Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs
    1.
    发明授权
    Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs 有权
    用于确定用于不同掩模版设计的晶片印刷工艺的不同工艺窗口的计算机实现的方法和系统

    公开(公告)号:US08102408B2

    公开(公告)日:2012-01-24

    申请号:US11770437

    申请日:2007-06-28

    IPC分类号: H04N7/18

    CPC分类号: G03F1/84

    摘要: Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.

    摘要翻译: 提供了用于确定用于不同掩模版设计的晶片印刷工艺的不同工艺窗口的计算机实现的方法和系统。 一种方法包括产生模拟图像,其示出了在晶片印刷过程的一个或多个参数的不同值下每个不同的标线设计将如何印刷在晶片上。 该方法还包括使用模拟图像检测每个不同标线设计中的缺陷。 此外,该方法包括基于检测步骤的结果确定用于每个不同掩模版设计的晶片印刷处理的处理窗口。

    COMPUTER-IMPLEMENTED METHODS AND SYSTEMS FOR DETERMINING DIFFERENT PROCESS WINDOWS FOR A WAFER PRINTING PROCESS FOR DIFFERENT RETICLE DESIGNS
    2.
    发明申请
    COMPUTER-IMPLEMENTED METHODS AND SYSTEMS FOR DETERMINING DIFFERENT PROCESS WINDOWS FOR A WAFER PRINTING PROCESS FOR DIFFERENT RETICLE DESIGNS 有权
    用于确定不同过程窗口的计算机实现方法和系统,用于不同设计的WAFER打印过程

    公开(公告)号:US20080072207A1

    公开(公告)日:2008-03-20

    申请号:US11770437

    申请日:2007-06-28

    IPC分类号: G06F17/50

    CPC分类号: G03F1/84

    摘要: Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.

    摘要翻译: 提供了用于确定用于不同掩模版设计的晶片印刷工艺的不同工艺窗口的计算机实现的方法和系统。 一种方法包括产生模拟图像,其示出了在晶片印刷过程的一个或多个参数的不同值下每个不同的标线设计将如何印刷在晶片上。 该方法还包括使用模拟图像检测每个不同标线设计中的缺陷。 此外,该方法包括基于检测步骤的结果确定用于每个不同掩模版设计的晶片印刷处理的处理窗口。

    Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
    3.
    发明授权
    Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer 有权
    用于确定用于预测晶片上的掩模版特征的可印刷性的模型的计算机实现的方法,系统和计算机可读介质

    公开(公告)号:US07962863B2

    公开(公告)日:2011-06-14

    申请号:US12115830

    申请日:2008-05-06

    IPC分类号: G06F17/50

    CPC分类号: G03F7/70441 G03F1/36 G03F1/68

    摘要: Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer are provided. One method includes generating simulated images of the reticle features printed on the wafer using different generated models for a set of different values of exposure conditions. The method also includes determining one or more characteristics of the reticle features of the simulated images. In addition, the method includes comparing the one or more characteristics of the reticle features of the simulated images to one or more characteristics of the reticle features printed on the wafer using a lithography process. The method further includes selecting one of the different generated models as the model to be used for predicting the printability of the reticle features based on results of the comparing step.

    摘要翻译: 提供了用于确定用于预测晶片上的掩模版特征的可印刷性的模型的计算机实现的方法,系统和计算机可读介质。 一种方法包括使用针对一组不同曝光条件值的不同生成模型产生印刷在晶片上的掩模版特征的模拟图像。 该方法还包括确定模拟图像的掩模版特征的一个或多个特征。 此外,该方法包括使用光刻工艺将模拟图像的掩模版特征的一个或多个特征与印刷在晶片上的掩模版特征的一个或多个特性进行比较。 该方法还包括基于比较步骤的结果,选择不同的生成模型中的一个作为用于预测标线图特征的可印刷性的模型。

    COMPUTER-IMPLEMENTED METHODS, SYSTEMS, AND COMPUTER-READABLE MEDIA FOR DETERMINING A MODEL FOR PREDICTING PRINTABILITY OF RETICLE FEATURES ON A WAFER
    4.
    发明申请
    COMPUTER-IMPLEMENTED METHODS, SYSTEMS, AND COMPUTER-READABLE MEDIA FOR DETERMINING A MODEL FOR PREDICTING PRINTABILITY OF RETICLE FEATURES ON A WAFER 有权
    计算机实现的方法,系统和计算机可读介质,用于确定用于预测WAFER中的特征的可打印性的模型

    公开(公告)号:US20090024967A1

    公开(公告)日:2009-01-22

    申请号:US12115830

    申请日:2008-05-06

    IPC分类号: G06F17/50

    CPC分类号: G03F7/70441 G03F1/36 G03F1/68

    摘要: Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer are provided. One method includes generating simulated images of the reticle features printed on the wafer using different generated models for a set of different values of exposure conditions. The method also includes determining one or more characteristics of the reticle features of the simulated images. In addition, the method includes comparing the one or more characteristics of the reticle features of the simulated images to one or more characteristics of the reticle features printed on the wafer using a lithography process. The method further includes selecting one of the different generated models as the model to be used for predicting the printability of the reticle features based on results of the comparing step.

