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公开(公告)号：US06548757B1
公开(公告)日：2003-04-15
申请号：US09649765
申请日：2000-08-28
IPC分类号： H01L2302
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49541 , H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2224/45099 , H01L2924/00
摘要： Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates. Each conductive member can have a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated conductive section connecting the bond-site to the external connector. The conductive members are generally arranged so that at least some of the bond-sites are arranged in a first row in which the bond-sites and a portion of the elongated sections are spaced apart from one other by a first gap width. The support structure can more specifically include a first conductive member having a first bond-site coupled to the Vref bond-pad by a first wire-bond line and a second conductive member having a second bond-site coupled to the signal bond-pad by a second wire-bond line. The first bond-site of the first conductive member can be spaced apart from the second bond-site of the second conductive member by a second gap width greater than the first gap width.
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公开(公告)号：US06784367B2
公开(公告)日：2004-08-31
申请号：US10374449
申请日：2003-02-25
IPC分类号： H01L2302
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49541 , H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2224/45099 , H01L2924/00
摘要： Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates. Each conductive member can have a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated conductive section connecting the bond-site to the external connector. The conductive members are generally arranged so that at least some of the bond-sites are arranged in a first row in which the bond-sites and a portion of the elongated sections are spaced apart from one other by a first gap width. The support structure can more specifically include a first conductive member having a first bond-site coupled to the Vref bond-pad by a first wire-bond line and a second conductive member having a second bond-site coupled to the signal bond-pad by a second wire-bond line. The first bond-site of the first conductive member can be spaced apart from the second bond-site of the second conductive member by a second gap width greater than the first gap width.
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公开(公告)号：US5231305A
公开(公告)日：1993-07-27
申请号：US495663
申请日：1990-03-19
申请人： Ernest J. Russell
发明人： Ernest J. Russell
IPC分类号： H01L23/04 , H01L23/08 , H01L23/495 , H01L23/498
CPC分类号： H01L24/06 , H01L23/49531 , H01L23/49811 , H01L23/49838 , H01L23/4985 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/49111 , H01L2224/49112 , H01L2224/49175 , H01L24/48 , H01L2924/00014 , H01L2924/01082 , H01L2924/07802 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/19107
摘要： A ceramic semiconductor package has a ceramic bridge to provide shorter bond wire lengths and other interconnections for the semiconductor device.
摘要翻译： 陶瓷半导体封装具有陶瓷桥，以为半导体器件提供较短的接合线长度和其它互连。
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公开(公告)号：US4832699A
公开(公告)日：1989-05-23
申请号：US134071
申请日：1987-12-17
申请人： M. K. Choi , Ernest J. Russell
发明人： M. K. Choi , Ernest J. Russell
CPC分类号： D06P3/241 , D06P1/65118 , Y10S8/924
摘要： Filament nylon 6 and 66 fabrics are dyed in a multi-step continuous aqueous dyeing process. Uniformly dyed fabrics having a high degree of fiber bundle penetration result.
摘要翻译： 长丝尼龙6和66织物在多步连续水性染色工艺中染色。 具有高度纤维束穿透性的均匀染色织物。
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公开(公告)号：US4749378A
公开(公告)日：1988-06-07
申请号：US906380
申请日：1986-09-12
摘要： Aramid fibers, polybenzimidazole fibers or blends of aramid and polybenzimidazole fibers are rendered flame resistant by a flame retardant introduced into the fibers by a polar organic swelling agent such as DMSO. Dyed or undyed fibers so treated exhibit substantially improved flame resistance as compared with untreated fibers.
摘要翻译： 芳族聚酰胺纤维，聚苯并咪唑纤维或芳族聚酰胺和聚苯并咪唑纤维的共混物通过极性有机溶胀剂如DMSO引入到纤维中的阻燃剂变得阻燃。 与未处理的纤维相比，如此处理的染色或未染色的纤维显示出显着改善的阻燃性。
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公开(公告)号：US5589420A
公开(公告)日：1996-12-31
申请号：US475446
申请日：1995-06-07
申请人： Ernest J. Russell
发明人： Ernest J. Russell
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L24/06 , H01L23/4951 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/73215 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14
摘要： A hybrid leadframe-over-chip (LOC) semiconductor package is generally comprised of bonding finger elements located over a surface of a semiconductor component and electrically coupled, by means of conducting wires, to the bonding pads located on the surface. In addition, at least one bonding finger is located outside the boundary of the surface of the semiconductor component. Each bonding finger located outside the boundary is coupled, by a conducting wire, to a bonding pad positioned within the boundary of the semiconductor component. In this manner, for a given semiconductor component size and for given routing and lead dimension constraints, a larger number of conducting paths can be provided between the leadframe and the semiconductor component.
