公开(公告)号：US5793203A

公开(公告)日：1998-08-11

申请号：US567278

申请日：1995-12-05

申请人： Eriko Takeda ,  Toshikazu Nishino ,  Masahiro Otaka ,  Ren Morinaka ,  Fuminobu Takahashi

发明人： Eriko Takeda ,  Toshikazu Nishino ,  Masahiro Otaka ,  Ren Morinaka ,  Fuminobu Takahashi

IPC分类号： G01R33/035 ,  G01N27/82 ,  G01R33/12 ,  G21C17/003

CPC分类号： G01N27/82 ,  Y10S505/846

摘要： A measurement system for measuring material deterioration in accordance with a magnetic field of the material in the presence of radiation. The measurement system includes a detection circuit which detects a magnetic field of the material and generates a signal indicative thereof which signal includes noise due to the radiation, a signal processing circuit including semiconductor devices to process the signal generated from the detection circuit and a noise reducing circuit for at least reducing noise in the generated signal which is due to the radiation. The signal processing circuit is installed at a place where a dose equivalent of radiation is equal to or smaller than that of a place where the detection circuit is installed.

摘要翻译： 一种用于在存在辐射的情况下根据材料的磁场测量材料劣化的测量系统。 该测量系统包括一个检测电路，该检测电路检测该材料的磁场，并产生一个指示该信号的信号，该信号包括由于该辐射引起的噪声;一信号处理电路，包括用于处理从该检测电路产生的信号的半导体器件和一降噪 电路，用于至少降低由于辐射而产生的信号中的噪声。 信号处理电路安装在等离子体的剂量等于或小于安装检测电路的地方。

公开(公告)号：US5646526A

公开(公告)日：1997-07-08

申请号：US356495

申请日：1994-12-15

申请人： Eriko Takeda ,  Toshikazu Nishino

发明人： Eriko Takeda ,  Toshikazu Nishino

IPC分类号： G01R33/035 ,  G01R33/02 ,  H03M1/12

CPC分类号： G01R33/0354 ,  Y10S505/846

摘要： A Josephson signal detector is presented which includes (1) a sensor with at least one Josephson junction (e.g., a SQUID) and (2) a comparator (e.g., an analog-to-digital converter); a measurement system using such detector; and a method of using such detector and measurement system. The detector can be, e.g., a digital SQUID. The detector can also include a readout circuit for reading out the output of the comparator. In one aspect of the invention, the sensor, or both the sensor and readout circuit, are powered by a DC current source. Through use of the DC current source, it is possible to provide, e.g., a digital SQUID, having reduced crosstalk and reduced fluctuation of ground potential, and which is kept from an increase in noise or a miss operation.

摘要翻译： 提出了约瑟夫逊信号检测器，其包括（1）具有至少一个约瑟夫逊结（例如，SQUID）的传感器和（2）比较器（例如，模数转换器）; 使用这种检测器的测量系统; 以及使用这种检测器和测量系统的方法。 检测器可以是例如数字SQUID。 检测器还可以包括用于读出比较器的输出的读出电路。 在本发明的一个方面，传感器或传感器和读出电路都由DC电流源供电。 通过使用DC电流源，可以提供例如数字SQUID，其具有减少的串扰和减小地电势的波动，并且防止噪声或错误操作的增加。

公开(公告)号：US07362576B2

公开(公告)日：2008-04-22

申请号：US11076938

申请日：2005-03-11

申请人： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

发明人： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

IPC分类号： H05K7/20

CPC分类号： H01L23/345 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/062 ,  H01L2924/00012

摘要： In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the first chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

摘要翻译： 在紧凑型射频模块中，第一芯片形成加热元件，第二芯片形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件。 多层基板具有多个电介质层和多个导体层，并且机械地支撑第一芯片和第二芯片，其中一些导体层与这些芯片电连接。 该模块可以在整个模块中传导第一芯片产生的热量; 将第一芯片产生的热量从模块的顶面引导到其底面; 并且将来自第一芯片的第一导体图案的热传导中断到放置第二芯片的第二导体图案。

