Semiconductor device having metallic interconnects formed by grit
blasting
    3.
    发明授权
    Semiconductor device having metallic interconnects formed by grit blasting 失效
    具有通过喷砂形成的金属互连的半导体装置

    公开(公告)号:US5170245A

    公开(公告)日:1992-12-08

    申请号:US653978

    申请日:1991-02-11

    摘要: This invention relates to a ceramic module and to methods for forming protruding, upstanding electrically conducting pins by the selective abrasion of a surface 18 of a multilayered ceramic module 10. An abrasive blasting device 40 is disposed adjacent to the surface 18 for directing a stream of abrasive particles 42 against the surface. The particles 42 strike both metallic conductors 20 and 22 and also the ceramic material of the layer 14. Inasmuch as the ceramic material is relatively hard and brittle as compared to the ductile metallic conductors the abrasive particles 42 abrade away the ceramic layer 14 at a faster rate than the ductile metallic material of the conductors 20 and 22. The abrasive particles 42 may be comprised of any suitable abrasive, such as Al.sub.2 O.sub.3, SiC or WC. The module may be rotated beneath a nozzle of the grit blasting device, the nozzle being linearly translated above the surface being abraded.

    摘要翻译: 本发明涉及一种陶瓷模块以及通过多层陶瓷模块10的表面18的选择性磨损来形成突出的,直立的导电销的方法。喷砂装置40邻近表面18设置,用于引导 研磨颗粒42抵靠表面。 颗粒42撞击金属导体20和22以及层14的陶瓷材料。由于与延性金属导体相比,陶瓷材料相对硬且脆,研磨颗粒42以更快的速度磨掉陶瓷层14 导体20和22的韧性金属材料的比率。磨料颗粒42可以由任何合适的研磨剂,例如Al 2 O 3,SiC或WC组成。 模块可以在喷砂装置的喷嘴下方旋转,喷嘴在被磨损的表面上线性平移。

    Method for providing pinhole free dielectric layers
    5.
    发明授权
    Method for providing pinhole free dielectric layers 失效
    提供无针孔电介质层的方法

    公开(公告)号:US4519851A

    公开(公告)日:1985-05-28

    申请号:US621335

    申请日:1984-06-15

    摘要: A method is taught for repairing pinholes in dielectric layers and thereby avoiding metal shorts. The method is applied after the dielectric has been deposited on a base of conductive metallurgy and involves heating the metal-dielectric layers in an oxygen ambient and thereby oxidizing any exposed metal. The metal-oxide formed in the pinhole effectively insulates the underlying metal from a subsequently deposited metal; and, hence acts to prevent metal-to-metal shorts.

    摘要翻译: 教导了一种修复电介质层中针孔的方法,从而避免金属短路。 在将电介质沉积在导电冶金基底上之后应用该方法,并且涉及在氧环境中加热金属 - 电介质层,从而氧化任何暴露的金属。 形成在针孔中的金属氧化物有效地将下面的金属与随后沉积的金属绝缘; 并因此起到防止金属对金属短路的作用。

    Method of clocking integrated circuit chips
    6.
    发明授权
    Method of clocking integrated circuit chips 失效
    时钟集成电路芯片的方法

    公开(公告)号:US5430567A

    公开(公告)日:1995-07-04

    申请号:US280025

    申请日:1994-07-25

    CPC分类号: H04B10/801 G06F1/105

    摘要: A method of clocking integrated circuit chips. A pulsed laser striking an integrated circuit module substrate is diffused through the substrate and exits the opposite surface as diffused light pulses. An integrated circuit chip mounted on the top surface of the substrate has optical receivers. The optical receivers receive pulsed energy from the diffused light pulses, converting pulsed light to electrical pulses that clock the chip.

    摘要翻译: 一种集成电路芯片时钟的方法。 冲击集成电路模块基板的脉冲激光通过基板扩散并作为漫射光脉冲离开相对表面。 安装在基板的顶表面上的集成电路芯片具有光接收器。 光接收器从扩散的光脉冲接收脉冲能量,将脉冲光转换成对芯片进行计时的电脉冲。

    Optical interconnect in optical packages using holograms
    7.
    发明授权
    Optical interconnect in optical packages using holograms 失效
    使用全息图的光学封装中的光学互连

    公开(公告)号:US5515462A

    公开(公告)日:1996-05-07

    申请号:US267334

    申请日:1994-06-28

    CPC分类号: G02B6/34 G02B6/30 G02B6/4206

    摘要: An efficient light coupling apparatus for interconnecting two optical components. Light radiation from the first optical component, for example an optical light fiber is directed onto the plane surface of the second optical component, for example a passive waveguide. The light is directed onto the second optical component at a convenient angle such that it impinges on the plane surface of the second optical component at an incident angle. An angularly selective coupling means, for example a volume hologram is located between the first and second optical components for coupling a maximum amount of the light at the incident angle.

    摘要翻译: 一种用于互连两个光学部件的高效光耦合装置。 来自第一光学部件(例如光纤光纤)的光辐射被引导到第二光学部件的平面表面,例如无源波导。 光以适当的角度被引导到第二光学部件上,使得它以入射角撞击第二光学部件的平面表面。 角度选择性耦合装置,例如体积全息图位于第一和第二光学部件之间,用于以入射角耦合最大量的光。

    Extrusion of polymer waveguides onto surfaces
    9.
    发明授权
    Extrusion of polymer waveguides onto surfaces 失效
    将聚合物波导挤出到表面上

    公开(公告)号:US5317657A

    公开(公告)日:1994-05-31

    申请号:US922267

    申请日:1992-07-30

    摘要: A waveguide structure is directly extruded onto a surface from a nozzle placed a predetermined distance above the surface and which is moved relative to the surface, preferably by means of a translation table. The predetermined distance is preferably maintained constant and the speed of relative motion regulated to achieve a uniform degree of molecular orientation within the extruded material, thus maintaining a sufficiently uniform refractive index along the axis of the waveguide. Partitions within the nozzle allow the formation of a layered waveguide or the simultaneous formation of concentric cladding or protective layers. The waveguides are advantageously formed as a curtain which is later patterned, by direct writing on the surface or between chips mounted on an electronic module.

    摘要翻译: 波导结构直接从位于表面上方预定距离的喷嘴的表面挤出,并且相对于表面移动,优选地通过平移台。 预定距离优选地保持恒定并且相对运动的速度被调节以在挤出的材料内实现均匀的分子取向程度,从而沿着波导的轴保持足够均匀的折射率。 喷嘴内的分区允许形成分层波导或同时形成同心包层或保护层。 波导有利地形成为帘幕,其通过直接写在表面上或安装在电子模块上的芯片之间而被图案化。