公开(公告)号：US5896651A

公开(公告)日：1999-04-27

申请号：US713174

申请日：1996-09-12

Applicant: Emily Hawthorne

Inventor： Emily Hawthorne

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/495 ,  H05K1/02 ,  H05K3/30

CPC classification number: H01L23/3675 ,  H01L23/16 ,  H01L23/32 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2924/14 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

公开(公告)号：US5898575A

公开(公告)日：1999-04-27

申请号：US710573

申请日：1996-09-19

Applicant: Emily Hawthorne ,  John McCormick

Inventor： Emily Hawthorne ,  John McCormick

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/40 ,  H01L23/495 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K3/30 ,  H05K7/10 ,  H05K7/02

CPC classification number: H05K3/301 ,  H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/49572 ,  H01L25/105 ,  H01L25/117 ,  H05K3/303 ,  H05K7/1061 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/49171 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10681 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board. The arrangement enables transfer of force applied to the heat spreader directly to the circuit board, thereby isolating the die, thin substrate and its fragile free leads from forces applied to the die and/or the heat spreader.

Abstract translation: 承载多个导电引线的薄介电基片具有由基板限定的孔，其中定位有具有焊盘的管芯，该焊盘接合到由衬底承载的引线的端部并突出到与管芯焊盘接触的孔中。 引线包括自由的外端，其横向向外和向下突出离开基板的平面，以连接到电路板上的接触焊盘。 在通过薄的自支撑导热散热器连接到电路板上之后，自由导线与带组件上的芯片之间的压力隔离开，该散热器接触与其焊盘相对的模具的侧面并且包括固定的支架 /或延伸穿过薄基板中的对准孔并与印刷电路板的冲浪物理接触的定位销。 该布置使得能够将施加到散热器的力直接传递到电路板，从而将模具，薄基板及其脆弱的自由导线与施加到模具和/或散热器的力隔离。

公开(公告)号：US6008991A

公开(公告)日：1999-12-28

申请号：US903241

申请日：1997-07-24

Applicant: Emily Hawthorne ,  John McCormick

Inventor： Emily Hawthorne ,  John McCormick

IPC: H01L23/367 ,  H01L23/495 ,  H01L25/10 ,  H05K7/20

CPC classification number: H01L23/3672 ,  H01L23/3677 ,  H01L23/49572 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002

Abstract: An electronic system such as a Board-Level-Product (BLP) includes at least one integrated circuit device which is mounted on a circuit board. Each integrated circuit device includes a thin dielectric substrate bearing a plurality of conductive leads and has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on the circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surface of the printed circuit board. The arrangement enables transfer of force applied to the heat spreader directly to the circuit board, thereby isolating the die, thin substrate and its fragile free leads from forces applied to the die and/or the heat spreader.

Abstract translation: 诸如板级产品（BLP）的电子系统包括安装在电路板上的至少一个集成电路装置。 每个集成电路器件包括一个承载多个导电引线的薄电介质基片，并具有一个由衬底外接的孔，其中定位有一个管芯，该管芯具有焊盘，该焊盘与由衬底承载的引线的端部接合并突出到与孔接触的孔中 模具垫。 引线包括自由的外端，其横向向外和向下突出于基板的平面，用于连接到电路板上的接触焊盘。 在通过薄的自支撑导热散热器将其连接到电路板上之后，将自由导线与施加到带组件上的芯片的压力隔离开，所述散热器与模具相对的侧面接触，并且包括固定支架 /或延伸穿过薄基板中的对准孔并与印刷电路板的表面物理接触的定位销。 该布置使得能够将施加到散热器的力直接传递到电路板，从而将模具，薄基板及其脆弱的自由导线与施加到模具和/或散热器的力隔离。

公开(公告)号：US5410451A

公开(公告)日：1995-04-25

申请号：US170102

申请日：1993-12-20

Applicant: Emily Hawthorne ,  John McCormick

Inventor： Emily Hawthorne ,  John McCormick

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/40 ,  H01L23/495 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K3/30 ,  H05K7/10 ,  H05K7/02

CPC classification number: H05K3/301 ,  H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/49572 ,  H01L25/105 ,  H01L25/117 ,  H05K3/303 ,  H05K7/1061 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/49171 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10681 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surface of the printed circuit board. The arrangement enables transfer of force applied to the heat spreader directly to the circuit board, thereby isolating the die, thin substrate and its fragile free leads from forces applied to the die and/or the heat spreader.

Abstract translation: 承载多个导电引线的薄介电基片具有由基板限定的孔，其中定位有具有焊盘的管芯，该焊盘接合到由衬底承载的引线的端部并突出到与管芯焊盘接触的孔中。 引线包括自由的外端，其横向向外和向下突出离开基板的平面，以连接到电路板上的接触焊盘。 在通过薄的自支撑导热散热器连接到电路板上之后，自由导线与带组件上的芯片之间的压力隔离开，该散热器接触与其焊盘相对的模具的侧面并且包括固定的支架 /或延伸穿过薄基板中的对准孔并与印刷电路板的表面物理接触的定位销。 该布置使得能够将施加到散热器的力直接传递到电路板，从而将模具，薄基板及其脆弱的自由导线与施加到模具和/或散热器的力隔离。

公开(公告)号：US5923538A

公开(公告)日：1999-07-13

申请号：US646037

申请日：1996-05-07

Applicant: Emily Hawthorne

Inventor： Emily Hawthorne

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/495 ,  H05K1/02 ,  H01R5/09 ,  H05K7/02

CPC classification number: H01L23/3675 ,  H01L23/16 ,  H01L23/32 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2924/14 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

公开(公告)号：US5673479A

公开(公告)日：1997-10-07

申请号：US323817

申请日：1994-10-17

Applicant: Emily Hawthorne

Inventor： Emily Hawthorne

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/40 ,  H01L23/495 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K3/30 ,  H05K7/10 ,  H05K3/34

CPC classification number: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/49572 ,  H01L25/105 ,  H01L25/117 ,  H05K3/303 ,  H05K7/1061 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/49171 ,  H01L2225/1029 ,  H01L2225/1094 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/14 ,  H01L2924/1532 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10681 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。