摘要:
According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a plurality of insulating layers, a conductive layer, and a ground layer. The ground layer comprises a first conductive paste filled in a plurality of openings of a second insulating layer so as to cover a ground line exposed to bottoms of the plurality of openings. The ground layer further comprises a second conductive paste applied so as to continuously cover the first conductive paste and the second insulating layer. The first and second conductive pastes each contain conductive particles and binder resin that binds the conductive particles, and the second conductive paste has the conductive particles whose amount as compared to the binder resin is larger than the first conductive paste such that a volume resistivity of the second conductive paste becomes smaller than that of the first conductive paste.
摘要:
According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a conductive layer including a signal line and a ground line, a second insulating layer layered on the conductive layer and including openings open to above the ground line, a ground layer covering the signal line and electrically connected to the ground line, and a third insulating layer covering the ground layer. The ground layer includes first and second conductive pastes. The first conductive paste is filled in the openings so as to cover the ground line exposed to bottoms of the openings. The second conductive paste is applied so as to continuously cover the first conductive paste and the second insulating layer. The second conductive paste has a smaller volume resistivity than the first conductive paste.
摘要:
According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.
摘要:
According to one embodiment, an electronic apparatus includes a housing, a connector, and a component connected to the connector. The component includes a first and third electrically conductive portion on a first surface, a second electrically conductive portion on a second surface, and a first and second cover portions. The second electrically conductive portion is connected to the first electrically conductive portion. The third electrically conductive portion is kept in contact with a terminal of the connector, and connected to the second electrically conductive portion. The first and second cover portions cover at least a part of the first and second electrically conductive portion.
摘要:
According to one exemplary embodiment, a television apparatus includes: a housing; a circuit board housed in the housing; and an electronic component including a first face placed to a side of the circuit board and a second face placed opposite to the first face, and incorporating a silicon member. The electronic component comprises: an electrode provided at the first face and configured to be electrically connected to the circuit board; and a protrusion provided at the first face, placed between the silicon member and the circuit board, and separated from a surface of the circuit board.
摘要:
According to one embodiment, an electronic apparatus includes a casing and a flexible printed wiring board contained in the casing. The flexible printed wiring board includes an insulating layer, which is sheet-like, a signal line formed on a first surface of the insulating layer, and a ground layer, which is conductive and formed on a second surface of the insulating layer opposite to the first surface. The ground layer includes a mesh portion having a mesh structure and a thin film portion which fills cells in the mesh structure of the mesh portion.
摘要:
Disclosed is a wiring board including a first polyimide layer of heat-cured photosensitive polyimide, a copper layer pattern formed by growing an electrolytic copper plating layer on the polyimide layer, and a second polyimide layer of heat-cured photosensitive polyimide, the second polyimide layer covering the copper layer pattern. Also, disclosed is a magnetic disc apparatus including this wiring board, a head carriage having an electric connection to the wiring board and having a head mounted thereon to perform input/output of electric signals transmitted bilaterally via the connection, and a magnetic disc on which reading/writing of magnetic information are performed by the head mounted on the head carriage.
摘要:
A flexible printed circuit board includes: a base film that has electrical insulation property; a conductive pattern that is formed on the base film and including a pair of differential signal lines and a ground line; an insulating layer that is formed on the conductive pattern; a conductive layer that is formed on the insulating layer; and a connecting portion that electrically connects the ground line and the conductive layer through a penetration hole formed on the insulating layer.
摘要:
An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and a ground layer coated on the cover layer to cover the signal layer, the ground layer comprising a conductive paste in which metal powder and metal nanoparticles are mixed.
摘要:
A wiring board is constructed such that a base layer constituted of photosensitive polyimide, a conductor layer constituted of copper, and a cover layer constituted of photosensitive polyimide are formed in this order on a stainless layer. On an electronic part mounting portion, a plurality of lands are formed so as to correspond to electrode terminals of an electronic part to be mounted. On the periphery of the electronic part mounting portion, an underfill diffusion preventing portion formed by removing the cover layer in a trench shape is provided so as to surround the periphery thereof.