公开(公告)号：US5000682A

公开(公告)日：1991-03-19

申请号：US467937

申请日：1990-01-22

申请人： Donald W. Heidt ,  Steve Thompson ,  Worm Lund ,  Raymon F. Thompson ,  Larry M. Beasley

发明人： Donald W. Heidt ,  Steve Thompson ,  Worm Lund ,  Raymon F. Thompson ,  Larry M. Beasley

IPC分类号： F27D5/00

CPC分类号： F27D5/0037

摘要： Semiconductor wafers within a supporting vertical wafer tower are positioned within a vertical process chamber through a lower gate valve fixed to a supporting framework. The gate valve is sealed to a similar gate valve at the upper end of a movable load lock on the framework, within which the wafers are subjected to pre-treatment and post-treatment processes. Two load locks are alternately used in conjunction with the process chamber and a wafer loading station on the framework. In addition, a cleaning element is movably mounted on the framework for periodically maintaining the interior surfaces of the process tube within the process chamber.

摘要翻译： 支撑垂直晶片塔内的半导体晶片通过固定到支撑框架的下闸阀定位在垂直处理室内。 闸阀在框架上的可移动负载锁的上端处被密封到类似的闸阀，在其中晶片经过预处理和后处理过程。 两个负载锁与框架上的处理室和晶片加载站交替使用。 此外，清洁元件可移动地安装在框架上，用于周期性地将处理管的内表面保持在处理室内。

公开(公告)号：US20150014175A1

公开(公告)日：2015-01-15

申请号：US13937866

申请日：2013-07-09

申请人： Raymon F. Thompson

发明人： Raymon F. Thompson

IPC分类号： C25D17/00 ,  C25D7/12

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/002 ,  C25D17/02 ,  C25D17/12 ,  C25D21/10 ,  C25D21/18 ,  H01L21/2885 ,  H01L21/76877

摘要： An electroplating apparatus for plating a metal onto a surface of a wafer is disclosed. The apparatus comprises a wafer support configured to support a wafer and a processing base. The processing base has a scroll pump oriented to pump a plating solution in a substantially perpendicular direction with respect to the surface of the wafer. Further, the scroll pump includes a first scroll and a second scroll, at least one of which is configured as an anode. In one embodiment, the processing base includes an anolyte chamber including the scroll pump, a catholyte chamber, and a membrane separating the anolyte chamber from the catholyte chamber.

摘要翻译： 公开了一种用于将金属镀覆在晶片表面上的电镀设备。 该装置包括构造成支撑晶片和处理基座的晶片支撑件。 处理基座具有定向成相对于晶片表面沿基本上垂直的方向泵送电镀溶液的涡旋泵。 此外，涡旋泵包括第一涡旋件和第二涡旋件，其中至少一个构造为阳极。 在一个实施例中，处理基底包括一个包括涡旋泵，阴极电解液室和一个将阳极电解液室与阴极电解液室隔开的膜的阳极电解液室。

公开(公告)号：US08028978B2

公开(公告)日：2011-10-04

申请号：US10397946

申请日：2003-03-25

申请人： Gordon R. Nelson ,  Jeffry A. Davis ,  Raymon F. Thompson ,  Eric J. Bergman

发明人： Gordon R. Nelson ,  Jeffry A. Davis ,  Raymon F. Thompson ,  Eric J. Bergman

IPC分类号： B23P19/00

CPC分类号： H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S269/903

摘要： A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.

摘要翻译： 半导体晶片处理系统具有包括晶片槽的载体。 过程机器人接合载体并将载体安装在处理室内的转子中。 转子具有与载体的锥形或阶梯状外表面匹配的锥形或阶梯状内表面。 载体上的晶片固定器枢转以更好地将晶片保护在载体内。

公开(公告)号：US07625821B2

公开(公告)日：2009-12-01

申请号：US11420591

申请日：2006-05-26

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： H01L21/302

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供了用于处理晶片的系统和装置。 新的系统和设备允许生产更薄的晶片，同时保持坚固。 结果，由本方法生产的晶片不易破裂。 独特的系统还提供了一种改进的处理薄化晶片的结构，并减少了处理步骤的数量。 这导致产量提高和工艺效率提高。

