-
公开(公告)号：US10433447B2
公开(公告)日：2019-10-01
申请号：US15805070
申请日：2017-11-06
Applicant: FINISAR CORPORATION
Inventor： Andrei Kaikkonen , Lennart Per Olof Lundqvist , Lars-Goete Svensson , Peter Lindberg
IPC: H05K7/02 , H01S5/022 , H01S5/042 , H05K1/02 , G01J1/02 , G01J1/44 , H04B10/80 , H01S5/062 , H01S5/42 , G02B6/42
Abstract: An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.
-
公开(公告)号：US10141715B2
公开(公告)日：2018-11-27
申请号：US15411828
申请日：2017-01-20
Applicant: Finisar Corporation
Inventor： Marek Grzegorz Chacinski , Nicolae Pantazi Chitica , Hans Magnus Emil Andersson , Lennart Per Olof Lundqvist , Andrei Kaikkonen
IPC: H01S5/026 , H01S5/022 , H01S5/42 , H01S5/042 , H01S5/06 , H01L31/09 , H01L31/16 , H01S5/00 , H01S5/0683 , H01S5/183
Abstract: The present invention relates to an apparatus for damping arid monitoring emissions from a light emitting device, particularly a vertical cavity surface emitting laser (VCSEL), comprising: a semi transparent substrate, preferably glass; a light emitting device for generating light emission; a damping layer deposited on a surface of the substrate; and a pair of electrodes, each of which being in direct contact with the damping layer. The damping layer is adapted to decrease the power level of the light emission of the light emitting device by absorption, to a desired level, for instance, to a level that meets eye safety limits. In addition, the damping layer is photosensitive to the light emission of the light emitting device, thereby allowing the pair of electrodes to output an electric signal corresponding to the power level of the light emission of the light emitting device.
-
公开(公告)号：US09923636B2
公开(公告)日：2018-03-20
申请号：US15403157
申请日：2017-01-10
Applicant: Finisar Corporation
Inventor： Andrei Kaikkonen , Lennart Lundquist , Lars-Goete Svensson , Robert Smith
CPC classification number: H04B10/40 , G02B6/4274 , G02B6/4279 , G02B6/4281 , H04B10/801 , H05K1/0213 , H05K1/0225 , H05K1/0245 , H05K1/0253 , H05K1/11 , H05K2201/10121
Abstract: Disclosed embodiments relate to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate and a plurality of signal lead pairs to be coupled between said electronic unit and a front end contact region for electrically contacting said interconnect structure by said further electronic component. A ground plane layer is electrically insulated from said pairs of signal leads, wherein each pair of signal leads has a circuit connecting region for electrically contacting respective terminals of said at least one electronic unit, and wherein in a region adjacent to said terminals of said at least one electronic unit said ground plane layer has a plurality of clearances that are each allocated to one pair of signal leads and separated from a respective neighboring clearance.
-
公开(公告)号：US10790568B2
公开(公告)日：2020-09-29
申请号：US16085533
申请日：2017-03-15
Applicant: FINISAR CORPORATION
Inventor： Andrei Kaikkonen , Robert Monroe Smith , Lennart Per Olof Lundqvist , Lars-Goete Svenson , Marek Grzegorz Chacinski
IPC: H05K7/00 , H01P3/08 , H01P3/00 , H01P3/02 , H05K1/02 , H05K1/11 , H05K1/18 , H01P7/08 , H01L31/105
Abstract: A carrier layout comprising a substrate comprising a ground plane layer and a coplanar waveguide interconnect disposed onto the substrate. The coplanar waveguide interconnect comprises a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The coplanar conductors of the pair are electrically connected to each other by at least one conducting island that is isolated from the ground plane layer. The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate having a ground plane layer, the interconnect structure comprising a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The conductors of the pair are electrically connected by at least one conducting island that is isolated from the ground plane layer.
-
5.发明申请公开(公告)号：US20170150593A1
公开(公告)日：2017-05-25
申请号：US15403157
申请日：2017-01-10
Applicant: Finisar Corporation
Inventor： Andrei Kaikkonen , Lennart Lundquist , Lars-Goete Svensson , Robert Smith
CPC classification number: H04B10/40 , G02B6/4274 , G02B6/4279 , G02B6/4281 , H04B10/801 , H05K1/0213 , H05K1/0225 , H05K1/0245 , H05K1/0253 , H05K1/11 , H05K2201/10121
Abstract: Disclosed embodiments relate to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate and a plurality of signal lead pairs to be coupled between said electronic unit and a front end contact region for electrically contacting said interconnect structure by said further electronic component. A ground plane layer is electrically insulated from said pairs of signal leads, wherein each pair of signal leads has a circuit connecting region for electrically contacting respective terminals of said at least one electronic unit, and wherein in a region adjacent to said terminals of said at least one electronic unit said ground plane layer has a plurality of clearances that are each allocated to one pair of signal leads and separated from a respective neighboring clearance.
