公开(公告)号：US10002740B2

公开(公告)日：2018-06-19

申请号：US15667040

申请日：2017-08-02

申请人： EBARA CORPORATION

发明人： Masahiro Hatakeyama ,  Ryo Tajima ,  Kenichi Suematsu ,  Kenji Watanabe ,  Yasushi Toma ,  Kenji Terao ,  Takeshi Murakami

IPC分类号： H01J37/05 ,  H01J37/147 ,  H01J37/141 ,  H01J37/26 ,  H01J37/244

CPC分类号： H01J37/05 ,  H01J37/12 ,  H01J37/141 ,  H01J37/147 ,  H01J37/244 ,  H01J37/26 ,  H01J37/29 ,  H01J2237/0268 ,  H01J2237/16 ,  H01J2237/24475 ,  H01J2237/2448 ,  H01J2237/2817

摘要： An electron beam inspection device includes: a primary electron optical system that irradiates the surface of a sample with an electron beam; and a secondary electron optical system that gathers secondary electrons emitted from the sample and forms an image on the sensor surface of a detector. An electron image of the surface of the sample is obtained from a signal detected by the detector, and the sample is inspected. A cylindrical member that is formed with conductors stacked as an inner layer and an outer layer, and an insulator stacked as an intermediate layer is provided inside a lens tube into which the secondary electron optical system is incorporated. An electron orbital path is formed inside the cylindrical member, and the members constituting the secondary electron optical system are arranged outside the cylindrical member.

公开(公告)号：US09406480B2

公开(公告)日：2016-08-02

申请号：US14596447

申请日：2015-01-14

申请人： EBARA CORPORATION

发明人： Nobuharu Noji ,  Tohru Satake ,  Hirosi Sobukawa ,  Toshifumi Kimba ,  Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Kenichi Suematsu ,  Yutaka Tabe ,  Ryo Tajima ,  Keiichi Tohyama

IPC分类号： H01J37/28 ,  G01N23/22 ,  G01N23/225 ,  H01J37/20 ,  H01J37/05 ,  H01L21/683

CPC分类号： H01J37/20 ,  G01N23/2204 ,  G01N23/225 ,  H01J37/05 ,  H01J37/28 ,  H01J2237/202 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2801 ,  H01J2237/2817 ,  H01L21/6833 ,  H01L2223/54466

摘要： A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.

公开(公告)号：US08946631B2

公开(公告)日：2015-02-03

申请号：US14156140

申请日：2014-01-15

申请人： Ebara Corporation

发明人： Nobuharu Noji ,  Tohru Satake ,  Hirosi Sobukawa ,  Toshifumi Kimba ,  Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Kenichi Suematsu ,  Yutaka Tabe ,  Ryo Tajima ,  Keiichi Tohyama

IPC分类号： G01N23/225 ,  H01J37/28 ,  H01L21/683

CPC分类号： H01J37/20 ,  G01N23/2204 ,  G01N23/225 ,  H01J37/05 ,  H01J37/28 ,  H01J2237/202 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2801 ,  H01J2237/2817 ,  H01L21/6833 ,  H01L2223/54466

摘要： A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.

摘要翻译： 用一次电子照射衬底，由检测器检测由衬底产生的二次电子。 将参考管芯放置在平台上以获得包括参考管芯的特征坐标的模式匹配模板图像。 使用模板图像，使用包含基准管芯的行或列中的任意管芯进行图案匹配，以获得任意管芯的特征坐标。 基于任意模具的特征坐标和参考模具的特征坐标，在包括基准模具的行或列的方向与基板的移动方向之间计算出未对准的角度。 旋转台阶以校正未对准的角度，以使包括基准模具的行或列的方向与衬底的运动方向之一相一致。

公开(公告)号：US08796621B2

公开(公告)日：2014-08-05

申请号：US13853418

申请日：2013-03-29

申请人： Ebara Corporation

发明人： Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Kenichi Suematsu ,  Tsutomu Karimata ,  Nobuharu Noji

IPC分类号： G01N23/00 ,  G21K7/00

CPC分类号： H01J37/261 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/2441 ,  H01J2237/2446

摘要： An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12for receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors 11, 12, where the plurality of detectors 11, 12 are disposed in the same chamber MC. The plurality of detectors 11, 12 can be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector.

