公开(公告)号：US20060273841A1

公开(公告)日：2006-12-07

申请号：US11160056

申请日：2005-06-07

申请人： David Hanson ,  Dureseti Chidambarrao ,  Gregory Fredeman ,  David Onsongo

发明人： David Hanson ,  Dureseti Chidambarrao ,  Gregory Fredeman ,  David Onsongo

IPC分类号： H01H37/76

CPC分类号： G11C17/18

摘要： A circuit is provided which is operable to program an electrically alterable element, e.g., fuse or antifuse, to a programmed state and determine whether the electrically alterable element is in the programmed state or not. Such circuit includes a multiple conduction state field effect transistor (“multi-state FET”) having at least one of a source or a drain coupled to the electrically alterable element to apply a current to the electrically alterable element. The multi-state FET has a first threshold voltage and a second threshold voltage, both being effective at the same time, the second threshold voltage being higher than the first threshold voltage. The gate is operable to control operation of the multi-state FET in multiple states including a) an essentially nonconductive state; b) a first or “low” conductive state when a gate-source voltage exceeds the first threshold voltage, in which the multi-state FET is biased to conduct a relatively low magnitude current for determining the state of the fuse; and c) a second conductive state when the gate-source voltage exceeds the second threshold voltage, in which the multi-state FET is biased to conduct a relatively high magnitude programming current.

摘要翻译： 提供了一种电路，其可操作以将电可更改元件（例如，熔丝或反熔丝）编程到编程状态，并确定电可更改元件是否处于编程状态。 这种电路包括多导通状态场效应晶体管（“多状态FET”），其具有耦合到可电可变元件的源极或漏极中的至少一个，以将电流施加到电可更改元件。 多状态FET具有第一阈值电压和第二阈值电压，两者均同时有效，第二阈值电压高于第一阈值电压。 栅极可操作以控制多状态FET的操作，包括a）基本上非导通状态; b）当栅极 - 源极电压超过第一阈值电压时，第一或“低”导通状态，其中多态FET被偏置以传导相对低的幅度电流以确定保险丝的状态; 以及c）当所述栅极 - 源极电压超过所述第二阈值电压时，所述第二导电状态是所述多态FET被偏置以导通相对高的编程电流。

公开(公告)号：US20060273393A1

公开(公告)日：2006-12-07

申请号：US11160055

申请日：2005-06-07

申请人： Dureseti Chidambarrao ,  David Onsongo ,  David Hanson

发明人： Dureseti Chidambarrao ,  David Onsongo ,  David Hanson

IPC分类号： H01L29/43

CPC分类号： H01L21/2822 ,  H01L29/42368 ,  H01L29/512 ,  H01L29/518

摘要： A field effect transistor (“FET”) is provided has a semiconductor region including a channel region, a source region and a drain region and a gate conductor overlying the channel region. Such FET has a first threshold voltage having a first magnitude and a second threshold voltage having a second magnitude higher than the first magnitude, both threshold voltages being effective at the same time. The FET is operable in response to a gate-source voltage between the gate conductor and the source region in multiple states including at least: a) an essentially nonconductive state when a magnitude of the gate-source voltage is less than the first magnitude and less than the second magnitude, the source-drain current then being at most a negligible value; b) a first conductive state when the magnitude of the gate-source voltage is greater than the first magnitude and less than the second magnitude, the source-drain current then having a first operating value about ten or more times higher than the negligible value; and c) a second conductive state when the magnitude of the gate-source voltage is greater than first magnitude and the second magnitude, in which state the source-drain current has a second operating value ten or more times higher than the first operating value.

摘要翻译： 提供场效应晶体管（“FET”）具有包括沟道区，源极区和漏极区以及覆盖沟道区的栅极导体的半导体区。 这样的FET具有第一阈值电压和第二阈值电压，第一阈值电压具有比第一幅度高的第二幅度，两个阈值电压同时有效。 FET可响应于多个状态的栅极导体和源极区域之间的栅极 - 源极电压而工作，包括至少：a）当栅极 - 源极电压的幅度小于第一个幅度并且较小时，基本上是非导通状态 那么源极 - 漏极电流最大可以忽略不计。 b）当栅极 - 源极电压的大小大于第一幅度且小于第二幅度时，第一导电状态，源极 - 漏极电流的第一个操作值比可忽略的值高大约十倍或更多倍; 以及c）当所述栅极 - 源极电压的大小大于所述第一幅度和所述第二幅度时，所述第二导通状态，其中所述源极 - 漏极电流具有比所述第一操作值高十倍或更多倍的第二操作值。

公开(公告)号：US20070257249A1

公开(公告)日：2007-11-08

申请号：US11381810

申请日：2006-05-05

申请人： Anda Mocuta ,  Dureseti Chidambarrao ,  Ricardo Donaton ,  David Onsongo ,  Kern Rim

