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    SAMPLE OBSERVING DEVICE AND SAMPLE OBSERVING METHOD
    1.
    发明申请
    SAMPLE OBSERVING DEVICE AND SAMPLE OBSERVING METHOD 有权
    样品观察装置和样品观察方法

    公开(公告)号：US20130161511A1

    公开(公告)日：2013-06-27

    申请号：US13665623

    申请日：2012-10-31

    Applicant: Ebara Corporation

    Inventor： Tsutomu Karimata ,  Tatsuya Kohama ,  Shoji Yoshikawa ,  Masahiro Hatakeyama

    IPC: H01J37/26

    CPC classification number: H01J37/261 ,  H01J37/073 ,  H01J37/12 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/036 ,  H01J2237/062 ,  H01J2237/06333 ,  H01J2237/1205 ,  H01J2237/1518 ,  H01J2237/186 ,  H01J2237/2443 ,  H01J2237/2817

    Abstract: An electron beam inspection device observes a sample by irradiating the sample set on a stage with electron beams and detecting the electron beams from the sample. The electron beam inspection device has one electron column which irradiates the sample with the electron beams, and detects the electron beams from the sample. In this one electron column, a plurality of electron beam irradiation detecting systems are formed which each form electron beam paths in which the electron beams with which the sample is irradiated and the electron beams from the sample pass. The electron beam inspection device inspects the sample by simultaneously using a plurality of electron beam irradiation detecting systems and simultaneously irradiating the sample with the plurality of electron beams.

    Abstract translation: 电子束检查装置通过用电子束照射载物台上的样品并检测来自样品的电子束来观察样品。 电子束检查装置具有一个电子管，用电子束照射样品，并检测来自样品的电子束。 在该一个电子柱中，形成多个电子束照射检测系统，每个电子束照射检测系统形成电子束路径，其中照射样品的电子束和来自样品的电子束通过。 电子束检查装置通过同时使用多个电子束照射检测系统来检查样品，同时用多个电子束照射样品。

    Electro-optical inspection apparatus and method with dust or particle collection function
    3.
    发明授权
    Electro-optical inspection apparatus and method with dust or particle collection function 有权
    电光检测装置及方法，具有灰尘或颗粒收集功能

    公开(公告)号：US09105444B2

    公开(公告)日：2015-08-11

    申请号：US14096361

    申请日：2013-12-04

    Applicant: Ebara Corporation

    Inventor： Kenji Watanabe ,  Masahiro Hatakeyama ,  Yoshihiko Naito ,  Tatsuya Kohama ,  Kenji Terao ,  Takeshi Murakami ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Hiroshi Sobukawa ,  Norio Kimura

    IPC: H01J37/24 ,  H01J37/02 ,  H01J37/22 ,  H01J37/26 ,  H01J37/29

    CPC classification number: H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

    Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate (124) having a through hole (124a) at the center above the sample (200) and the dust collecting electrode (122).

    Abstract translation: 提供一种电光检查装置，其能够尽可能地防止灰尘或颗粒附着到样品表面。 将其上放置有样品（200）的载物台（100）设置在能够抽真空的真空室（112）的内部，并且设置集尘电极（122）以包围样品（200）的周围， 。 集尘电极（122）施加与施加到样品（200）的电压相同极性的电压和与电压的绝对值相同或更大的绝对值。 因此，由于灰尘或颗粒例如颗粒附着在集尘电极122上，所以可以降低灰尘或颗粒对样品表面的粘附。 代替使用集尘电极，可以在包含载物台的真空室的壁上形成凹部，或者在壁上配置具有施加了预定电压的网状结构的金属板。 此外，通过在样品（200）上方的中心和集尘电极（122）设置具有通孔（124a）的间隙控制板（124），可以进一步减少灰尘或颗粒的附着。

    Sample observing device and sample observing method
    4.
    发明授权
    Sample observing device and sample observing method 有权
    样品观察装置和样品观察方法

    公开(公告)号：US08884225B2

    公开(公告)日：2014-11-11

    申请号：US13665623

    申请日：2012-10-31

    Applicant: Ebara Corporation

    Inventor： Tsutomu Karimata ,  Tatsuya Kohama ,  Shoji Yoshikawa ,  Masahiro Hatakeyama

    IPC: H01J37/28 ,  H01J37/26 ,  H01J37/073 ,  H01J37/12

    CPC classification number: H01J37/261 ,  H01J37/073 ,  H01J37/12 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/036 ,  H01J2237/062 ,  H01J2237/06333 ,  H01J2237/1205 ,  H01J2237/1518 ,  H01J2237/186 ,  H01J2237/2443 ,  H01J2237/2817

    Abstract: An electron beam inspection device observes a sample by irradiating the sample set on a stage with electron beams and detecting the electron beams from the sample. The electron beam inspection device has one electron column which irradiates the sample with the electron beams, and detects the electron beams from the sample. In this one electron column, a plurality of electron beam irradiation detecting systems are formed which each form electron beam paths in which the electron beams with which the sample is irradiated and the electron beams from the sample pass. The electron beam inspection device inspects the sample by simultaneously using a plurality of electron beam irradiation detecting systems and simultaneously irradiating the sample with the plurality of electron beams.

    Abstract translation: 电子束检查装置通过用电子束照射载物台上的样品并检测来自样品的电子束来观察样品。 电子束检查装置具有一个电子管，用电子束照射样品，并检测来自样品的电子束。 在该一个电子柱中，形成多个电子束照射检测系统，每个电子束照射检测系统形成电子束路径，其中照射样品的电子束和来自样品的电子束通过。 电子束检查装置通过同时使用多个电子束照射检测系统来检查样品，同时用多个电子束照射样品。

    Adjustment method and electron beam device
    5.
    发明授权
    Adjustment method and electron beam device 有权

    公开(公告)号：US11217421B2

    公开(公告)日：2022-01-04

    申请号：US16879151

    申请日：2020-05-20

    Applicant: EBARA CORPORATION

    Inventor： Takehide Hayashi ,  Ryo Tajima ,  Tatsuya Kohama ,  Kenji Watanabe ,  Tsutomu Karimata

    IPC: H01J37/147 ,  H01J37/244 ,  H01J37/32 ,  H01J37/14

    Abstract: An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.

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