公开(公告)号：US06396142B1

公开(公告)日：2002-05-28

申请号：US09369402

申请日：1999-08-06

申请人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

发明人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

公开(公告)号：US06803258B2

公开(公告)日：2004-10-12

申请号：US10152727

申请日：2002-05-23

申请人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

发明人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

IPC分类号： H01L2150

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

摘要翻译： 在具有散热板的半导体器件中，连接到半导体芯片的内部引线的尖端具有引线宽度w和引线厚度t，宽度小于厚度。 内引线固定在散热板上。 将内部引线固定到散热板上，支撑后者，并且不需要悬挂引线。 引线间距p，连接到半导体芯片的内引线头的引线宽度w和引线厚度t具有w

公开(公告)号：US06673655B2

公开(公告)日：2004-01-06

申请号：US10152726

申请日：2002-05-23

申请人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

发明人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

摘要翻译： 在具有散热板的半导体器件中，连接到半导体芯片的内部引线的尖端具有引线宽度w和引线厚度t，宽度小于厚度。 内引线固定在散热板上。 将内部引线固定到散热板上，支撑后者，并且不需要悬挂引线。 引线间距p，连接到半导体芯片的内引线头的引线宽度w和引线厚度t具有w

公开(公告)号：US20050052851A1

公开(公告)日：2005-03-10

申请号：US10902024

申请日：2004-07-30

申请人： Nobuaki Yamada ,  Kazunari Suzuki ,  Bunshi Kuratomi ,  Hiroaki Tanaka ,  Akira Onozawa

发明人： Nobuaki Yamada ,  Kazunari Suzuki ,  Bunshi Kuratomi ,  Hiroaki Tanaka ,  Akira Onozawa

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02 ,  H04B1/38 ,  H04M1/00 ,  H05K1/14

CPC分类号： G06K19/07745 ,  G06K19/077 ,  G06K19/07718 ,  G06K19/07724 ,  G06K19/07733 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.

摘要翻译： 推动插入式通用IC卡的多功能结构，降低制造成本。 插件UICC的主体由模制树脂构成。 胶带基板和安装在带基材一侧的芯片被密封在模塑树脂的内部。 与带基片的芯片安装侧相对的一侧暴露于模制树脂的外部，构成插件UICC的表面部分。 作为插件UICC的外部端子的接触图案形成在暴露于成型树脂的外部的带基材的表面上。 在其主体由模制树脂构成的插件UICC中，即使在芯片尺寸较大的情况下也可以有效地防止芯片的开裂。

公开(公告)号：US07176060B2

公开(公告)日：2007-02-13

申请号：US10902024

申请日：2004-07-30

申请人： Nobuaki Yamada ,  Kazunari Suzuki ,  Bunshi Kuratomi ,  Hiroaki Tanaka ,  Akira Onozawa

发明人： Nobuaki Yamada ,  Kazunari Suzuki ,  Bunshi Kuratomi ,  Hiroaki Tanaka ,  Akira Onozawa

IPC分类号： H01L21/00

CPC分类号： G06K19/07745 ,  G06K19/077 ,  G06K19/07718 ,  G06K19/07724 ,  G06K19/07733 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.

摘要翻译： 推动插入式通用IC卡的多功能结构，降低制造成本。 插件UICC的主体由模制树脂构成。 胶带基板和安装在带基材一侧的芯片被密封在模塑树脂的内部。 与带基片的芯片安装侧相对的一侧暴露于模制树脂的外部，构成插件UICC的表面部分。 作为插件UICC的外部端子的接触图案形成在暴露于成型树脂的外部的带基材的表面上。 在其主体由模制树脂构成的插件UICC中，即使在芯片尺寸较大的情况下也可以有效地防止芯片的开裂。

公开(公告)号：US10962776B2

公开(公告)日：2021-03-30

申请号：US16779843

申请日：2020-02-03

申请人： Hiroaki Tanaka ,  Toshihiro Yamashiro

发明人： Hiroaki Tanaka ,  Toshihiro Yamashiro

IPC分类号： G02B27/01

摘要： A display device includes a light source; a light deflector configured to deflect light emitted from the light source to scan as scanning light in a main scanning direction and a sub-scanning direction; a screen having a scanning area to be two-dimensionally scanned with the scanning light at a predetermined cycle, the scanning area having a first area and a second area that differ in position in the sub-scanning direction; a light receiver disposed on the screen, configured to detect the light scanning in each of the first area and the second area of the screen; and a control unit configured to adjust a position of the scanning light in the scanning area according to the number of scanning lines in each of the first area and the second area.

