公开(公告)号：US08580070B2

公开(公告)日：2013-11-12

申请号：US11720954

申请日：2005-11-09

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Simon Jerebic ,  Michael Bauer

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Simon Jerebic ,  Michael Bauer

IPC分类号： B32B37/02

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/3512 ,  H01L2924/00

摘要： The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.

摘要翻译： 本发明涉及制造半导体的方法。 在一个实施例中，该方法包括将粘合剂层应用于半导体晶片的接地薄或薄化的半导体芯片。 在本实施例中，由可固化粘合剂组成的粘合剂层相对较早地引入用于通过半导体晶片的研磨，分离和分离来减薄的方法以形成变薄的半导体芯片，并且进一步用于半导体器件中，其中薄化半导体 芯片将被并入。

公开(公告)号：US07944061B2

公开(公告)日：2011-05-17

申请号：US11575851

申请日：2005-09-20

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

IPC分类号： H01L23/48 ,  H01L23/28

CPC分类号： H05K3/3442 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.

摘要翻译： 本发明涉及一种半导体器件，其包括通过接触件通过塑料外壳组合物及其制造方法。 为此，布线基板具有通过接触元件相对于布线基板垂直布置的焊料沉积物，并且延伸到半导体器件的顶侧。

公开(公告)号：US20080029874A1

公开(公告)日：2008-02-07

申请号：US11839740

申请日：2007-08-16

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H05K3/3426 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49811 ,  H01L24/02 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  Y02P70/613

摘要： A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.

摘要翻译： 本文描述了包括表面安装壳体的半导体部件及其制造方法。 半导体部件包括嵌入塑料外壳组合物中并布置在壳体的下侧上的引线片。 引导件的外部接触区域不含塑料外壳构成。 结构可焊接涂层布置在已经保持没有塑料外壳组合物的外部接触区域上，涂层包括多个导电和机械弹性的接触元件。

公开(公告)号：US20110155297A1

公开(公告)日：2011-06-30

申请号：US11720954

申请日：2005-11-09

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Simon Jerebic ,  Michael Bauer

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Simon Jerebic ,  Michael Bauer

IPC分类号： B32B37/02 ,  B32B38/00 ,  B32B38/10 ,  C23F1/00

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/3512 ,  H01L2924/00

摘要： The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.

摘要翻译： 本发明涉及制造半导体的方法。 在一个实施例中，该方法包括将粘合剂层应用于半导体晶片的接地薄或薄化的半导体芯片。 在本实施例中，由可固化粘合剂组成的粘合剂层相对较早地引入用于通过半导体晶片的研磨，分离和分离来减薄的方法以形成变薄的半导体芯片，并且进一步用于半导体器件中，其中薄化半导体 芯片将被并入。

公开(公告)号：US07713791B2

公开(公告)日：2010-05-11

申请号：US11437304

申请日：2006-05-19

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49002 ,  Y10T29/49014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top side of a wiring substrate. The wiring substrate is covered by a plastic packaging compound in a plurality of semiconductor device positions, the rear sides of the semiconductor chips being fixed on the wiring substrate. A plastic packaging compound in the region of the boundary surfaces with the semiconductor chips has a coefficient of thermal expansion which is matched to that of silicon, while the remaining plastic packaging compound has a coefficient of thermal expansion which is matched to that of the wiring substrate and is therefore correspondingly higher.

摘要翻译： 本发明涉及包括具有半导体芯片的复合板和塑料封装化合物的面板和半导体器件及其制造方法。 为此，具有复合板的面板具有在布线基板的上侧排成行和列的半导体芯片。 布线基板被多个半导体器件位置中的塑料封装化合物覆盖，半导体芯片的背面固定在布线基板上。 在与半导体芯片的边界区域的区域中的塑料封装化合物具有与硅的热膨胀系数相匹配的剩余塑料封装化合物的热膨胀系数与布线基板的热膨胀系数相匹配 因此相应地更高。

公开(公告)号：US07663218B2

公开(公告)日：2010-02-16

申请号：US11839740

申请日：2007-08-16

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC分类号： H01L23/48

CPC分类号： H05K3/3426 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49811 ,  H01L24/02 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  Y02P70/613

摘要： A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.

