导体层的表面上的第一绝缘层的状态下，将第一导体层，第二导体层，第一绝缘层和第三导体层集成的器件为 从与第一导体层相对的一侧覆盖第三导体层; 通过以通过积分获得的结构部分地去除第一导体层和第三导体层中的至少一个而形成导体图案的装置; 以及被配置为覆盖所述结构的两侧的装置。

公开(公告)号：US08767405B2

公开(公告)日：2014-07-01

申请号：US13093593

申请日：2011-04-25

申请人： Kota Tokuda ,  Sadahiro Tamai

发明人： Kota Tokuda ,  Sadahiro Tamai

IPC分类号： H05K5/00

CPC分类号： H05K1/189 ,  G06F1/1616 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2009

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

摘要翻译： 根据一个实施例，电子设备包括容纳在壳体中的壳体和柔性印刷电路板。 柔性印刷电路板包括基部，导电部分，第一粘合部分，盖部分，刚性加强板和第二粘合部分。 导电部分层压到基部。 第一粘合部分层压到导电部分并且包括第一开口。 盖部分层压到第一粘合剂部分并且包括与第一开口连续的第二开口。 刚性加强板与盖部相对。 第二粘合剂部分穿透第一和第二开口并插入在盖部分和加强板之间。

公开(公告)号：US20100326706A1

公开(公告)日：2010-12-30

申请号：US12797285

申请日：2010-06-09

申请人： Kiyomi Muro ,  Sadahiro Tamai

发明人： Kiyomi Muro ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0715

摘要： According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a conductive layer including a signal line and a ground line, a second insulating layer layered on the conductive layer and including openings open to above the ground line, a ground layer covering the signal line and electrically connected to the ground line, and a third insulating layer covering the ground layer. The ground layer includes first and second conductive pastes. The first conductive paste is filled in the openings so as to cover the ground line exposed to bottoms of the openings. The second conductive paste is applied so as to continuously cover the first conductive paste and the second insulating layer. The second conductive paste has a smaller volume resistivity than the first conductive paste.

摘要翻译： 根据一个实施例，电子设备包括柔性印刷线路板。 印刷布线板包括：导电层，包括信号线和接地线;层叠在导电层上的第二绝缘层，并且包括开到地线上方的开口;覆盖信号线并电连接到接地线的接地层 以及覆盖所述接地层的第三绝缘层。 接地层包括第一和第二导电浆料。 将第一导电膏填充在开口中以覆盖暴露于开口底部的接地线。 施加第二导电浆料以连续地覆盖第一导电浆料和第二绝缘层。 第二导电糊具有比第一导电糊更小的体积电阻率。

公开(公告)号：US08742264B2

公开(公告)日：2014-06-03

申请号：US13407612

申请日：2012-02-28

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： H05K1/11

CPC分类号： H04N5/64 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/1034 ,  H05K2203/0278

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

摘要翻译： 根据一个实施例，电子设备包括壳体和壳体中的柔性印刷线路板。 柔性印刷布线板包括通孔，绝缘体，第一导电图案和第二导电图案。 通孔周围的绝缘体包括第一表面和与第一表面相对的第二表面。 第一导电图案连接到第一表面上的通孔。 第二导电图案连接到第二表面上的通孔。

公开(公告)号：US07936565B2

公开(公告)日：2011-05-03

申请号：US12615064

申请日：2009-11-09

申请人： Kiyomi Muro ,  Sadahiro Tamai

发明人： Kiyomi Muro ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H05K1/118 ,  G06F1/1616 ,  G06F1/1658 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/097 ,  Y10T29/53157 ,  Y10T29/53261

摘要： According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

摘要翻译： 根据一个实施例，一种电子设备包括壳体，容纳在所述软管中的电路板，并且包括位于与所述第一表面相对的一侧的第一表面和第二表面，具有弹性的柔性印刷线路板，电连接到 所述电路板从所述电路板的所述第一表面提供到所述第二表面;以及按压部，所述按压部在弯曲时由柔性印刷布线板的一部分形成，并且将柔性印刷布线板朝向第一表面按压 使其与壳体的与电路板的第一表面相对的内表面接触。

公开(公告)号：US20120228009A1

公开(公告)日：2012-09-13

申请号：US13473449

申请日：2012-05-16

申请人： Kiyomi Muro ,  Sadahiro Tamai

发明人： Kiyomi Muro ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0715

摘要： According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a plurality of insulating layers, a conductive layer, and a ground layer. The ground layer comprises a first conductive paste filled in a plurality of openings of a second insulating layer so as to cover a ground line exposed to bottoms of the plurality of openings. The ground layer further comprises a second conductive paste applied so as to continuously cover the first conductive paste and the second insulating layer. The first and second conductive pastes each contain conductive particles and binder resin that binds the conductive particles, and the second conductive paste has the conductive particles whose amount as compared to the binder resin is larger than the first conductive paste such that a volume resistivity of the second conductive paste becomes smaller than that of the first conductive paste.

摘要翻译： 根据一个实施例，电子设备包括柔性印刷线路板。 印刷布线板包括多个绝缘层，导电层和接地层。 接地层包括填充在第二绝缘层的多个开口中的第一导电膏，以覆盖暴露于多个开口的底部的接地线。 接地层还包括施加以连续覆盖第一导电浆料和第二绝缘层的第二导电浆料。 第一和第二导电膏各自包含导电颗粒和结合导电颗粒的粘合剂树脂，并且第二导电糊具有与粘合剂树脂相比的量大于第一导电糊的导电颗粒，使得其的体积电阻率 第二导电糊比第一导电糊小。