公开(公告)号：US5070039A

公开(公告)日：1991-12-03

申请号：US337609

申请日：1989-04-13

Applicant: Richard E. Johnson ,  Dennis D. Davis ,  David R. Kee ,  John W. Orcutt ,  Angus W. Hightower

Inventor： Richard E. Johnson ,  Dennis D. Davis ,  David R. Kee ,  John W. Orcutt ,  Angus W. Hightower

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50

CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/14 ,  Y10T29/49121

Abstract: A lead from 10 carries an integrated circuit on a die support pad 14. The lead frame has a dam bar including a transverse portion that extends between adjacent leads (20) for limiting mold flash. The dam bar transverse portion 26 is entirely severed from the adjacent leads for final removal by a metal punch 33 along with the supporting web 16.

Abstract translation: 来自10的引线在芯片支撑垫14上承载集成电路。引线框架具有在相邻引线（23,24）之间延伸的阻挡条26，用于限制模具闪光。 阻挡杆26从导线部分或全部切断，以便通过金属冲头33以及引线网16最终去除。

公开(公告)号：US5594234A

公开(公告)日：1997-01-14

申请号：US337798

申请日：1994-11-14

Applicant: Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Jesse Clark ,  Steven P. Laverde ,  Hai Tran

Inventor： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Jesse Clark ,  Steven P. Laverde ,  Hai Tran

IPC: H01L23/50 ,  H01L23/495 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0206 ,  H01L23/49503 ,  H01L23/49551 ,  H01L2224/06165 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/341

Abstract: The invention is a single piece deep downset exposed lead frame (10) that can be used in current production processes. A single lead frame (10) has a die mount pad (12) that is formed with a downset or cavity into which the semiconductor die (20) is mounted. Wings (14, 15, 17, 18) lock the die pad in the device package (21) and increase the length of potential moisture paths (34a). The downset die pad (12) provides direct thermal contact of the die mount pad (12) to an external heat sink, eliminating the need for a heat slug internal to the package. The exposed die pad (12) can also be used as an RF ground connection to an RF circuit ground plane.

Abstract translation: 本发明是可用于当前生产过程中的单件式深层封闭式引线框架（10）。 单个引线框架（10）具有模具安装焊盘（12），其形成有安装半导体管芯（20）的凹陷或空腔。 翼（14,15,17,18）将管芯焊盘锁定在设备封装（21）中并增加潜在湿气路径（34a）的长度。 芯片焊盘（12）提供模具安装焊盘（12）与外部散热器的直接热接触，从而消除了对封装内部的热段的需要。 暴露的裸片焊盘（12）也可以用作与RF电路接地层的RF接地连接。

公开(公告)号：US06365980B1

公开(公告)日：2002-04-02

申请号：US09513121

申请日：2000-02-25

Applicant: Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

Inventor： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

IPC: H01L2348

CPC classification number: H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6655 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor device comprising a thermally conductive foil including a chip mount portion having first and second surfaces; an integrated circuit chip attached to said first surface; a body of encapsulation material molded around said chip and said first surface such that it leaves said second surface exposed; and said second surface comprising means for forming thermal contact, thereby creating a path for dissipating thermal energy from said chip. Said means for thermal contact comprise a configuration of said second surface suitable for direct thermal attachment to a heat sink. Alternatively, said means for thermal contact comprise a configuration of said second surface suitable for thermal attachment including solder balls between the chip and the heat sink.

Abstract translation: 一种半导体器件，包括导热箔，其包括具有第一和第二表面的芯片安装部分; 附接到所述第一表面的集成电路芯片; 围绕所述芯片和所述第一表面模制的封装材料体，使得其离开所述第二表面; 并且所述第二表面包括用于形成热接触的装置，由此产生用于从所述芯片消散热能的路径。 所述用于热接触的装置包括适于直接热附接到散热器的所述第二表面的构造。 或者，所述用于热接触的装置包括适于热附接的所述第二表面的构造，包括在芯片和散热器之间的焊球。

公开(公告)号：US5308797A

公开(公告)日：1994-05-03

申请号：US980824

申请日：1992-11-24

Applicant: David R. Kee

Inventor： David R. Kee

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/4951 ,  H01L2924/0002 ,  Y10S228/902 ,  Y10T29/49171

Abstract: A semiconductor device is formed without using a leadframe. A semiconductor device is formed in one area of a semiconductor chip and a second area includes conductors to which lead wires are bonded. The lead wires are used for mounting the semiconductor device.