发明人： Anda Mocuta ,  Dureseti Chidambarrao ,  Ricardo Donaton ,  David Onsongo ,  Kern Rim

IPC分类号： H01L31/00

CPC分类号： H01L21/823807 ,  H01L29/1054 ,  H01L29/66636 ,  H01L29/78687

摘要： A semiconductor structure and method of manufacturing a semiconductor device, and more particularly, an NFET device. The devices includes a stress receiving layer provided over a stress inducing layer with a material at an interface there between which reduces the occurrence and propagation of misfit dislocations in the structure. The stress receiving layer is silicon (Si), the stress inducing layer is silicon-germanium (SiGe) and the material is carbon which is provided by doping the layers during formation of the device. The carbon can be doped throughout the whole of the SiGe layer also.

摘要翻译： 一种制造半导体器件的半导体结构和方法，特别是NFET器件。 这些装置包括在应力诱导层上提供的应力接收层，其中在其间的界面处的材料减少了结构中失配位错的发生和传播。 应力接收层是硅（Si），应力诱导层是硅锗（SiGe），并且材料是在形成器件期间通过掺杂层提供的碳。 也可以在整个SiGe层中掺杂碳。

公开(公告)号：US20070028195A1

公开(公告)日：2007-02-01

申请号：US11193711

申请日：2005-07-29

申请人： Dureseti Chidambarrao ,  Donald Jordan ,  Judith McCullen ,  David Onsongo ,  Tina Wagner ,  Richard Williams

发明人： Dureseti Chidambarrao ,  Donald Jordan ,  Judith McCullen ,  David Onsongo ,  Tina Wagner ,  Richard Williams

IPC分类号： G06F17/50

CPC分类号： G06F17/5068 ,  G06F17/5036 ,  H01L29/7843

摘要： System and method for compact model algorithms to accurately account for effects of layout-induced changes in nitride liner stress in semiconductor devices. The layout-sensitive compact model algorithms account for the impact of large layout variation on circuits by implementing algorithms for obtaining the correct stress response approximations and layout extraction algorithms for obtaining the correct geometric parameters that drive the stress response. In particular, these algorithms include specific information from search “buckets” that are directionally-oriented and include directionally-specific distance measurements for analyzing in detail the specific shape neighborhood of the semiconductor device. The algorithms are additionally adapted to enable the modeling and stress impact determination of a device having single stress liner film and dual-stress liners (two different liner films that abut at an interface).

摘要翻译： 用于紧凑模型算法的系统和方法来准确地解释半导体器件中氮化物衬垫应力的布局引起的变化的影响。 布局敏感的压缩模型算法通过实现用于获得正确的应力响应近似和布局提取算法的算法来解决大布局变化对电路的影响，以获得驱动应力响应的正确几何参数。 特别地，这些算法包括来自定向定向的搜索“桶”的特定信息，并且包括用于详细分析半导体器件的特定形状邻域的定向特定的距离测量。 算法还适用于使具有单个应力衬垫膜和双应力衬垫（在界面处邻接的两个不同衬垫膜）的器件的建模和应力冲击确定。

公开(公告)号：US09059316B2

公开(公告)日：2015-06-16

申请号：US13397860

申请日：2012-02-16

申请人： Yaocheng Liu ,  Dureseti Chidambarrao ,  Oleg Gluschenkov ,  Judson R. Holt ,  Renee T. Mo ,  Kern Rim

发明人： Yaocheng Liu ,  Dureseti Chidambarrao ,  Oleg Gluschenkov ,  Judson R. Holt ,  Renee T. Mo ,  Kern Rim

IPC分类号： H01L21/8238 ,  H01L21/768 ,  H01L21/84 ,  H01L27/12 ,  H01L29/66 ,  H01L29/78 ,  H01L27/32 ,  H01L29/165

CPC分类号： H01L21/823864 ,  H01L21/76886 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/3279 ,  H01L29/165 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7848

摘要： While embedded silicon germanium alloy and silicon carbon alloy provide many useful applications, especially for enhancing the mobility of MOSFETs through stress engineering, formation of alloyed silicide on these surfaces degrades device performance. The present invention provides structures and methods for providing unalloyed silicide on such silicon alloy surfaces placed on semiconductor substrates. This enables the formation of low resistance contacts for both mobility enhanced PFETs with embedded SiGe and mobility enhanced NFETs with embedded Si:C on the same semiconductor substrate. Furthermore, this invention provides methods for thick epitaxial silicon alloy, especially thick epitaxial Si:C alloy, above the level of the gate dielectric to increase the stress on the channel on the transistor devices.