公开(公告)号：US20060250182A1

公开(公告)日：2006-11-09

申请号：US11334451

申请日：2006-01-19

申请人： Eriko Takeda ,  Akira Kuriyama ,  Tatemi Ido

发明人： Eriko Takeda ,  Akira Kuriyama ,  Tatemi Ido

IPC分类号： H03G3/20

CPC分类号： H03F1/0277 ,  H03F1/0205 ,  H03F3/211 ,  H03F3/24 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/294 ,  H03G1/0088

摘要： A radio frequency circuit apparatus and a radio frequency module which permit alleviation of the PA efficiency drop and are compatible with both a MIMO system and a conventional system are to be provided. They are provided with a plurality of power amplifiers for amplifying a transmit signal and the plurality of power amplifiers include at least two power amplifiers differing in maximum output power from each other, and at least one out of the plurality of power amplifiers is used according to the communication system.

摘要翻译： 提供一种射频电路装置和射频模块，其能够缓解PA效率下降并与MIMO系统和常规系统兼容。 它们设置有用于放大发射信号的多个功率放大器，并且多个功率放大器包括彼此最大输出功率不同的至少两个功率放大器，并且根据多个功率放大器中的至少一个功率放大器根据 通信系统。

公开(公告)号：US20050151240A1

公开(公告)日：2005-07-14

申请号：US11076938

申请日：2005-03-11

申请人： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

发明人： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

IPC分类号： H01L23/12 ,  H01L23/34 ,  H01L23/367 ,  H01L25/04 ,  H01L25/18 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03

CPC分类号： H01L23/345 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/062 ,  H01L2924/00012

摘要： In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the first chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

摘要翻译： 在紧凑型射频模块中，第一芯片形成加热元件，第二芯片形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件。 多层基板具有多个电介质层和多个导体层，并且机械地支撑第一芯片和第二芯片，其中一些导体层与这些芯片电连接。 该模块可以在整个模块中传导第一芯片产生的热量; 将第一芯片产生的热量从模块的顶面引导到其底面; 并且将来自第一芯片的第一导体图案的热传导中断到放置第二芯片的第二导体图案。

公开(公告)号：US07848714B2

公开(公告)日：2010-12-07

申请号：US11334451

申请日：2006-01-19

申请人： Eriko Takeda ,  Akira Kuriyama ,  Tatemi Ido

发明人： Eriko Takeda ,  Akira Kuriyama ,  Tatemi Ido

IPC分类号： H01Q11/12 ,  H04B1/04

CPC分类号： H03F1/0277 ,  H03F1/0205 ,  H03F3/211 ,  H03F3/24 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/294 ,  H03G1/0088

摘要： A radio frequency circuit apparatus and a radio frequency module which permit alleviation of the PA efficiency drop and are compatible with both a MIMO system and a conventional system are to be provided. They are provided with a plurality of power amplifiers for amplifying a transmit signal and the plurality of power amplifiers include at least two power amplifiers differing in maximum output power from each other, and at least one out of the plurality of power amplifiers is used according to the communication system.

摘要翻译： 提供一种射频电路装置和射频模块，其能够缓解PA效率下降并与MIMO系统和常规系统兼容。 它们设置有用于放大发射信号的多个功率放大器，并且多个功率放大器包括彼此最大输出功率不同的至少两个功率放大器，并且根据多个功率放大器中的至少一个功率放大器根据 通信系统。

公开(公告)号：US06889431B2

公开(公告)日：2005-05-10

申请号：US10078448

申请日：2002-02-21

申请人： Hiroshi Okabe ,  Hirozi Yamada ,  Eriko Takeda ,  Kazunori Yamamoto ,  Hiroyuki Kuriya ,  Masanori Yamaguchi ,  Kazuhisa Otsuka ,  Yoshitaka Hirata ,  Yasushi Shimada

发明人： Hiroshi Okabe ,  Hirozi Yamada ,  Eriko Takeda ,  Kazunori Yamamoto ,  Hiroyuki Kuriya ,  Masanori Yamaguchi ,  Kazuhisa Otsuka ,  Yoshitaka Hirata ,  Yasushi Shimada

IPC分类号： H01G4/33 ,  H01L21/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/16 ,  H05K3/42 ,  H05K3/46 ,  H05K3/02

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/162 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/0338 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a manufacturing method of an electronic circuit device including a multi-layer circuit board incorporated with a thin film capacitor small in size and of high performance capable of attaining higher capacitance value with a thin dielectric film of high dielectric constant and with favorable film quality. A first electrode layer and a thin film dielectric layer are laminated continuously in this order in one identical to laminate each of the layers on a leveled substrate in one identical chamber and then the first electrode layer is fabricated a conductor pattern.