Abstract translation: 在不使用引线框的情况下形成半导体器件。 半导体器件形成在半导体芯片的一个区域中，第二区域包括导线被接合的导体。 引线用于安装半导体器件。

公开(公告)号：US06365976B1

公开(公告)日：2002-04-02

申请号：US09511320

申请日：2000-02-23

Applicant: Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

Inventor： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

IPC: H01L2348

CPC classification number: H01L21/4853 ,  H01L21/565 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/85001 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device, especially a Ball Grid Array or Chip Scale Package, comprising an integrated circuit chip having at least one input/output terminal; a body of encapsulation material molded around said chip, forming a generally flat surface including at least one dimple having a suitable size and shape to receive a solder ball or solder paste; and said dimple having an electrically conductive solderable surface connected to said terminal.

Abstract translation: 一种半导体器件，特别是球栅阵列或芯片级封装，包括具有至少一个输入/输出端的集成电路芯片; 围绕所述芯片模制的封装材料体，形成包括具有合适尺寸和形状的至少一个凹坑的大致平坦的表面以接收焊球或焊膏; 并且所述凹坑具有连接到所述端子的导电可焊接表面。

公开(公告)号：US6072230A

公开(公告)日：2000-06-06

申请号：US926150

申请日：1997-09-09

Applicant: Buford H. Carter, Jr. ,  Jesse E. Clark ,  David R. Kee

Inventor： Buford H. Carter, Jr. ,  Jesse E. Clark ,  David R. Kee

IPC: H01L23/50 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L23/49551 ,  H01L23/49544 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181

Abstract: The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segments connecting said chip mount pad with said leadframe. The latter plurality of segments has a geometry designed so as to tolerate bending and stretching beyond the limit of simple elongation based upon the inherent material characteristics. The chip mount pad of said leadframe provides direct thermal contact to an external heat conductor or heat sink by being designed so as to extend through the encapsulating package. The exposed chip pad can also be used electrically as a ground connection.

Abstract translation: 本发明涉及可用于当前半导体器件生产中的单件引线框架。 引线框架具有水平面中的多个段，不同水平面中的芯片安装焊盘以及将所述芯片安装焊盘与所述引线框架连接的另外多个段。 后面的多个段具有被设计为基于固有材料特性而允许弯曲和拉伸超出简单伸长极限的几何形状。 所述引线框架的芯片安装焊盘通过被设计成延伸穿过封装封装而提供与外部导热体或散热器的直接热接触。 暴露的芯片焊盘也可以用作接地连接。

公开(公告)号：US5715989A

公开(公告)日：1998-02-10

申请号：US657492

申请日：1996-06-04

Applicant: David R. Kee

Inventor： David R. Kee

IPC: B23K20/00 ,  B23K20/12 ,  H01L21/603

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/129 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48666 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/48866 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2224/85099 ,  H01L2224/8517 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: A method of low temperature securing a wire to a bond pad in a microelectronic semiconductor device which includes providing a semiconductor die having a bond pad thereon and providing a wire to be secured to the bond pad. One of the bond pad and wire is rotated relative to the other and the pad is contacted with the wire while the bond pad and the wire are rotating relative to each other until the interface of the wire and the bond pad diffuse into each other sufficiently to provide a bond therebetween upon cooling to secure the wire to the bond pad. Preferably the die is stationary and the wire is rotated. The wire is then cut to a predetermined length. By this method, it is possible to weld together dissimilar metals as well as metals which were previously no available in the fabrication procedures being utilized such as, for example, wherein the wire and the bond pad are both copper, wherein the wire is copper and the bond pad is aluminum, or wherein the wire is copper and the bond pad is titanium tungsten.

Abstract translation: 一种低温将导线固定到微电子半导体器件中的接合焊盘的方法，该方法包括提供其上具有接合焊盘的半导体管芯，并提供要固定到接合焊盘的导线。 接合焊盘和导线中的一个相对于另一个旋转，并且焊盘与导线接触，同时接合焊盘和导线相对于彼此旋转，直到电线和接合焊盘的界面充分扩散到彼此中 在冷却时在其间提供接合以将导线固定到接合焊盘。 优选地，模具是静止的并且线材被旋转。 然后将线切割成预定长度。 通过这种方法，可以将异种金属以及之前在所用的制造过程中不可用的金属焊接在一起，例如，其中导线和接合焊盘都是铜，其中导线是铜和 接合焊盘是铝，或者其中导线是铜，并且接合焊盘是钛钨。