摘要翻译： 用于减少与用于改变检测器的工作相关联的时间损失的检查装置的特征在于包括多个检测器11,12，用于接收从样品W发射的电子束以捕获表示样品W的图像数据，以及切换机构 M，用于使电子束入射到多个检测器11,12中的一个上，其中多个检测器11,12设置在同一个室MC中。 多个检测器11,12可以是包括用于将电子束转换为电信号的电子传感器的检测器的任意组合，该检测器包括用于将电子束转换成光并将光转换成电信号的光学传感器 。 切换机构M可以是机械移动机构或电子束偏转器。

公开(公告)号：US10074510B2

公开(公告)日：2018-09-11

申请号：US14455276

申请日：2014-08-08

申请人： EBARA CORPORATION

发明人： Kenichi Suematsu ,  Shoji Yoshikawa

IPC分类号： H01J37/28 ,  H01J37/20 ,  H01J37/285

CPC分类号： H01J37/20 ,  H01J37/285 ,  H01J2237/20228

摘要： An inspection system includes a TDI sensor that integrates amounts of secondary charged particles or electromagnetic waves along a predetermined direction at every timing at which a transfer clock is inputted and sequentially transfers the amounts of secondary charged particles or electromagnetic waves so integrated, and a deflector which deflects, based on a difference between an actual position and a target position of the inspection target, the secondary charged particles or electromagnetic waves directed towards the TDI sensor in a direction in which the difference is offset. The target position is set into something like a step-and-riser shape in which the target position is kept staying in the same position by a predetermined period of time that is equal to or shorter than a period of time from an input of the transfer clock to an input of the following transfer clock and thereafter rises by a predetermined distance.

公开(公告)号：US09852878B2

公开(公告)日：2017-12-26

申请号：US14747488

申请日：2015-06-23

申请人： EBARA CORPORATION

发明人： Masahiro Hatakeyama ,  Kenichi Suematsu ,  Ryo Tajima ,  Kiwamu Tsukamoto ,  Kenji Terao ,  Shoji Yoshikawa

IPC分类号： H01J37/20 ,  H01J37/22 ,  H01J37/305 ,  H01J37/30 ,  H01J37/302 ,  H01J37/317

CPC分类号： H01J37/20 ,  H01J37/226 ,  H01J37/3005 ,  H01J37/3023 ,  H01J37/3056 ,  H01J37/3177 ,  H01J2237/24535

摘要： A surface processing apparatus is an apparatus which performs surface processing on an inspection object 20 by irradiating the inspection object with an electron beam. A surface processing apparatus includes: an electron source 10 (including lens system that controls beam shape of electron beam) which generates an electron beam; a stage 30 on which an inspection object 20 to be irradiated with the electron beam is set; and an optical microscope 110 for checking a position to be irradiated with the electron beam. The current value of the electron beam which irradiates the inspection object 20 is set at 10 nA to 100 A.

公开(公告)号：US09105445B2

公开(公告)日：2015-08-11

申请号：US14220719

申请日：2014-03-20

申请人： EBARA CORPORATION

发明人： Ryo Tajima ,  Kenichi Suematsu ,  Shoji Yoshikawa

IPC分类号： H01J37/26 ,  H01J37/22 ,  H01J37/244 ,  H01J37/285

CPC分类号： H01J37/222 ,  H01J37/244 ,  H01J37/265 ,  H01J37/285

摘要： An inspection system includes a primary optical system configured to irradiate a charged particle or an electromagnetic wave as a beam, a movable unit configured to hold an inspection target and move the target through a position where the beam is irradiated, and a TDI sensor configured to integrate an amount of secondary charged particles in a predetermined direction to sequentially transfer the integrated amount. The secondary charged particles are obtained by irradiating the beam onto the target while moving the movable unit in the predetermined direction. The inspection system further includes a prevention module configured to prevent an arrival of the beam at the target side or an arrival of the secondary charged particles at the TDI sensor during a time period from one transfer to the following transfer after the elapse of a predetermined length of time from the one transfer and until the following transfer.