摘要翻译： 虽然嵌入式硅锗合金和硅碳合金提供了许多有用的应用，特别是为了通过应力工程增强MOSFET的迁移率，在这些表面上形成合金化硅化物降低了器件性能。 本发明提供了在放置在半导体衬底上的这种硅合金表面上提供非合金硅化物的结构和方法。 这使得能够在具有嵌入式SiGe的迁移率增强的PFET和在同一半导体衬底上具有嵌入的Si：C的迁移率增强的NFET形成低电阻触点。 此外，本发明提供了在栅极电介质的电平之上的厚外延硅合金，特别是厚的外延Si：C合金的方法，以增加晶体管器件上的沟道上的应力。

公开(公告)号：US08871576B2

公开(公告)日：2014-10-28

申请号：US13036292

申请日：2011-02-28

申请人： Daniel Tekleab ,  Hung H. Tran ,  Jeffrey W. Sleight ,  Dureseti Chidambarrao

发明人： Daniel Tekleab ,  Hung H. Tran ,  Jeffrey W. Sleight ,  Dureseti Chidambarrao

IPC分类号： H01L29/49 ,  H01L29/06 ,  B82Y10/00 ,  H01L29/775 ,  H01L29/66 ,  H01L29/78

CPC分类号： H01L29/78 ,  B82Y10/00 ,  H01L29/0676 ,  H01L29/66439 ,  H01L29/66666 ,  H01L29/775 ,  H01L29/7827

摘要： A nanotubular MOSFET device and a method of fabricating the same are used to extend device scaling roadmap while maintaining good short channel effects and providing competitive drive current. The nanotubular MOSFET device includes a concentric tubular inner and outer gate separated from each other by a tubular shaped epitaxially grown silicon layer, and a source and drain respectively separated by spacers surrounding the tubular inner and outer gates. The method of forming the nanotubular MOSFET device includes: forming on a substrate a cylindrical shaped Si layer; forming an outer gate surrounding the cylindrical Si layer and positioned between a bottom spacer and a top spacer; growing a silicon epitaxial layer on the top spacer adjacent to a portion of the cylindrical shaped Si layer; etching an inner portion of the cylindrical shaped Si forming a hollow cylinder; forming an inner spacer at the bottom of the inner cylinder; forming an inner gate by filling a portion of the hollow cylinder; forming a sidewall spacer adjacent to the inner gate; and etching a deep trench for accessing and contacting the outer gate and drain.

摘要翻译： 纳米管MOSFET器件及其制造方法用于扩展器件缩放路线图，同时保持良好的短沟道效应并提供有竞争力的驱动电流。 纳米管MOSFET器件包括通过管状外延生长硅层彼此分离的同心管状内部和外部栅极，以及分别由围绕管状内部和外部门的间隔开的源极和漏极。 形成纳米管MOSFET器件的方法包括：在衬底上形成圆柱形的Si层; 形成围绕圆柱形Si层并位于底部间隔件和顶部间隔件之间的外部门; 在与圆柱形Si层的一部分相邻的顶部间隔上生长硅外延层; 蚀刻形成中空圆筒的圆柱形Si的内部; 在内筒的底部形成内隔板; 通过填充中空圆筒的一部分形成内门; 形成邻近所述内门的侧壁间隔物; 并蚀刻用于访问和接触外部栅极和漏极的深沟槽。

公开(公告)号：US08803243B2

公开(公告)日：2014-08-12

申请号：US13342435

申请日：2012-01-03

申请人： Yue Liang ,  Dureseti Chidambarrao ,  Brian J. Greene ,  William K. Henson ,  Unoh Kwon ,  Shreesh Narasimha ,  Xiaojun Yu

发明人： Yue Liang ,  Dureseti Chidambarrao ,  Brian J. Greene ,  William K. Henson ,  Unoh Kwon ,  Shreesh Narasimha ,  Xiaojun Yu

IPC分类号： H01L21/70

CPC分类号： H01L21/823871 ,  H01L21/28079 ,  H01L21/30604 ,  H01L21/76224 ,  H01L21/823878 ,  H01L29/4958

摘要： A complementary metal oxide semiconductor (CMOS) device including a substrate including a first active region and a second active region, wherein each of the first active region and second active region of the substrate are separated by from one another by an isolation region. A n-type semiconductor device is present on the first active region of the substrate, in which the n-type semiconductor device includes a first portion of a gate structure. A p-type semiconductor device is present on the second active region of the substrate, in which the p-type semiconductor device includes a second portion of the gate structure. A connecting gate portion provides electrical connectivity between the first portion of the gate structure and the second portion of the gate structure. Electrical contact to the connecting gate portion is over the isolation region, and is not over the first active region and/or the second active region.

