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公开(公告)号：US4965654A
公开(公告)日：1990-10-23
申请号：US428533
申请日：1989-10-30
IPC分类号： H01L23/36 , H01L21/60 , H01L23/495 , H01L23/50
CPC分类号： H01L24/83 , H01L23/4951 , H01L23/49531 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/92147 , H01L24/45 , H01L24/48 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/14 , H01L2924/3011
摘要： A plastic encapsulated semiconductor package in which the connecting lead frame members are deposited over the surface of the device together with a covering ground plane so as to provide enhanced electrical and thermal coupling of the members and the device and so reduce the signal to noise ratio by a factor or greater than three over that available in other similar plastic encapsulated packages while simultaneously improving the transfer of heat out of the package.In particular, a lead frame having a plurality of conductors is attached to a major active surface of a semiconductor chip via a ground plane which, in the preferred embodiment, is a multilayered structure containing an insulated integral, uniform ground plane positioned between the lead frame and the chip and adhesively and insulatively joined to both of them. Wires connect terminals on the major active surface of the semiconductor chip to the ground plane and to selective lead frame conductors. The lead frame, the ground plane structure, the semiconductor chip, and the wires which connect the semiconductor chip terminals to the ground plane and to selected lead frame conductors are encapsulated with a suitable insulating material to form a semiconductor module or package.
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公开(公告)号：US4907734A
公开(公告)日：1990-03-13
申请号：US263806
申请日：1988-10-28
申请人： H. Ward Conru , Stephen E. Gons , Gordon C. Osborne, Jr. , Douglas W. Phelps, Jr. , Stephen G. Starr , William C. Ward
发明人： H. Ward Conru , Stephen E. Gons , Gordon C. Osborne, Jr. , Douglas W. Phelps, Jr. , Stephen G. Starr , William C. Ward
IPC分类号： H01R43/00 , B23K20/02 , B23K20/10 , B23K20/22 , B23K35/00 , H01L21/00 , H01L21/607 , H01R43/02 , H05K3/32 , H05K3/34
CPC分类号： H01L24/85 , B23K20/023 , B23K20/10 , B23K20/22 , B23K35/007 , H01L24/03 , H01L24/05 , H01L24/48 , H01R43/02 , H01L2224/04042 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/456 , H01L2224/48463 , H01L2224/48507 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/78301 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85365 , H01L2224/85815 , H01L24/45 , H01L24/78 , H01L2924/00011 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H05K3/328 , H05K3/3457
摘要： A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.
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公开(公告)号：US4821945A
公开(公告)日：1989-04-18
申请号：US68679
申请日：1987-07-01
CPC分类号： H01L24/78 , B23K20/005 , H01L2224/48091 , H01L2224/48247 , H01L2224/78901 , H01L2224/85205 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/15787
摘要： A system of single lead clamping and bonding in the assembly of integrated circuit devices. A capillary bonder has a clamp member rotatably mounted around the capillary for movement with the bond head. The clamp is moveable vertically to contact and clamp a terminal to be bonded. The clamp is rotatable to orient itself with respect to the terminal and the fine wire. The capillary and clamp move under computer control to make a series of bonds, typically between lead frame fingers and terminals on a semiconductor device.
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公开(公告)号：US4796078A
公开(公告)日：1989-01-03
申请号：US61361
申请日：1987-06-15
IPC分类号： H01L23/50 , H01L23/495 , H01L23/48 , H01L23/30
CPC分类号： H01L23/49537 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/92147 , H01L2224/92247 , H01L24/48 , H01L2924/00014 , H01L2924/14
摘要： An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.
摘要翻译： 公开了一种电子组件及其制造方法。 半导体器件（10）被背接合到第一引线框架（14）。 粘合绝缘带（24）放置在第一引线框和设备上。 第二引线框架（28）安装在胶带上。 在器件与第一引线框架和第二引线框架之间建立通过引线键合的电触点。
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公开(公告)号：US4878108A
公开(公告)日：1989-10-31
申请号：US61649
申请日：1987-06-15
CPC分类号： H01L23/4006 , H01L23/4093 , H01L2023/405 , H01L2924/0002
摘要： A package for heat dissipation of electronic components mounted on a strip of thermally conductive material. A plastic body is molded to encapsulate the component and strip with extended mold ejector pins employed to form a recess such that access to the thermally conductive strip is obtained. An external heat sink is mounted onto the plastic body. A clip or through bolt establishes thermal contact between the external heat sink and the internal thermally conductive strip.
