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公开(公告)号：US20100181679A1
公开(公告)日：2010-07-22
申请号：US12663349
申请日：2008-06-05
CPC分类号： B81C1/00238 , B81B2207/07 , B81C2201/019 , H01L21/561 , H01L21/568 , H01L23/3185 , H01L23/5389 , H01L24/04 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2221/68377 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/48 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06582 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
摘要翻译： 一种重构的电子设备，包括：第一面和第二面; 垂直于所述表面放置的多个独立芯片，每个独立芯片在其一个表面上承载与所述重构的电子设备的一个或另一个面齐平的至少一个部件，轨道和连接机构; 以及封装各个芯片的密封剂。
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公开(公告)号：US08039306B2
公开(公告)日：2011-10-18
申请号：US12663349
申请日：2008-06-05
CPC分类号： B81C1/00238 , B81B2207/07 , B81C2201/019 , H01L21/561 , H01L21/568 , H01L23/3185 , H01L23/5389 , H01L24/04 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2221/68377 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/48 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06582 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
摘要翻译： 一种重构的电子设备，包括：第一面和第二面; 垂直于所述表面放置的多个独立芯片，每个独立芯片在其一个表面上承载与所述重构的电子设备的一个或另一个面齐平的至少一个部件，轨道和连接机构; 以及封装各个芯片的密封剂。
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3.发明申请ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOVE COMPRISING AT LEAST ONE BUMP SECURING THE WIRE ELEMENT 有权具有包含至少一个保护电线元件的保护栅的微电子芯片的电线元件的组装公开(公告)号：US20110001237A1
公开(公告)日：2011-01-06
申请号：US12919512
申请日：2008-10-21
申请人： Jean Brun , Dominique Vicard , Sophie Verrun
发明人： Jean Brun , Dominique Vicard , Sophie Verrun
IPC分类号： H01L23/498
CPC分类号： H01L25/0655 , H01L21/6835 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L25/50 , H01L2223/6677 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/48 , H01L2224/78301 , H01L2224/85001 , H01L2224/85365 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T29/41 , H01L2924/20752 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.
摘要翻译： 组件包括至少一个具有两个平行的主表面和侧表面的微电子芯片，至少一个侧面包括容纳具有平行于凹槽的纵向轴线的线的线元件的纵向槽。 凹槽由至少两个侧壁描绘。 线元件在布置在一个侧壁上的至少一个凸块与与凸起相对的凹槽的侧壁之间的夹紧区域的水平处固定到芯片。 夹紧区域具有比线元件的直径更小的高度，并且沿凹槽的纵向轴线横向布置凸块的自由区域。 自由区域具有与分离两个侧壁的距离相对应的高度，该高度大于线元件的直径。
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4.发明授权Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly 有权具有带有线材形式的线元件的凹槽的微电子芯片的组装，以及组装方法公开(公告)号：US08611101B2
公开(公告)日：2013-12-17
申请号：US13124762
申请日：2009-10-21
申请人： Jean Brun , Sophie Verrun , Dominique Vicard
发明人： Jean Brun , Sophie Verrun , Dominique Vicard
CPC分类号： H01L25/0657 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/85 , H01L25/065 , H01L25/50 , H01L2224/32014 , H01L2224/45015 , H01L2224/45028 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48699 , H01L2224/49111 , H01L2224/858 , H01L2225/06527 , H01L2225/06555 , H01L2225/06575 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , Y10T29/49194 , H01L2924/00 , H01L2924/01049 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.
摘要翻译： 组装具有线元件的至少一个微电子芯片，该芯片包括用于嵌入线元件的凹槽。 线元件是具有基本上平行于凹槽的轴线的纵向轴线的线，包括至少两个被绝缘体覆盖的导电线。 该芯片包括凹槽中的至少一个导电凸块，该凸起与该线束的单根导电线的剥离区域电接触。
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5.发明授权Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element 有权具有微电子芯片的线元件的组装，所述微电子芯片具有凹槽，所述凹槽包括固定所述线元件的至少一个凸块公开(公告)号：US08723312B2
公开(公告)日：2014-05-13
申请号：US12919512
申请日：2008-10-21
申请人： Jean Brun , Dominique Vicard , Sophie Verrun
发明人： Jean Brun , Dominique Vicard , Sophie Verrun
CPC分类号： H01L25/0655 , H01L21/6835 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L25/50 , H01L2223/6677 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/48 , H01L2224/78301 , H01L2224/85001 , H01L2224/85365 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T29/41 , H01L2924/20752 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.
摘要翻译： 组件包括至少一个具有两个平行的主表面和侧表面的微电子芯片，至少一个侧面包括容纳具有平行于凹槽的纵向轴线的线的线元件的纵向槽。 凹槽由至少两个侧壁描绘。 线元件在布置在一个侧壁上的至少一个凸块与与凸起相对的凹槽的侧壁之间的夹紧区域的水平处固定到芯片。 夹紧区域具有比线元件的直径更小的高度，并且沿凹槽的纵向轴线横向布置凸块的自由区域。 自由区域具有与分离两个侧壁的距离相对应的高度，该高度大于线元件的直径。
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6.发明申请ASSEMBLY OF A MICROELECTRONIC CHIP HAVING A GROOVE WITH A WIRE ELEMENT IN THE FORM OF A STRAND, AND METHOD FOR ASSEMBLY 有权具有带状丝网中的电线元件的微电子芯片的组装以及组装方法公开(公告)号：US20110198735A1
公开(公告)日：2011-08-18
申请号：US13124762
申请日：2009-10-21
申请人： Jean Brun , Sophie Verrun , Dominique Vicard
发明人： Jean Brun , Sophie Verrun , Dominique Vicard
CPC分类号： H01L25/0657 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/85 , H01L25/065 , H01L25/50 , H01L2224/32014 , H01L2224/45015 , H01L2224/45028 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48699 , H01L2224/49111 , H01L2224/858 , H01L2225/06527 , H01L2225/06555 , H01L2225/06575 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , Y10T29/49194 , H01L2924/00 , H01L2924/01049 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.
摘要翻译： 组装具有线元件的至少一个微电子芯片，该芯片包括用于嵌入线元件的凹槽。 线元件是具有基本上平行于凹槽的轴线的纵向轴线的线，包括至少两个被绝缘体覆盖的导电线。 该芯片包括凹槽中的至少一个导电凸块，该凸起与该线束的单根导电线的剥离区域电接触。
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