公开(公告)号：US06369493B1

公开(公告)日：2002-04-09

申请号：US09300182

申请日：1999-04-27

申请人： Dmitry Lubomirsky ,  Harald Herchen ,  Simon Yavelberg ,  David Palagashvili ,  Donald J. Olgado

发明人： Dmitry Lubomirsky ,  Harald Herchen ,  Simon Yavelberg ,  David Palagashvili ,  Donald J. Olgado

IPC分类号： H01J1726

CPC分类号： G03F7/70016 ,  H01J37/32192 ,  H01J37/32522

摘要： A plasma applicator having a tube that is surrounded by a cooling jacket such that a volume is defined proximate the tube. The volume is filled with a thermal transfer medium to couple heat from the tube to the cooling jacket. The cooling jacket contains an aperture through which energy is transmitted to a process gas contained in the tube. As such, the process gas is infused with energy and a plasma is formed in the tube.

摘要翻译： 一种等离子体施加器，其具有由冷却套包围的管，使得容积限定在管附近。 体积填充有热传递介质，以将热量从管耦合到冷却套管。 冷却套包含孔，通过该孔将能量传递到管中包含的处理气体。 因此，工艺气体注入能量，并且在管中形成等离子体。

公开(公告)号：US06824612B2

公开(公告)日：2004-11-30

申请号：US10036321

申请日：2001-12-26

申请人： Joseph J. Stevens ,  Dmitry Lubomirsky ,  Ian Pancham ,  Donald J. Olgado ,  Howard E. Grunes ,  Yeuk-Fai Edwin Mok ,  Girish Dixit

发明人： Joseph J. Stevens ,  Dmitry Lubomirsky ,  Ian Pancham ,  Donald J. Olgado ,  Howard E. Grunes ,  Yeuk-Fai Edwin Mok ,  Girish Dixit

IPC分类号： B05C502

CPC分类号： H01L21/67167 ,  C23C18/1632 ,  C23C18/1692 ,  H01L21/6723

摘要： A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.

摘要翻译： 一种用于电镀基板的方法和装置，其中所述装置包括具有至少一个基板传送机器人的中央基板传送外壳。 提供与中心基板传送外壳连通的基板激活室，并且可由至少一个基板传送机器人访问。 提供与中心基板传送外壳连通的基板电镀室，并且可由至少一个基板传送机器人访问。 提供与中央基板传送外壳连通的基板旋转漂洗干燥室，并且可由至少一个基板传送机器人访问，并且提供与中央基板传送外壳连通的退火室，并且可由至少一个 基板传送机器人。 还提供了至少一个与基板传送室连通并且可由至少一个基板传送机器人访问的基板盒装载器。

公开(公告)号：US06635157B2

公开(公告)日：2003-10-21

申请号：US09867780

申请日：2001-05-29

申请人： Yezdi Dordi ,  Donald J. Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Seon Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok K. Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

发明人： Yezdi Dordi ,  Donald J. Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Seon Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok K. Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

IPC分类号： C25D1700

CPC分类号： H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D21/02 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67745 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H05K3/241

摘要： The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

公开(公告)号：US07005046B2

公开(公告)日：2006-02-28

申请号：US10217872

申请日：2002-08-13

申请人： Joseph J. Stevens ,  Yevgeniy Rabinovich ,  Sandy S. Chao ,  Mark R. Denome ,  Allen L. D'Ambra ,  Donald J. Olgado

发明人： Joseph J. Stevens ,  Yevgeniy Rabinovich ,  Sandy S. Chao ,  Mark R. Denome ,  Allen L. D'Ambra ,  Donald J. Olgado

IPC分类号： C25D17/00

CPC分类号： C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D21/18

摘要： A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

摘要翻译： 提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。 较小的流量被转移到可以在单独平台上的计量单元。 在一个实施例中的计量单元包括加压流动管线。

公开(公告)号：US06454927B1

公开(公告)日：2002-09-24

申请号：US09603791

申请日：2000-06-26

申请人： Joseph J. Stevens ,  Yevgeniy Rabinovich ,  Sandy S. Chao ,  Mark R. Denome ,  Allen L. D'Ambra ,  Donald J. Olgado

发明人： Joseph J. Stevens ,  Yevgeniy Rabinovich ,  Sandy S. Chao ,  Mark R. Denome ,  Allen L. D'Ambra ,  Donald J. Olgado

IPC分类号： C25B1500

CPC分类号： C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D21/18

摘要： A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

摘要翻译： 提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。 较小的流量被转移到可以在单独平台上的计量单元。 在一个实施例中的计量单元包括加压流动管线。

公开(公告)号：US06612014B1

公开(公告)日：2003-09-02

申请号：US09616308

申请日：2000-07-12

申请人： Bernardo Donoso ,  Joseph J. Stevens ,  Donald J. Olgado ,  Alexander Sou-Kang Ko

发明人： Bernardo Donoso ,  Joseph J. Stevens ,  Donald J. Olgado ,  Alexander Sou-Kang Ko

IPC分类号： B23Q700

CPC分类号： H01L21/68728 ,  H01L21/67034 ,  Y10T29/49998

摘要： An apparatus and associated method for securing a wafer to a SRD spider, the SRD spider has a plurality of spider arms. The apparatus includes a plurality of spaced surfaces disposed on a distal end of one of the spider arms, each of the surfaces being spaced perpendicularly from the longitudinal axis of the spider arm. In one aspect, the two surfaces are positioned to limit production of a wedging force between that spaced surface and the wafer. In one embodiment, a post at least partially defines each one of the plurality of spaced surfaces.

