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8 条记录 (耗时 0.021 秒)

    Optocoupler apparatus
    1.
    发明授权
    Optocoupler apparatus 失效
    OPTOCOUPLER装置

    公开(公告)号：US5064299A

    公开(公告)日：1991-11-12

    申请号：US318458

    申请日：1989-03-01

    申请人： Guenther Hirschmann ,  Guenter Waitl ,  Franz Schellhorn

    发明人： Guenther Hirschmann ,  Guenter Waitl ,  Franz Schellhorn

    IPC分类号： G02B6/24 ,  G02B6/42 ,  G02B6/44

    CPC分类号： G02B6/4295 ,  G02B6/4204 ,  G02B6/4416

    摘要： An optical connection between an optoelectronic structural element and a fiber-optic beam waveguide is described which is reliable, simple, and space-saving. A lens and a hollow cylinder are integrated in the structural component of optoelectronic structural elements. Each end of a fiber-optic beam waveguide is inserted into the hollow cylinders, and the optoelectronic structural elements are connected with the aid of a heat-shrinkable tubing with the fiber-optic beam waveguide such that the ends of the light beam waveguide to be coupled abut each of the lens integrated into the optoelectronic structural elements. An optocoupler according to the invention may be advantageously used in motor vehicles, in electromedicine, in power electronics, in robot control, in sensory analysis, and in "instrumentaion-control-regulation" tasks.

    摘要翻译： 描述了光电结构元件和光纤波导之间的光学连接，其可靠，简单且节省空间。 透镜和中空圆筒集成在光电结构元件的结构部件中。 将光纤波导波导的每个端部插入中空圆柱体中，并且光电结构元件借助于具有光纤波导管的热收缩管道连接，使得光束波导的端部为 耦合到每个透镜集成到光电结构元件中。 根据本发明的光耦合器可以有利地用于机动车辆，电动医疗，电力电子学，机器人控制，感觉分析和“仪器控制调节”任务中。

    Optical emission device
    3.
    发明授权
    Optical emission device 失效
    光发射装置

    公开(公告)号：US4907044A

    公开(公告)日：1990-03-06

    申请号：US380698

    申请日：1989-07-14

    申请人： Franz Schellhorn ,  Guenter Waitl

    发明人： Franz Schellhorn ,  Guenter Waitl

    IPC分类号： H01L33/54

    CPC分类号： H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247

    摘要： An optical emission device with an emitter semiconductor chip and a cover intended to be suitable for backlighting areas, the device having a comparatively low structural height and low packing density. The cover has a light aperture formed using a convex and concave lens for radiating light in a solid angle of maximum size. This device can also be used in combination with an additional external reflector and diffusion screen.

    摘要翻译： 具有发射极半导体芯片和盖子的光发射器件旨在适用于背光区域，该器件具有较低的结构高度和较低的封装密度。 盖具有使用用于以最大尺寸的立体角度照射光的凸凹透镜形成的光孔。 该设备也可以与额外的外部反射器和扩散屏幕组合使用。

    Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture
    4.
    发明授权
    Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture 有权
    热膨胀补偿光电子半导体元件，特别是紫外（UV）发光二极管及其制造方法

    公开(公告)号：US06683325B2

    公开(公告)日：2004-01-27

    申请号：US10218887

    申请日：2002-08-14

    申请人： Guenter Waitl ,  Alfred Langer ,  Reinhard Weitzel

    发明人： Guenter Waitl ,  Alfred Langer ,  Reinhard Weitzel

    IPC分类号： H01L29267

    CPC分类号： H01L33/56 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00011 ,  H01L2224/45099

    摘要： An opto-electronic semiconductor element has a radiation emitting or receiving, that is, radiation active semiconductor chip secured to an electrically conductive base frame. One, or a plurality of chips, are surrounded by a housing which may be integral with or have, separately, a cover. All materials of the housing, as well as of the conductive base frame, have mutually matching thermal coefficients of expansion within the temperature ranges which arise during manufacture and in application of the semiconductive element, singly or as a plurality in a common housing. Glass, quartz glass, ceramic or glass ceramic are suitable for the housing or parts thereof; the conductive base frame is preferably made of cladded or jacketed copper wire or strip with an iron-nickel core. Assembling a plurality of chips in a housing which has a luminescence conversion layer, e.g. a phosphor applied thereto, permits construction of a flat light source.

    摘要翻译： 光电子半导体元件具有辐射发射或接收，即固定到导电基架的辐射有源半导体芯片。 一个或多个芯片被壳体包围，该壳体可以与盖子成一体或者分开地覆盖。 外壳的所有材料以及导电基底框架在制造过程中出现的温度范围内以及在共同外壳中单独或多个应用半导体元件时具有相互匹配的热膨胀系数。 玻璃，石英玻璃，陶瓷或玻璃陶瓷适用于外壳或其部件; 导电基架优选地由具有铁镍芯的包层或夹套铜线或带制成。 在具有发光转换层的外壳中组装多个芯片，例如， 施加到其上的荧光体可以构造平坦的​​光源。