摘要翻译： 本文描述了包括表面安装壳体的半导体部件及其制造方法。 半导体部件包括嵌入塑料外壳组合物中并布置在壳体的下侧上的引线片。 引导件的外部接触区域不含塑料外壳构成。 结构可焊接涂层布置在已经保持没有塑料外壳组合物的外部接触区域上，涂层包括多个导电和机械弹性的接触元件。

公开(公告)号：US20080315399A1

公开(公告)日：2008-12-25

申请号：US11575851

申请日：2005-09-20

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

IPC分类号： H01L23/04 ,  H01L21/00

CPC分类号： H05K3/3442 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.

摘要翻译： 本发明涉及一种半导体器件，其包括通过接触件通过塑料外壳组合物及其制造方法。 为此，布线基板具有通过接触元件相对于布线基板垂直布置的焊料沉积物，并且延伸到半导体器件的顶侧。

公开(公告)号：US20060265860A1

公开(公告)日：2006-11-30

申请号：US11437304

申请日：2006-05-19

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC分类号： H01S4/00 ,  H01L39/24

CPC分类号： H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49002 ,  Y10T29/49014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top side of a wiring substrate. The wiring substrate is covered by a plastic packaging compound in a plurality of semiconductor device positions, the rear sides of the semiconductor chips being fixed on the wiring substrate. A plastic packaging compound in the region of the boundary surfaces with the semiconductor chips has a coefficient of thermal expansion which is matched to that of silicon, while the remaining plastic packaging compound has a coefficient of thermal expansion which is matched to that of the wiring substrate and is therefore correspondingly higher.

摘要翻译： 本发明涉及包括具有半导体芯片的复合板和塑料封装化合物的面板和半导体器件及其制造方法。 为此，具有复合板的面板具有在布线基板的上侧排成行和列的半导体芯片。 布线基板被多个半导体器件位置中的塑料封装化合物覆盖，半导体芯片的背面固定在布线基板上。 在与半导体芯片的边界区域的区域中的塑料封装化合物具有与硅的热膨胀系数相匹配的剩余塑料封装化合物的热膨胀系数与布线基板的热膨胀系数相匹配 因此相应地更高。

公开(公告)号：US20070052112A1

公开(公告)日：2007-03-08

申请号：US10565259

申请日：2005-05-17

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

IPC分类号： H01L23/48

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49805 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K2201/0108 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： The invention relates to a support (4) with solder ball elements (1) for loading substrates (2) with ball contacts. Furthermore, the invention relates to a system for loading substrates (2) with ball contacts and to a method for loading substrates (2) with ball contacts. For this purpose, the support (4) has a layer of adhesive (5) applied on one side, the layer of adhesive (5) losing its adhesive force to the greatest extent when irradiated. Furthermore, the support (4) has solder ball elements (1), which are arranged closely packed in rows (6) and columns (7) on the layer of adhesive (5) in a prescribed pitch (w) for a semiconductor chip or a semiconductor component.

摘要翻译： 本发明涉及一种具有用于加载具有球接触件的基板（2）的焊球元件（1）的支撑件（4）。 此外，本发明涉及一种用于装载具有球接触件的基板（2）的系统以及用于将基板（2）与球接触件一起加载的方法。 为此，支撑体（4）具有一侧施加的粘合剂层（5），当照射时，粘合剂层（5）最大程度地失去其粘合力。 此外，支撑件（4）具有焊料球元件（1），其以规定的用于半导体芯片的间距（w）紧密地排列在粘合剂层（5）上的行（6）和列（7）中，或 半导体元件。

公开(公告)号：US07545047B2

公开(公告)日：2009-06-09

申请号：US11593150

申请日：2006-11-06

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

IPC分类号： H01L29/40

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.

摘要翻译： 这里描述了具有布线基板作为半导体器件堆叠的堆叠元件的半导体器件。 布线基板包括第一塑料化合物的塑料框架和第二塑料化合物的中心区域。 半导体芯片的后侧和其边缘侧嵌入第二塑料化合物中，半导体器件的有源上侧与第一和第二塑料化合物在共面区域中。