摘要:
Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising a polymerizable monomer (Ax) having a substituent having an aromatic group and having a molecular weight of 100 or more, and a photopolymerization initiator.
摘要:
Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising at least one kind of polymerizable monomer selected from the following compounds and a photopolymerization initiator;
摘要:
There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein, and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.
摘要:
Provided is a photosensitive resin composition having high sensitivity and storage stability. The photosensitive resin composition comprises (A) a polymer component including a polymer satisfying at least one of (1) and (2) below: (1) a polymer comprising (a1) a structural unit containing a group in which an acid group is protected by an acid-dissociable group, and (a2) a structural unit containing a crosslinkable group, and (2) a polymer comprising (a1) a structural unit containing a group in which an acid group is protected by an acid-dissociable group, and a polymer comprising (a2) a structural unit containing a crosslinkable group; (B) a compound represented by formula (I) below; and (C) a solvent;
摘要:
An object is to provide a photosensitive composition capable of obtaining a cured film having excellent reliability even when being heated at a low temperature and patterning by photolithography.A photosensitive composition of the present invention includes a polymerizable monomer having three or more (meth)acryloyl groups and one or more carboxy groups in a molecule as Component A, a polymerizable monomer having three or more (meth)acryloyl groups and not having a carboxy group in a molecule as Component B, a photopolymerization initiator as Component C, a solvent as Component D, a blocked isocyanate compound as Component N, and a polymerization inhibitor as Component K, in which a content of Component A is 10% to 50% by mass with respect to a total content of Component A and Component B.
摘要:
Disclosed is a photosensitive resin composition comprising: (Component A) an oxime sulfonate compound represented by Formula (1); (Component B) a resin comprising a constituent unit having an acid-decomposable group that is decomposed by an acid to form a carboxyl group or a phenolic hydroxy group; and (Component C) a solvent wherein in Formula (1) R1 denotes an alkyl group, an aryl group, or a heteroaryl group, each R2 independently denotes a hydrogen atom, an alkyl group, an aryl group, or a halogen atom, Ar1 denotes an o-arylene group or an o-heteroarylene group, X denotes O or S, and n denotes 1 or 2, provided that of two or more R2s present in the compound, at least one denotes an alkyl group, an aryl group, or a halogen atom.