摘要翻译： 一种用于将晶片固定到SRD蜘蛛的装置和相关方法，SRD蜘蛛具有多个蜘蛛臂。 该装置包括设置在一个蜘蛛臂的远端上的多个间隔表面，每个表面与该蜘蛛臂的纵向轴线垂直地间隔开。 在一个方面，两个表面被定位成限制在该间隔表面和晶片之间的楔入力的产生。 在一个实施例中，柱至少部分地限定多个间隔开的表面中的每一个。

公开(公告)号：US06571657B1

公开(公告)日：2003-06-03

申请号：US09664607

申请日：2000-09-18

申请人： Donald J. Olgado ,  Avi Tepman ,  Timothy J. Franklin

发明人： Donald J. Olgado ,  Avi Tepman ,  Timothy J. Franklin

IPC分类号： B25J1700

CPC分类号： H01L21/67126 ,  B25J9/1638 ,  C25D7/12 ,  G05B2219/40351 ,  G05B2219/41457 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67742 ,  H01L21/68707 ,  H05K3/241 ,  Y10T74/20311

摘要： The present invention provides an apparatus and associated method in which the apparatus comprises a multiple blade robot and a compensating device. The multiple blade robot includes at least one set of robot blades. The compensating device adjusts for differences in spacing between the set of robot blades and spacing between two or more cells. In different embodiments, the compensating device may be coupled to one or more of the process cells, one or more of the substrate holder systems, or one or more of the robot blades.

摘要翻译： 本发明提供了一种装置和相关联的方法，其中该装置包括多叶片机器人和补偿装置。 多刀片机器人包括至少一组机器人刀片。 补偿装置调节机器人刀片组之间的间距和两个或更多个单元之间的间隔的差异。 在不同的实施例中，补偿装置可以耦合到一个或多个处理单元，一个或多个基板保持器系统或一个或多个机器人叶片。

公开(公告)号：US06517130B1

公开(公告)日：2003-02-11

申请号：US09524977

申请日：2000-03-14

申请人： Bernardo Donoso ,  Joseph J. Stevens ,  Donald J. Olgado ,  Mark Denome

发明人： Bernardo Donoso ,  Joseph J. Stevens ,  Donald J. Olgado ,  Mark Denome

IPC分类号： B66C102

CPC分类号： H01L21/68707 ,  B25J15/0616 ,  H01L21/6838 ,  Y10S414/141

摘要： In one aspect, a vacuum chuck supports a substrate on an end effector, the vacuum chuck comprising a position reference structure and a suction cup. The position reference structure is mounted to the surface and comprises a reference surface. The suction cup is located proximate the reference surface and comprising a suction mount. In another aspect, a method of chucking a substrate to a vacuum chuck is provided. The vacuum chuck comprises a suction cup and a position reference structure. The method comprises attaching the suction cup to the substrate to form a seal therebetween. The suction cup is deformed such that the substrate contacts the position reference structure. The substrate is then leveled on the position reference structure.

摘要翻译： 在一个方面，真空吸盘支撑末端执行器上的基板，真空卡盘包括位置参考结构和吸盘。 位置参考结构安装到表面并且包括参考表面。 吸盘位于参考表面附近并且包括抽吸座。 另一方面，提供了将基板夹持到真空吸盘的方法。 真空吸盘包括吸盘和位置参考结构。 该方法包括将吸盘连接到基底以在其间形成密封。 吸盘变形使得基板接触位置参考结构。 然后将基板平整在位置参考结构上。

公开(公告)号：US06432282B1

公开(公告)日：2002-08-13

申请号：US09518182

申请日：2000-03-02

申请人： Shamouil Shamouilian ,  Anada H. Kumar ,  Donald J. Olgado ,  Joseph J. Stevens ,  Ricardo Leon ,  Jon Clinton

发明人： Shamouil Shamouilian ,  Anada H. Kumar ,  Donald J. Olgado ,  Joseph J. Stevens ,  Ricardo Leon ,  Jon Clinton

IPC分类号： B23H704

CPC分类号： H01L21/2885 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12

摘要： The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

公开(公告)号：US06258220B1

公开(公告)日：2001-07-10

申请号：US09289074

申请日：1999-04-08

申请人： Yezdi Dordi ,  Donald J. Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Seon Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok K. Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

发明人： Yezdi Dordi ,  Donald J. Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Seon Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok K. Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

IPC分类号： C25D1700

CPC分类号： H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D21/02 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67745 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H05K3/241

摘要： The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

摘要翻译： 本发明提供了一种电化学沉积系统，其被设计成具有可扩展以适应未来设计和间隙填充要求的柔性结构，并提供令人满意的生产量以满足其它处理系统的需求。 电化学沉积系统通常包括具有主机晶片传送机器人的主机，与主机连接设置的加载站，与主机连接设置的一个或多个处理单元，以及流体连接到该主机的一个或多个 电加工电池。 优选地，电化学沉积系统包括设置在加载站和主机之间的旋转干燥（SRD）站，附接到装载站的快速热退火室，以及用于控制电化学沉积的系统控制器 工艺和电化学沉积系统的组件。