摘要翻译： 本发明提供一种电子电路器件的制造方法，该电子电路器件包括多层电路板，该多层电路板结合有小型和高性能的薄膜电容器，能够用高介电常数的薄电介质膜获得较高的电容值 电影质量。 将第一电极层和薄膜电介质层依次层叠在一个相同的层中，在一个相同的室中的层叠基板上层叠，然后将第一电极层制成导体图案。

公开(公告)号：US06879488B2

公开(公告)日：2005-04-12

申请号：US10302813

申请日：2002-11-25

申请人： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

发明人： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

IPC分类号： H01L23/12 ,  H01L23/34 ,  H01L23/367 ,  H01L25/04 ,  H01L25/18 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05H7/20

CPC分类号： H01L23/345 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/062 ,  H01L2924/00012

摘要： In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

摘要翻译： 在紧凑型射频模块中，第一芯片形成加热元件，第二芯片形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件。 多层基板具有多个电介质层和多个导体层，并机械地支撑第一芯片和第二芯片，其中一些导体层与这些芯片电连接。 该模块可以在整个模块中传导第一芯片产生的热量; 将第一芯片产生的热量从模块的顶面引导到其底面; 并且将来自第一芯片的第一导体图案的热传导中断到放置第二芯片的第二导体图案。

公开(公告)号：US06952565B1

公开(公告)日：2005-10-04

申请号：US10110345

申请日：1999-10-13

申请人： Eriko Takeda ,  Kiichi Yamashita ,  Kenji Sekine ,  Ken Takei

发明人： Eriko Takeda ,  Kiichi Yamashita ,  Kenji Sekine ,  Ken Takei

IPC分类号： H04B1/3822 ,  H04B1/40

CPC分类号： H04B1/40

摘要： The present invention provides a communication terminal that enables precise communications with optimum receive sensitivity at any time regardless of any change in peripheral environments of an antenna thereof. The communication terminal including means for transmitting and receiving radio waves is provided with a training mechanism for enabling the communication terminal itself to conduct training mode for tuning receive sensitivity, and switching mechanism for switching between normal communication mode and the training mode. The communication terminal is particularly useful as a communication terminal for automobile in the Intelligent Transport System or the like.

摘要翻译： 本发明提供了一种通信终端，其能够在任何时候实现具有最佳接收灵敏度的精确通信，而不管其天线的外围环境如何变化。 通信终端包括用于发送和接收无线电波的装置，设置有用于使通信终端本身能够进行用于调整接收灵敏度的训练模式的训练机制，以及用于在正常通信模式和训练模式之间切换的切换机制。 通信终端在智能交通系统等中作为汽车的通信终端特别有用。

公开(公告)号：US06639559B2

公开(公告)日：2003-10-28

申请号：US10082092

申请日：2002-02-26

申请人： Hiroshi Okabe ,  Eriko Takeda ,  Hiroyuki Aoyama ,  Keiko Kikuchi

发明人： Hiroshi Okabe ,  Eriko Takeda ,  Hiroyuki Aoyama ,  Keiko Kikuchi

IPC分类号： H01Q138

CPC分类号： H01Q9/0414 ,  H01Q1/243 ,  H01Q1/36 ,  H01Q1/38

摘要： To provide an antenna element having a radiation electrode formed mainly on one surface of a dielectric substrate. The radiation electrode is substantially symmetric in form with respect to the center thereof, and has a first half and a second half with the same direction of main polarization of radiation emitted therefrom. Each of the halves of the radiation electrode may be a quarter-wave antenna for a wavelength of the emitted radiation. A power supply conductor to be connected to a high frequency signal source is connected to the first half of the radiation electrode, and a ground conductor to be connected to a ground is connected to the second half. A total impedance of the first half of the radiation electrode and the power supply conductor and a total impedance of the second half of the radiation electrode and the ground conductor can substantially match to one another, so that resonance between the halves of the radiation electrode can be enhanced and a wider bandwidth can be realized.