公开(公告)号：US06900132B2

公开(公告)日：2005-05-31

申请号：US10691688

申请日：2003-10-22

申请人： Raymon F. Thompson ,  Jeffry A. Davis ,  Randy Harris ,  Dana R. Scranton ,  Ryan Pfeifle ,  Steven A. Peace ,  Brian Aegerter

发明人： Raymon F. Thompson ,  Jeffry A. Davis ,  Randy Harris ,  Dana R. Scranton ,  Ryan Pfeifle ,  Steven A. Peace ,  Brian Aegerter

IPC分类号： H01L21/00 ,  H01L21/3213 ,  H01L21/311

CPC分类号： H01L21/6715 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/6708 ,  Y10S438/913

摘要： A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.

摘要翻译： 用于处理半导体晶片的系统在框架的台面上具有处理单元。 过程单元和甲板具有精确的定位特征，例如锥形销，用于将处理单元精确地定位在甲板上。 可以拆卸加工单元并安装在甲板上的更换过程单元，而无需重新校准装载/卸载机器人。 这减少了更换过程单元并重新启动处理操作所需的时间。 通过将未使用的液体从供应管线中抽出并将其抽回储存器来减少加工过程中的液体化学品消耗。

公开(公告)号：US06666922B2

公开(公告)日：2003-12-23

申请号：US09921845

申请日：2001-08-02

申请人： Gary L Curtis ,  Raymon F. Thompson

发明人： Gary L Curtis ,  Raymon F. Thompson

IPC分类号： C23C1600

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

摘要： An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a substantially closed processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. Multiple housings may be vertically stacked and rotated about a common rotation axis to simultaneously process multiple workpieces in a small space.

公开(公告)号：US06622737B2

公开(公告)日：2003-09-23

申请号：US10217716

申请日：2002-08-13

申请人： Gary L. Curtis ,  Raymon F. Thompson

发明人： Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： B08B304

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67075 ,  H01L21/6708 ,  Y10S134/902

摘要： In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

公开(公告)号：US06447633B1

公开(公告)日：2002-09-10

申请号：US09710530

申请日：2000-11-09

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： C28F102

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

公开(公告)号：US06264752B1

公开(公告)日：2001-07-24

申请号：US09113435

申请日：1998-07-10

申请人： Gary L. Curtis ,  Raymon F. Thompson

发明人： Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： C23L1600

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708

摘要： An apparatus for processing a microelectronic workpiece in a micro-environment is set forth. The apparatus includes a first chamber member having an interior chamber wall and a second chamber member having an interior chamber wall. The first and second chamber members are adapted for relative movement between a loading position in which the first and second chamber members are distal one another and a processing position in which the first and second chamber members are proximate one another to define a processing chamber. At least one workpiece support assembly is disposed between the first and second chamber members for supporting the microelectronic workpiece. The workpiece support assembly is operable to space the workpiece a first distance, x1, from an interior chamber wall of at least one of the first and second chamber members when the first and second chamber members are in the loading position and to space the workpiece a second distance, x2, from the interior chamber wall when the first and second chamber members are in the processing position, wherein x1>x2.

摘要翻译： 阐述了在微环境中处理微电子工件的装置。 该装置包括具有内部室壁的第一室构件和具有内部室壁的第二室构件。 第一和第二室构件适于在第一和第二室构件彼此远离的装载位置和第一和第二室构件彼此靠近以限定处理室的处理位置之间的相对运动。 至少一个工件支撑组件设置在第一和第二室构件之间，用于支撑微电子工件。 工件支撑组件可操作以当第一和第二室构件处于装载位置时将工件与第一和第二室构件中的至少一个室内构件的内室壁隔开第一距离x1，并使工件空间 第二距离x2，当第一和第二腔室构件处于加工位置时，其中x1> x2。

公开(公告)号：US5678320A

公开(公告)日：1997-10-21

申请号：US415240

申请日：1995-04-03

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B17/24

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理诸如集成电路晶片，平板显示器，半导体衬底和数据盘的半导体产品的处理器。 处理器具有接收物品载体中的物品的接口部分。 接口部分将物品从载体转移到处理阵列中。 具有自动臂组件的输送机将物品阵列移动到处理站之间和处理站之间。 处理站从与接口部分相邻的封闭区域进行访问。