公开(公告)号：US09372433B2

公开(公告)日：2016-06-21

申请号：US14830352

申请日：2015-08-19

申请人： Hiroyuki Suhara ,  Hiroaki Tanaka

发明人： Hiroyuki Suhara ,  Hiroaki Tanaka

IPC分类号： G03G15/043 ,  B41J2/385 ,  B41J2/435

CPC分类号： G03G15/043 ,  B41J2/385 ,  B41J2/435

摘要： An electrostatic latent image forming method for forming, on an image carrier, an electrostatic latent image that has a pattern where there are an irradiated area and a not-irradiated area in a mixed manner, the electrostatic latent image forming method comprises; adjusting an exposure condition of an irradiated area that is included in the irradiated area and is adjacent to the not-irradiated area so that an electric field intensity of an electrostatic latent image that corresponds to the not-irradiated area is increased so as to prevent adhesion of a developer, and irradiating the image carrier with light under the adjusted exposure condition.

公开(公告)号：US20150054075A1

公开(公告)日：2015-02-26

申请号：US14501244

申请日：2014-09-30

申请人： Tadahiro Ohmi ,  Hiroaki Tanaka

发明人： Tadahiro Ohmi ,  Hiroaki Tanaka

IPC分类号： H01L29/10 ,  H01L29/417 ,  H01L29/45 ,  H01L29/78

CPC分类号： H01L29/1087 ,  H01L27/1203 ,  H01L29/41733 ,  H01L29/458 ,  H01L29/7816

摘要： There is provided a semiconductor device. An n-type transistor is formed on a (551) surface of a silicon substrate. A silicide layer region in contact with a diffusion region (heavily doped region) of the n-type transistor has a thickness not more than 5 nm. A metal layer region in contact with the silicide layer has a thickness of 25 nm (inclusive) to 400 nm (inclusive). A barrier height between the silicide layer region and the diffusion region has a minimum value in this thickness relationship.

摘要翻译： 提供了一种半导体器件。 n型晶体管形成在硅衬底的（551）表面上。 与n型晶体管的扩散区域（重掺杂区域）接触的硅化物层区域的厚度不大于5nm。 与硅化物层接触的金属层区域的厚度为25nm（含）〜400nm（含）。 硅化物层区域和扩散区域之间的势垒高度在该厚度关系中具有最小值。

公开(公告)号：US08836150B2

公开(公告)日：2014-09-16

申请号：US13989962

申请日：2010-11-29

申请人： Hiroaki Tanaka

发明人： Hiroaki Tanaka

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L29/739 ,  H01L29/417

CPC分类号： H01L23/498 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L29/417 ,  H01L29/41741 ,  H01L29/7397 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05557 ,  H01L2224/05624 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48132 ,  H01L2224/4847 ,  H01L2224/48491 ,  H01L2224/49175 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3511 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor device disclosed in this description has a semiconductor substrate including an element region in which a semiconductor element is formed, and an upper surface electrode formed on an upper surface of the element region of the semiconductor substrate. The upper surface electrode has a first thickness region and a second thickness region which is thicker than the first thickness region, and a bonding wire is bonded on the second thickness region.

摘要翻译： 在本说明书中公开的半导体器件具有包括其中形成半导体元件的元件区域和形成在半导体衬底的元件区域的上表面上的上表面电极的半导体衬底。 上表面电极具有比第一厚度区域厚的第一厚度区域和第二厚度区域，并且接合线接合在第二厚度区域上。

公开(公告)号：US08704937B2

公开(公告)日：2014-04-22

申请号：US13837623

申请日：2013-03-15

申请人： Keiji Matsusaka ,  Hiroaki Tanaka

发明人： Keiji Matsusaka ,  Hiroaki Tanaka

IPC分类号： H04N5/225 ,  G02B9/34

CPC分类号： G02B3/00 ,  G02B3/04 ,  G02B13/004 ,  G02B13/18 ,  H04N5/23245

摘要： An imaging optical system, an imaging device, and a digital apparatus have a four lens construction with positive, negative, positive, and negative refractive powers. A surface position at the maximum effective diameter of the second lens element is located on the object side than a surface vertex thereof. The fourth lens element has an inflection point at a position other than the intersection of the optical axis and the fourth lens element. The optical system satisfies the following conditions. 0.7 72 ν4>50, and 0.55

摘要翻译： 成像光学系统，成像装置和数字装置具有正，负，正和负折射力的四透镜结构。 第二透镜元件的最大有效直径处的表面位置位于物体侧，而不是其表面​​顶点。 第四透镜元件在光轴和第四透镜元件的交点以外的位置具有拐点。 光学系统满足以下条件。 0.7 72＆ ; 4> 50和0.55