摘要:
A method for manufacturing micro-mechanical components in which a structure is produced on a silicon layer, which is to be undercut in a further step. The silicon is selectively anodized for this undercutting operation. Thus, the method enables the manufacturing of micro-mechanical components that can be integrated together with bipolar circuit elements.
摘要:
A method for manufacturing sensors from a multilayer plate with upper and lower monocrystalline silicon layers and an etching layer between them. The upper silicon layer is structured by the introduction of troughs therein extending down to the etching layer. Sensor structures, such as a bending beam that is used in an acceleration sensor, are created by etching the etching layer beneath a part of the silicon layer structured in this manner.
摘要:
In a force sensor, a resonator is mounted by means of a dielectric layer on a bending element. Deformation of the bending element changes the resonant frequency of the resonator.
摘要:
In a force sensor, a resonator is mounted by means of a dielectric layer on a bending element. Deformation of the bending element changes the resonant frequency of the resonator.
摘要:
An assembly for a gas bag restraint system is provided. This assembly comprises an elongate housing provided with open axial ends. Within the housing a gas generator is accomodated which is held axially between two covers closing said open ends of said housing.
摘要:
In a process for applying a thin, transparent layer onto the surface of optical plastic elements for protecting the surface of such element against mechanical and chemical influences that surface is subjected to a monomeric vapor of organic compositions, preferably a silicon-organic substance in a vacuum container and a protection layer is separated from the vapor phase with the assistance of the radiation from an electrical gas discharge. Substances, in particular oxygen are added to the monomeric vapor during the polymerization which increases the layer hardness. The addition of these substances is performed with a delay with respect to the start of the polymerization process, so as to assume a good adherence of the layer on the surface.
摘要:
A method for producing bore holes, including conical bore holes, having a definite hole geometry in the longitudinal direction of the bore hole by adjusting the beam geometry and/or the beam parameters of a laser beam.
摘要:
A magnetostrictive transducer wherein a magnetostrictive layer is applied to a flexible element, for example, a flexible beam. The flexible element is deflected by an external magnetic field. The thin magnetostrictive layer consists of Tb.sub.(1-x) Dy.sub.(x) Fe.sub.2.
摘要:
It is an object of the invention to create a sailing yacht having a heeling hull body part and a non-heeling hull body part, which sailing yacht, with regard to the heeling hull body part, can be sailed in the conventional manner and, with regard to the non-heeling hull body part, ensures all the clear advantages of a substantially horizontally-remaining alignment when used preferably as a cabin, galley and/or cockpit, and which sailing yacht thereby offers the greatest possible comfort when sailing, in particular when residing below deck, and can be converted in a simple manner into a pure motorboat. The object is achieved according to the invention in that both the mast (2) and also the keel (3) are in each case arranged so as to be rigidly connected to the first, heeling hull body part (1.1), and in that the first hull body part (1.1) which supports the mast-keel combination (2, 3) is articulatedly connected to the non-heeling, second hull body part (1.2), which does not support a mast-keel combination, by means of a revolute joint (4), which is preferably formed as a double-ring rolling bearing, so as to be pivotable by a rotational angle (a) about the bow-stern axis (L).
摘要:
An assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The assembly is thus adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier. The carrier can be of metal or recyclable plastic material.