摘要翻译： 检查系统包括被配置为照射带电粒子或作为光束的电磁波的主光学系统，被配置为保持检查目标并将目标移动通过射束的位置的移动单元，以及被配置为 在预定方向上积分一定量的二次带电粒子以顺序地转移积分量。 通过在沿着预定方向移动可移动单元的同时将光束照射到目标物上而获得二次带电粒子。 所述检查系统还包括防止模块，所述防止模块被配置为在经过预定长度之后的一次转移到后续转移的时间段期间防止所述束到达所述目标侧或所述二次带电粒子到达所述TDI传感器 的时间从一次转移到下一次转移。

公开(公告)号：US20150122993A1

公开(公告)日：2015-05-07

申请号：US14596447

申请日：2015-01-14

申请人： EBARA CORPORATION

发明人： Nobuharu Noji ,  Tohru Satake ,  Hirosi Sobukawa ,  Toshifumi Kimba ,  Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Kenichi Suematsu ,  Yutaka Tabe ,  Ryo Tajima ,  Keiichi Tohyama

IPC分类号： H01J37/20 ,  G01N23/22

CPC分类号： H01J37/20 ,  G01N23/2204 ,  G01N23/225 ,  H01J37/05 ,  H01J37/28 ,  H01J2237/202 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2801 ,  H01J2237/2817 ,  H01L21/6833 ,  H01L2223/54466

摘要： A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.

摘要翻译： 用一次电子照射衬底，由检测器检测由衬底产生的二次电子。 将参考管芯放置在平台上以获得包括参考管芯的特征坐标的模式匹配模板图像。 使用模板图像，使用包含基准管芯的行或列中的任意管芯进行图案匹配，以获得任意管芯的特征坐标。 基于任意模具的特征坐标和参考模具的特征坐标，在包括基准模具的行或列的方向与基板的移动方向之间计算出未对准的角度。 旋转台阶以校正未对准的角度，以使包括基准模具的行或列的方向与衬底的移动方向之一相一致。

公开(公告)号：US10446404B2

公开(公告)日：2019-10-15

申请号：US15873108

申请日：2018-01-17

申请人： EBARA CORPORATION

发明人： Ryo Tajima ,  Masahiro Hatakeyama ,  Kenichi Suematsu ,  Kiwamu Tsukamoto ,  Kenji Watanabe ,  Shoji Yoshikawa ,  Shinichi Okada ,  Kenji Terao

IPC分类号： H01L37/00 ,  H01L21/3065 ,  H01J37/147 ,  H01J37/305 ,  H01J37/302 ,  H01L21/027

摘要： Provided is a method of adjusting an electron-beam irradiated area in an electron beam irradiation apparatus that deflects an electron beam with a deflector to irradiate an object with the electron beam, the method including: emitting an electron beam while changing an irradiation position on an adjustment plate by controlling the deflector in accordance with an electron beam irradiation recipe, the adjustment plate detecting a current corresponding to the emitted electron beam; acquiring a current value detected from the adjustment plate; forming image data corresponding to the acquired current value; determining whether the electron-beam irradiated area is appropriate based on the formed image data; and updating the electron beam irradiation recipe when the electron-beam irradiated area is determined not to be appropriate.

公开(公告)号：US09760984B2

公开(公告)日：2017-09-12

申请号：US14680286

申请日：2015-04-07

申请人： EBARA CORPORATION

发明人： Kenichi Suematsu

IPC分类号： G01N21/88 ,  G06T7/00 ,  G01N23/225 ,  H01J37/20 ,  H01J37/28

CPC分类号： G06T7/0004 ,  G01N23/2251 ,  G01N2223/6116 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/20292 ,  H01J2237/24592

摘要： A control unit for generating a timing signal for an imaging unit in an inspection system in which an image of an inspection target object is captured by the imaging unit while the inspection target object is caused to travel in a predetermined direction includes a traveling distance determination section configured to detect a traveling distance of the inspection target object based on a count value acquired as an integer value from a laser interferometer provided in the inspection system for detecting a traveling distance of the inspection target object, and configured to determine whether the detected traveling distance reaches a threshold, and a timing signal generation section configured to generate a timing signal when it is determined that the detected traveling distance reaches the threshold. The traveling distance determination section executes the determination by using a plurality of values selectively as the threshold.