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公开(公告)号：US4551912A
公开(公告)日：1985-11-12
申请号：US718817
申请日：1985-04-01
CPC分类号： H01L24/86 , H01L21/67144 , H01L2924/01005 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , Y10T29/49121
摘要： A method of forming semiconductor devices wherein a continuous metallic sheet is cut under computer control into a personalized lead pattern. The pattern is then moved to a bonding station. A bonding tool actuated by computer control moves from one terminal end to another to sequentially bond terminals to the semiconductor device. A variety of various patterns and chips can be handled on the same line using common cutting and bonding tools. A second bond can be made from the lead pattern to either a lead frame or a substrate.
摘要翻译： 一种形成半导体器件的方法，其中将连续的金属片在计算机控制下切割成个性化引线图案。 然后将图案移动到粘合台。 通过计算机控制启动的接合工具从一个终端移动到另一端，以将端子顺序地接合到半导体器件。 各种图案和芯片可以在同一条线上使用常用的切割和粘合工具进行处理。 可以从引线图案到引线框架或基板形成第二接合。
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公开(公告)号：US4862245A
公开(公告)日：1989-08-29
申请号：US161319
申请日：1988-02-19
IPC分类号： H01L23/495 , H01L23/556
CPC分类号： H01L24/06 , H01L23/495 , H01L23/4951 , H01L23/556 , H01L24/05 , H01L2224/04042 , H01L2224/05639 , H01L2224/05644 , H01L2224/06136 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73215 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3011
摘要： The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably by means of an alpha barrier. The conductors cover a substantial portion of the surface of the chip and thereby serve as conduits for the dissipation of heat from the chip. Wires are bonded to the conductors and extend from the conductors to the terminals on the semiconductor chip. In a preferred embodiment the semiconductor chip terminals are located along a center line of the chip. This allows for short connecting wires which in turn contribute to faster chip response.
摘要翻译： 本发明涉及一种有效散热并具有改进性能的封装半导体芯片。 封装的芯片具有延伸穿过封装材料的多个引线框架导体，其优选地通过α屏障粘合地接合到半导体芯片。 导体覆盖芯片表面的大部分，从而用作用于从芯片散热的导管。 电线被接合到导体并从导体延伸到半导体芯片上的端子。 在优选实施例中，半导体芯片端子沿芯片的中心线定位。 这允许短的连接线，这有助于更快的芯片响应。
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公开(公告)号：US4447857A
公开(公告)日：1984-05-08
申请号：US328889
申请日：1981-12-09
CPC分类号： H01L24/85 , H01L23/538 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/91 , H05K3/4015 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48229 , H01L2224/4823 , H01L2224/48491 , H01L2224/48599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48699 , H01L2224/48724 , H01L2224/48744 , H01L2224/73257 , H01L2224/73265 , H01L2224/85051 , H01L2224/85205 , H01L2224/85424 , H01L2224/85444 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043
摘要： A novel substrate is disclosed which can mount either flip-chip solder bonded IC chips or wire bonded chips, or both chips, or a single chip having both solder bonds and wire bonds is disclosed. The substrate has an array of solder pads which will accept solder bonds. Those pads which are to be used for wire bonding have mounted thereon a trimetallic pedestal. Each pedestal has a layer of solder metal bonded to the solder pad, a top layer metal suitable for wire bonding, such as, aluminum or gold, and an intermediate layer of metal, such as nickel, which is impervious to both solder metal and the top layer metal.
摘要翻译： 公开了可以安装倒装芯片焊接IC芯片或引线键合芯片或两个芯片的新颖的基板，或者具有两个焊接接合和引线键合的单个芯片。 衬底具有将接受焊料接合的焊盘阵列。 用于引线接合的那些焊盘在其上安装有金属台座。 每个基座具有结合到焊盘的焊料金属层，适于引线接合的顶层金属，例如铝或金，以及金属（例如镍）的中间层，其不会对焊料金属和 顶层金属。
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公开(公告)号：US4417120A
公开(公告)日：1983-11-22
申请号：US295476
申请日：1981-08-24
摘要： A method and apparatus for improved percussive arc welding is disclosed. In this technique a test arc of a voltage no greater than the initiating voltage of the percussive arc welding is first applied across the pieces to be welded. The welding cycle is then performed if, and only if, an arc is detected responsive to the impressing of the test voltage.
摘要翻译： 公开了一种改进的冲击电弧焊接方法和装置。 在这种技术中，首先施加不超过冲击电弧焊接的起始电压的电压的测试弧跨越待焊接的零件。 然后，如果并且仅当响应于施加测试电压的电弧检测到电弧，则执行焊接循环。
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