    摘要翻译: 提供了用于确定用于预测晶片上的掩模版特征的可印刷性的模型的计算机实现的方法,系统和计算机可读介质。 一种方法包括使用针对一组不同曝光条件值的不同生成模型产生印刷在晶片上的掩模版特征的模拟图像。 该方法还包括确定模拟图像的掩模版特征的一个或多个特征。 此外,该方法包括使用光刻工艺将模拟图像的掩模版特征的一个或多个特征与印刷在晶片上的掩模版特征的一个或多个特性进行比较。 该方法还包括基于比较步骤的结果,选择不同的生成模型中的一个作为用于预测标线图特征的可印刷性的模型。

    METHOD AND APPARATUS FOR TRANSMITTING WIRELESS FRAME, AND COMMUNICATION NETWORK ELEMENT
    6.
    发明申请
    METHOD AND APPARATUS FOR TRANSMITTING WIRELESS FRAME, AND COMMUNICATION NETWORK ELEMENT 有权
    用于发送无线帧的方法和装置,以及通信网络单元

    公开(公告)号:US20140126405A1

    公开(公告)日:2014-05-08

    申请号:US14118893

    申请日:2012-04-16

    IPC分类号: H04L5/00 H04W24/02

    摘要: It is disclosed a method for transmitting wireless frame, including: the wireless frame is transmitted by using any access category. The wireless frame is a beginning frame for performing channel information measurement. It is further disclosed an apparatus for transmitting wireless frame, including: a selection unit and a transmitting unit, where the selection unit is configured to select any access category for a beginning frame for performing the channel information measurement; and the transmitting unit is configured to transmit the beginning frame. It is further disclosed a communication network element provided with the apparatus for transmitting wireless frame mentioned above. It is ensured that the wireless frames subsequent to the frame exchange sequence for performing the channel information measurement may be smoothly transmitted, and the channel information measurement may be smoothly performed, and thereby transmitting communication data based on the acquired channel information. The support of each communication network elements to the MIMO and beam forming is further ensured, and an effective supplement to the existing protocols is provided.

    摘要翻译: 公开了一种用于发送无线帧的方法,包括:通过使用任何接入类别来发送无线帧。 无线帧是用于执行信道信息测量的起始帧。 还公开了一种用于发送无线帧的装置,包括:选择单元和发送单元,其中所述选择单元被配置为选择用于执行信道信息测量的起始帧的任何接入类别; 并且发送单元被配置为发送开始帧。 还公开了一种通信网络元件,其具有用于发送上述无线帧的装置。 确保可以平滑地发送用于执行信道信息测量的帧交换顺序之后的无线帧,并且可以平滑地执行信道信息测量,从而基于获取的信道信息发送通信数据。 进一步确保每个通信网络元件对MIMO和波束形成的支持,并且提供对现有协议的有效补充。

    DESIGNED-BASED YIELD MANAGEMENT SYSTEM
    7.
    发明申请
    DESIGNED-BASED YIELD MANAGEMENT SYSTEM 审中-公开
    基于设计的管理系统

    公开(公告)号:US20120259574A1

    公开(公告)日:2012-10-11

    申请号:US13080474

    申请日:2011-04-05

    IPC分类号: G06F19/00

    摘要: An integrated-circuit yield improvement system includes a global signature analysis/grouping module configured to receive an integrated circuit (IC) design and identify areas in the IC design that include potential defect signatures based on the defect signatures stored in the defect signature library. The global signature analysis/grouping module can produce a global signature map indicating these areas and their associated potential defect signatures in the IC design. A local signature analysis/grouping module can identify and group local defect signatures in the IC design with the process monitoring and yield data as input, to output grouped local signatures. An intelligent learning engine can analyze the global signature map and the grouped local signatures and update some of the defect signatures in the defect signature library. A feedback loop is formed to update and renew the contents of the defect signature library for each new IC design while process and yield are improved.