摘要翻译： 混合引线框片式芯片（LOC）半导体封装通常由位于半导体部件的表面上方的接合指状元件组成，并且通过导线电耦合到位于表面上的接合焊盘。 此外，至少一个接合指状物位于半导体部件的表面的边界之外。 位于边界外部的每个接合手指通过导线耦合到位于半导体部件的边界内的接合焊盘。 以这种方式，对于给定的半导体部件尺寸和给定的布线和引线尺寸约束，可以在引线框架和半导体部件之间提供更多数量的导电路径。
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公开(公告)号：US5483024A
公开(公告)日：1996-01-09
申请号：US134035
申请日：1993-10-08
IPC分类号： H01L23/495 , H01L23/02
CPC分类号： H01L23/4951 , H01L23/49575 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/14
摘要： The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.
摘要翻译： 本发明公开了一种高密度半导体封装。 在一个实施例中，两个半导体芯片各自固定在两个引线框架中相应的一个上。 半导体芯片和引线框架被封装，其中引线框架的引线的仅一部分从封装件突出并延伸。
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公开(公告)号：US4878920A
公开(公告)日：1989-11-07
申请号：US43360
申请日：1987-04-28
IPC分类号： D06P3/24
摘要： Described is a process for continuously dyeing high tenacity nylon 6,6 fabrics including the sequential steps of applying to a high tenacity, highly crystalline nylon 6,6 fabric whose fibers have a breaking tenacity in the range of 6.0 to 10 g/denier and an aqueous dyebath containing a tinctorial amount of at least one dye. The dyed fabric is then steamed with superheated steam at atmospheric pressure and at temperatures greater than 100.degree. C., e.g., 100.degree. to 160.degree. C., for a time sufficient to fix the dye to the fabric, usually up to 3 minutes. Following steaming, the dyed fabric is washed to remove any unfixed dye, then dried.
摘要翻译： 描述了一种连续染色高韧性尼龙6,6织物的方法，其包括应用于高韧性，高度结晶的尼龙6,6织物的顺序步骤，其纤维的断裂强度在6.0至10g /旦范围内， 含有染色剂的至少一种染料的含水染液。 然后将染色的织物在大气压和大于100℃，例如100至160℃的温度下用过热蒸汽蒸煮足够的时间以将染料固定在织物上，通常至多3分钟。 蒸汽后，洗涤染色的织物以除去任何未固定的染料，然后干燥。
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9.发明授权公开(公告)号：US06268643B1
公开(公告)日：2001-07-31
申请号：US09205566
申请日：1998-12-04
申请人： Ernest J. Russell
发明人： Ernest J. Russell
IPC分类号： H01L23495
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49541 , H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/48245 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/49433 , H01L2924/00014 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2224/45099 , H01L2924/00 , H01L2224/85399
摘要： A method and apparatus for delivering electrical power to a semiconductor die is provided in which a metal frame (104) is applied to the top surface of a semiconductor die. The metal frame include two voltages leads (106, 108), each adjacent to each series of bond pads (116) formed on the top surface of the semiconductor die. Each voltage lead includes a longitudinal portion (122) adjacent bond pads (116) in the center of the semiconductor die and corner portions (124) or arm portions (125) adjacent bond pads (116) located in the quadrants (114) of the semiconductor die.
摘要翻译： 提供了一种向半导体管芯输送电力的方法和装置，其中将金属框架（104）施加到半导体管芯的顶表面。 金属框架包括两个电压引线（106,108），每个电压引线邻近形成在半导体管芯的顶表面上的每一系列接合焊盘（116）。 每个电压引线包括在半导体管芯的中心附近的接合焊盘（116）的相邻的纵向部分（122）和与位于所述半导体管芯的象限（114）中的接合焊盘（116）相邻的拐角部分（124）或臂部分（125） 半导体芯片。
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公开(公告)号：US5637828A
公开(公告)日：1997-06-10
申请号：US483676
申请日：1995-06-07
IPC分类号： H01L23/495 , H01L23/28
CPC分类号： H01L23/4951 , H01L23/49575 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/14
摘要： The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.
摘要翻译： 本发明公开了一种高密度半导体封装。 两个半导体芯片各自固定在两个引线框架中相应的一个上。 半导体芯片和引线框架被封装，其中引线框架的引线的仅一部分从封装突出并延伸。
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