摘要翻译： 一种互补金属氧化物半导体（CMOS）器件，包括包括第一有源区和第二有源区的衬底，其中衬底的第一有源区和第二有源区中的每一个被隔离区彼此分开。 n型半导体器件存在于衬底的第一有源区上，其中n型半导体器件包括栅极结构的第一部分。 p型半导体器件存在于衬底的第二有源区上，其中p型半导体器件包括栅极结构的第二部分。 连接栅极部分提供栅极结构的第一部分和栅极结构的第二部分之间的电连接。 与连接栅极部分的电接触超过隔离区域，并且不在第一有源区域和/或第二有源区域之上。

公开(公告)号：US20130320340A1

公开(公告)日：2013-12-05

申请号：US13488532

申请日：2012-06-05

申请人： Emrah Acar ,  Aditya Bansal ,  Dureseti Chidambarrao ,  Liang-Teck Pang ,  Amith Singhee

发明人： Emrah Acar ,  Aditya Bansal ,  Dureseti Chidambarrao ,  Liang-Teck Pang ,  Amith Singhee

IPC分类号： H01L21/66 ,  H01L23/50

CPC分类号： H01L22/34 ,  H01L22/14 ,  H01L27/0203 ,  H01L27/1104 ,  H01L2924/0002 ,  H01L2924/00

摘要： A physical test integrated circuit has a plurality of repeating circuit portions corresponding to an integrated circuit design. A first of the portions is fabricated with a nominal block mask location, and additional ones of the portions are deliberately fabricated with predetermined progressive increased offset of the block mask location from the nominal block mask location. For each of the portions, the difference in threshold voltage between a first field effect transistor and a second field effect transistor is determined. The predetermined progressive increased offset of the block mask location is in a direction from the first field effect transistor to the second field effect transistor. The block mask overlay tolerance is determined at a value of the progressive increased offset corresponding to an inflection of the difference in threshold voltage from a zero difference. A method for on-chip monitoring, and corresponding circuits, are also disclosed.

公开(公告)号：US08476706B1

公开(公告)日：2013-07-02

申请号：US13343472

申请日：2012-01-04

申请人： Dureseti Chidambarrao ,  Brian J. Greene ,  Yue Liang ,  Xiaojun Yu

发明人： Dureseti Chidambarrao ,  Brian J. Greene ,  Yue Liang ,  Xiaojun Yu

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119 ,  H01L27/01 ,  H01L27/12 ,  H01L31/0392

CPC分类号： H01L21/8238 ,  H01L21/823807 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/1054 ,  H01L29/66651

摘要： A delta doping of silicon by carbon is provided on silicon surfaces by depositing a silicon carbon alloy layer on silicon surfaces, which can be horizontal surfaces of a bulk silicon substrate, horizontal surfaces of a top silicon layer of a semiconductor-on-insulator substrate, or vertical surfaces of silicon fins. A p-type field effect transistor (PFET) region and an n-type field effect transistor (NFET) region can be differentiated by selectively depositing a silicon germanium alloy layer in the PFET region, and not in the NFET region. The silicon germanium alloy layer in the PFET region can overlie or underlie a silicon carbon alloy layer. A common material stack can be employed for gate dielectrics and gate electrodes for a PFET and an NFET. Each channel of the PFET and the NFET includes a silicon carbon alloy layer, and is differentiated by the presence or absence of a silicon germanium layer.

摘要翻译： 通过在硅表面上沉积硅碳合金层，在硅表面上提供硅的δ掺杂，硅表面可以是体硅衬底的水平表面，绝缘体上半导体衬底的顶部硅层的水平表面， 或硅片的垂直表面。 可以通过在PFET区域中而不是在NFET区域中选择性地沉积硅锗合金层来区分p型场效应晶体管（PFET）区域和n型场效应晶体管（NFET）区域。 PFET区域中的硅锗合金层可以覆盖或叠加在硅碳合金层上。 普通材料堆叠可用于PFET和NFET的栅极电介质和栅电极。 PFET和NFET的每个沟道包括硅碳合金层，并且通过硅锗层的存在或不存在来区分。

公开(公告)号：US08429576B2

公开(公告)日：2013-04-23

申请号：US13471789

申请日：2012-05-15

申请人： James A. Culp ,  Paul Chang ,  Dureseti Chidambarrao ,  Praveen Elakkumanan ,  Jason Hibbeler ,  Anda C. Mocuta

发明人： James A. Culp ,  Paul Chang ,  Dureseti Chidambarrao ,  Praveen Elakkumanan ,  Jason Hibbeler ,  Anda C. Mocuta

IPC分类号： G06F17/50

CPC分类号： G01R31/26 ,  G06F17/5045

摘要： Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design.