利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

27 条记录 (耗时 0.015 秒)

    Optocoupler apparatus
    1.
    发明授权
    Optocoupler apparatus 失效
    OPTOCOUPLER装置

    公开(公告)号：US5064299A

    公开(公告)日：1991-11-12

    申请号：US318458

    申请日：1989-03-01

    申请人： Guenther Hirschmann ,  Guenter Waitl ,  Franz Schellhorn

    发明人： Guenther Hirschmann ,  Guenter Waitl ,  Franz Schellhorn

    IPC分类号： G02B6/24 ,  G02B6/42 ,  G02B6/44

    CPC分类号： G02B6/4295 ,  G02B6/4204 ,  G02B6/4416

    摘要： An optical connection between an optoelectronic structural element and a fiber-optic beam waveguide is described which is reliable, simple, and space-saving. A lens and a hollow cylinder are integrated in the structural component of optoelectronic structural elements. Each end of a fiber-optic beam waveguide is inserted into the hollow cylinders, and the optoelectronic structural elements are connected with the aid of a heat-shrinkable tubing with the fiber-optic beam waveguide such that the ends of the light beam waveguide to be coupled abut each of the lens integrated into the optoelectronic structural elements. An optocoupler according to the invention may be advantageously used in motor vehicles, in electromedicine, in power electronics, in robot control, in sensory analysis, and in "instrumentaion-control-regulation" tasks.

    摘要翻译： 描述了光电结构元件和光纤波导之间的光学连接，其可靠，简单且节省空间。 透镜和中空圆筒集成在光电结构元件的结构部件中。 将光纤波导波导的每个端部插入中空圆柱体中，并且光电结构元件借助于具有光纤波导管的热收缩管道连接，使得光束波导的端部为 耦合到每个透镜集成到光电结构元件中。 根据本发明的光耦合器可以有利地用于机动车辆，电动医疗，电力电子学，机器人控制，感觉分析和“仪器控制调节”任务中。

    Optical emission device
    3.
    发明授权
    Optical emission device 失效
    光发射装置

    公开(公告)号：US4907044A

    公开(公告)日：1990-03-06

    申请号：US380698

    申请日：1989-07-14

    申请人： Franz Schellhorn ,  Guenter Waitl

    发明人： Franz Schellhorn ,  Guenter Waitl

    IPC分类号： H01L33/54

    CPC分类号： H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247

    摘要： An optical emission device with an emitter semiconductor chip and a cover intended to be suitable for backlighting areas, the device having a comparatively low structural height and low packing density. The cover has a light aperture formed using a convex and concave lens for radiating light in a solid angle of maximum size. This device can also be used in combination with an additional external reflector and diffusion screen.

    摘要翻译： 具有发射极半导体芯片和盖子的光发射器件旨在适用于背光区域，该器件具有较低的结构高度和较低的封装密度。 盖具有使用用于以最大尺寸的立体角度照射光的凸凹透镜形成的光孔。 该设备也可以与额外的外部反射器和扩散屏幕组合使用。

    Illumination Device
    4.
    发明申请
    Illumination Device 有权
    照明装置

    公开(公告)号：US20080210962A1

    公开(公告)日：2008-09-04

    申请号：US11814595

    申请日：2006-02-21

    申请人： Simon Blumel ,  Franz Schellhorn ,  Gunter Waitl ,  Mario Wanninger

    发明人： Simon Blumel ,  Franz Schellhorn ,  Gunter Waitl ,  Mario Wanninger

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  F21V5/04 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.

    摘要翻译： 一种照明装置，其特征在于包括具有壳体和设置用于产生辐射的至少一个半导体芯片的光电子部件，以及设置用于在光电子部件处固定并具有光轴的单独的光学元件，所述光学元件具有 辐射出射区域和辐射出射区域具有凹曲面部分区域和凸曲面部分区域，其至少部分地围绕与光轴一定距离的凹曲面部分区域，光轴延伸穿过凹曲面部分区域 。

    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
    6.
    发明授权
    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 有权
    用于半导体元件的两极SMT微型外壳及其制造方法

    公开(公告)号：US07288831B2

    公开(公告)日：2007-10-30

    申请号：US11463127

    申请日：2006-08-08

    申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    IPC分类号： H01L23/495 ,  H01L31/0203

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

    摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

    摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

    TWO-POLE SMT MINIATURE HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF
    7.
    发明申请
    TWO-POLE SMT MINIATURE HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF 有权
    用于半导体元件的两点式SMT微型外壳及其制造方法

    公开(公告)号：US20060284287A1

    公开(公告)日：2006-12-21

    申请号：US11463127

    申请日：2006-08-08

    申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    IPC分类号： H01L23/495

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

    摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted prong laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

    摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向进行，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
    8.
    发明授权
    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 有权
    用于半导体元件的两极SMT微型外壳及其制造方法

    公开(公告)号：US06716673B2

    公开(公告)日：2004-04-06

    申请号：US10147672

    申请日：2002-05-15

    申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    IPC分类号： H01L2348

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

    摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

    摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。