    摘要翻译: 集成电路产量改进系统包括全局签名分析/分组模块,其被配置为接收集成电路(IC)设计,并基于存储在缺陷签名库中的缺陷签名来识别IC设计中包括潜在缺陷签名的区域。 全局签名分析/分组模块可以产生一个全局签名图,指示这些区域及其相关的潜在缺陷签名在IC设计中。 本地签名分析/分组模块可以通过流程监控和收益数据作为输入来识别和分组IC设计中的本地缺陷签名,以输出分组的本地签名。 智能学习引擎可以分析全局签名图和分组的本地签名,并更新缺陷签名库中的一些缺陷签名。 形成反馈循环,以更新和更新每个新IC设计的缺陷签名库的内容,同时改进处理和产量。

    Target acquisition technique for CD measurement machine
    9.
    发明授权
    Target acquisition technique for CD measurement machine 有权
    CD测量机的目标采集技术

    公开(公告)号:US06608920B1

    公开(公告)日:2003-08-19

    申请号:US09183077

    申请日:1998-10-29

    申请人: Bo Su Mircea Dusa

    发明人: Bo Su Mircea Dusa

    IPC分类号: G06K200

    CPC分类号: G03F7/70625

    摘要: In a process for measuring the CD of a mask pattern transferred to a semiconductor wafer, in which a series of dies are sequentially inspected by first locating a target area on the die and then vectoring to a CD measurement area, a technique is used whereby the stored image of an alignment target is used for pattern recognition in the process of acquiring each subsequent die's target. The stored image is updated with each new die inspected, using an image of the most recently acquired target area. In this manner, the stored target image always closely approximates the next target to be acquired. Thus, according to the invention, difficulties in recognizing and centering on the target are minimized, and CD measurements of much higher reliability can be effected.

    摘要翻译: 在用于测量转印到半导体晶片的掩模图案的CD的过程中,其中通过首先在芯片上定位目标区域,然后向量化到CD测量区域来连续检查一系列模具,使用这样的技术,由此 在获取每个后续​​的模具的目标的过程中,将对准目标的存储图像用于模式识别。 使用最近获取的目标区域的图像,使用检查的每个新模具更新存储的图像。 以这种方式,所存储的目标图像总是紧密接近要被获取的下一个目标。 因此,根据本发明,识别和集中在目标上的困难被最小化,并且可以实现更高可靠性的CD测量。

    Integrated critical dimension control for semiconductor device manufacturing
    10.
    发明授权
    Integrated critical dimension control for semiconductor device manufacturing 失效
    半导体器件制造的集成临界尺寸控制

    公开(公告)号:US06486492B1

    公开(公告)日:2002-11-26

    申请号:US09714984

    申请日:2000-11-20

    申请人: Bo Su

    发明人: Bo Su

    IPC分类号: H01L2358

    摘要: A method and apparatus for reducing lot to lot CD variation in semiconductor wafer processing feeds back information gathered during inspection of a wafer, such as after photoresist application, exposure and development, to upcoming lots that will be going through the photolithography process, and feeds forward information to adjust the next process the inspected wafer will undergo (e.g., the etch process). Embodiments include forming a feature such as an etch mask on a semiconductor wafer at a “photo cell” by a photolithography process, then conventionally imaging the feature with a CD-SEM to measure its CD and other sensitive parameters. The measured parameters are linked, via the feature's SEM waveform, to photolithography adjustable parameters such as stepper focus and exposure settings. If the measured parameters deviate from design dimensions, the linked information on focus and exposure is fed back to the photo cell so the stepper can be adjusted, either automatically or at the user's discretion, to correct the deviation in following lots. The measured parameters are also linked to etch process adjustable parameters such as etch recipes for different over-etch and/or etch chemistry. If the measured parameters deviate from desired values, a linked etch recipe to correct the error is fed forward to the etcher and implemented automatically or at the user's discretion. This feedback and feed-forward mechanism improves lot to lot CD control at inspection following photoresist development and at final inspection as well.

    摘要翻译: 用于减少半导体晶片处理中的批次CD变化的方法和装置反馈在晶片检测期间收集的信息,例如在光致抗蚀剂施加,曝光和显影之后的即将到来的将要经过光刻工艺的批次,并向前馈送 信息以调整被检查的晶片将经历的下一个处理(例如,蚀刻工艺)。 实施例包括通过光刻工艺在“光电池”上在半导体晶片上形成诸如蚀刻掩模的特征,然后用CD-SEM对该特征进行成像以测量其CD和其它敏感参数。 测量的参数通过特征的SEM波形链接到光刻可调参数,如步进聚焦和曝光设置。 如果测量的参数偏离设计尺寸,则将聚焦和曝光的链接信息反馈给光电池,以便可以自动或由用户自行调整步进器,以纠正以下批次中的偏差。 测量的参数也与蚀刻工艺可调参数相关联,例如用于不同的过蚀刻和/或蚀刻化学的蚀刻配方。 如果测量的参数偏离了所需的值,则将纠错错误的链接蚀刻配方向前馈送到蚀刻器,并自动或由用户自行决定。 这种反馈和前馈机制在光致抗蚀剂显影和最终检查之后的检查中,对于批次CD控制的改善也是很大的。