公开(公告)号：US10556314B2

公开(公告)日：2020-02-11

申请号：US15636343

申请日：2017-06-28

Applicant: EBARA CORPORATION

Inventor： Suguru Sakugawa ,  Toru Maruyama ,  Nobuyuki Takahashi ,  Zhongxin Wen ,  Yoichi Shiokawa ,  Keita Yagi ,  Itsuki Kobata ,  Tomohiko Takeuchi

IPC: B24B37/005 ,  B24B37/10 ,  H01L21/306

Abstract: According to one aspect, a substrate processing apparatus is provided. The substrate processing apparatus includes a table provided with a substrate holding surface for holding a substrate, a pad for processing the substrate held on the table, a head for holding the pad, an actuator for moving the head in a direction perpendicular to the substrate holding surface of the table, and a mechanical stopper device for stopping a movement of the head in the direction perpendicular to the substrate holding surface.

公开(公告)号：US10201888B2

公开(公告)日：2019-02-12

申请号：US15604328

申请日：2017-05-24

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno ,  Mitsuru Miyazaki ,  Naoki Toyomura ,  Takuya Inoue

IPC: B24B53/00 ,  B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US09700988B2

公开(公告)日：2017-07-11

申请号：US14832767

申请日：2015-08-21

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno ,  Mitsuru Miyazaki ,  Naoki Toyomura ,  Takuya Inoue

IPC: B24B53/00 ,  B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67

CPC classification number: B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US12179312B2

公开(公告)日：2024-12-31

申请号：US17193049

申请日：2021-03-05

Applicant: EBARA CORPORATION

Inventor： Takuya Moriura ,  Hiroshi Sotozaki ,  Tadakazu Sone ,  Masayoshi Ito ,  Itsuki Kobata ,  Hisanori Matsuo ,  Tetsuya Terada

IPC: B24B57/02 ,  B24B37/04

Abstract: There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

公开(公告)号：US11465254B2

公开(公告)日：2022-10-11

申请号：US16787892

申请日：2020-02-11

Applicant: Ebara Corporation

Inventor： Itsuki Kobata ,  Katsuhide Watanabe ,  Hozumi Yasuda ,  Yuji Yagi ,  Nobuyuki Takahashi ,  Koichi Takeda

IPC: B24B37/013 ,  B24B37/04 ,  B24B37/20

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20220013352A1

公开(公告)日：2022-01-13

申请号：US17294212

申请日：2019-10-31

Applicant: EBARA CORPORATION

Inventor： Toshio Mizuno ,  Yosuke Himori ,  Erina Baba ,  Tomoatsu Ishibashi ,  Itsuki Kobata

IPC: H01L21/02 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

Abstract: To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.

公开(公告)号：US11069563B2

公开(公告)日：2021-07-20

申请号：US16814560

申请日：2020-03-10

Applicant: EBARA CORPORATION

Inventor： Atsuo Katagiri ,  Itsuki Kobata

IPC: H01L21/768 ,  H01L21/321 ,  H01L21/3105

Abstract: Planarization is performed on heterogeneous films with high accuracy. According to one embodiment, a method for processing a substrate is provided. The substrate is formed of an insulating film layer where a groove is formed, a barrier metal layer, and a wiring metal layer in order from a bottom in at least a part of a region. The method includes (3) while the wiring metal layer, the barrier metal layer, and the insulating film layer are exposed to the surface of the substrate: a step of bringing the surface of the substrate into contact with a catalyst; a step of supplying a process liquid between the catalyst and the surface of the substrate; and a step of flowing a current between the catalyst and the surface of the substrate.

公开(公告)号：US10792782B2

公开(公告)日：2020-10-06

申请号：US15514785

申请日：2016-01-18

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno

IPC: B24B37/005 ,  B24B37/10 ,  B24B49/16 ,  B24B37/34 ,  H01L21/306 ,  H01L21/66

Abstract: The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed.One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.

公开(公告)号：US20200243364A1

公开(公告)日：2020-07-30

申请号：US16845914

申请日：2020-04-10

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Keita Yagi ,  Katsuhide Watanabe ,  Yoichi Shiokawa ,  Toru Maruyama ,  Nobuyuki Takahashi

IPC: H01L21/677 ,  H01L21/66 ,  B24B37/04 ,  H01L21/67 ,  H01L21/3213 ,  H01L21/321 ,  H01L21/306 ,  H01L21/311 ,  H01L21/683 ,  B24B37/20 ,  H01L21/3105

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method.The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

公开(公告)号：US20200171621A1

公开(公告)日：2020-06-04

申请号：US16692092

申请日：2019-11-22

Applicant: EBARA CORPORATION

Inventor： Takashi Yamazaki ,  Itsuki Kobata ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC: B24B57/02 ,  B24B37/34 ,  B24B37/005 ,  B24B37/10

Abstract: A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.