-
Patent Agency Ranking
公开(公告)号：US10659166B2
公开(公告)日：2020-05-19
申请号：US16226040
申请日：2018-12-19
Applicant: Finisar Corporation
Inventor： Nicolae Chitica , Jürgen Hauenschild , Theron Jones , David Nidelius , Lennart Lundqvist , Elisabeth Källén , Odd Steijer , Marek Chacinski , Åsa Johansson , Andrei Kaikkonen
IPC: H04B10/40 , H01S5/024 , H01S5/42 , H04B10/50 , H01S5/068 , H01S5/026 , H01S5/022 , G02B6/42 , H01S5/062
Abstract: An integrated optical transceiver, comprisinga laser component, comprising an array of VCSEL diodes formed on a laser diode substrate;a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate;a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; anda photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate;a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; andan electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant ε
-
公开(公告)号：US09998234B2
公开(公告)日：2018-06-12
申请号：US14201044
申请日：2014-03-07
Applicant: FINISAR CORPORATION
Inventor： Andrei Kaikkonen , Lennart Per Olof Lundqvist , Lars-Goete Svensson , Peter Lindberg
CPC classification number: H04B10/697 , G02B6/4249 , H04B10/40 , H05K1/0243 , H05K1/0253 , H05K2201/10121
Abstract: An optical receiver is disclosed having a dielectric non-conductive substrate. A ground plane is positioned on the dielectric non-conductive substrate. An optical signal converting photodiode is also positioned on the dielectric non-conductive substrate, and has an optical signal receiver and an electrical signal output. An electrical signal amplifier is provided having an input connected to the electrical signal output of the optical signal converting photodiode. A first opening is positioned in the ground plane and surrounds the optical signal converting photodiode. The first opening has a resonance frequency higher than a fundamental frequency such that crosstalk is reducible at the input of the electrical signal amplifier.
-
8.发明授权公开(公告)号：US09860972B2
公开(公告)日：2018-01-02
申请号：US14723662
申请日：2015-05-28
Applicant: FINISAR CORPORATION
Inventor： Andrei Kaikkonen , Doron Lapidot , Lennart Lundqvist , Lars-Gote Svensson
CPC classification number: H05K1/0218 , H05K1/0225 , H05K1/0245 , H05K1/0253 , H05K1/028 , H05K1/0306 , H05K1/09 , H05K1/11 , H05K1/14 , H05K3/368 , H05K2201/09827
Abstract: An electrical connection interface is provided. The electrical connection interface includes a first ground plane layer, a second ground plane layer, a first substrate and a second substrate. The second ground plane layer is positioned to overlap the first ground plane layer. The first substrate includes a first substrate conductive lead with a first interface region connected to and electrically insulated from the first ground plane layer. The second substrate includes a second substrate conductive lead with a second interface region connected to the first substrate conductive lead and the second ground plane layer. The second substrate conductive lead is electrically insulated from the second ground plane layer.
-
公开(公告)号：US10180588B1
公开(公告)日：2019-01-15
申请号：US16040121
申请日：2018-07-19
Applicant: Finisar Corporation
Inventor： Robert Lewen , Andrei Kaikkonen , Christopher Daunt , Marek Chacinski
Abstract: An electro-optical modulator includes a substrate comprising a first Mach-Zehnder modulator comprising a first waveguide and a second waveguide and a second Mach-Zehnder modulator comprising a first waveguide and a second waveguide. A first positive signal electrode is positioned on the substrate over the first waveguide of the first Mach-Zehnder modulator and a first negative signal electrode is positioned on the substrate over the second waveguide of the first Mach-Zehnder modulator. The first positive signal electrode and the first negative signal electrode are connected to a first differential signal input. A second positive signal electrode is positioned on the substrate over the first waveguide of the second Mach-Zehnder modulator and a second negative signal electrode positioned on the substrate over the second waveguide of the second Mach-Zehnder modulator. The second positive signal electrode and the second negative signal electrode are connected to a second differential signal input. A first ground electrode is positioned on the substrate between the first and second Mach-Zehnder modulators connected to ground potential. A second ground electrode is connected to ground potential and positioned on the substrate adjacent to the first Mach-Zehnder modulator such that the first positive signal electrode and the first negative signal electrode are between the second ground electrode and the first ground electrode. A third ground electrode is connected to ground potential and positioned on the substrate adjacent to the second Mach-Zehnder modulator such that the second positive signal electrode and the second negative signal electrode are between the third ground electrode and the first ground electrode. A plurality of first electrical connectors connect the first ground electrode to the second ground electrode and a plurality of second electrical connectors connect the first ground electrode to the third ground electrode. A spacing between at least two of the plurality of first electrical connectors is chosen to achieve a desired cross talk between an optical signal generated by the first Mach-Zehnder modulator and an optical signal generated by the second Mach-Zehnder modulator.
-
10.发明申请公开(公告)号：US20180124942A1
公开(公告)日：2018-05-03
申请号：US15805070
申请日：2017-11-06
Applicant: FINISAR CORPORATION
Inventor： Andrei Kaikkonen , Lennart Per Olof Lundqvist , Lars-Goete Svensson , Peter Lindberg
CPC classification number: H05K7/026 , G01J1/029 , G01J1/44 , G01J2001/446 , G02B6/4279 , H01S5/02276 , H01S5/0427 , H01S5/06226 , H01S5/423 , H04B10/801 , H05K1/0216 , H05K1/0243 , H05K1/025 , H05K2201/10121
Abstract: An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.
-
-
-
-
-
-
-
-
-
Search Results
13
records
(took 0.013 seconds)
