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公开(公告)号：US06413339B1
公开(公告)日：2002-07-02
申请号：US09470457
申请日：1999-12-22
申请人： Govindarajan Natarajan , Jon A. Casey , Martin E. Klepeis , John U. Knickerbocker , Srinivasa S. N. Reddy , Robert A. Rita , Subhash L. Shinde
发明人： Govindarajan Natarajan , Jon A. Casey , Martin E. Klepeis , John U. Knickerbocker , Srinivasa S. N. Reddy , Robert A. Rita , Subhash L. Shinde
IPC分类号： B32B3116
CPC分类号： C04B35/2683 , C04B35/64 , H01F1/0027 , H01F41/0253 , Y10T156/1056 , Y10T156/1057
摘要： The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.
摘要翻译： 本发明一般涉及具有通孔的新的金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。
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公开(公告)号：US06653776B1
公开(公告)日：2003-11-25
申请号：US09605694
申请日：2000-06-28
IPC分类号： H01J2964
CPC分类号： H01J29/68
摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.
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公开(公告)号：US06494758B1
公开(公告)日：2002-12-17
申请号：US09364842
申请日：1999-07-30
IPC分类号： H01J924
CPC分类号： H01F1/0027 , H01J9/244
摘要： The present invention relates generally to a new metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.
摘要翻译： 本发明一般涉及新的金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。
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4.发明授权Discrete magnets in dielectric forming metal/ceramic laminate and process thereof 失效电介质成形金属/陶瓷层压板中的离散磁体及其工艺公开(公告)号：US06974358B2
公开(公告)日：2005-12-13
申请号：US10462275
申请日：2003-06-16
CPC分类号： H01J29/68
摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.
摘要翻译： 本发明一般涉及一种新的电介质形成金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成电介质形成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。
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5.发明授权Ceramic via composition, multilayer ceramic circuit containing same, and process for using same 失效陶瓷通孔组合物，含有其的多层陶瓷电路及其使用方法
公开(公告)号：US5468445A
公开(公告)日：1995-11-21
申请号：US281716
申请日：1994-07-28
申请人： Jon A. Casey , Renuka S. Divakaruni , Govindarajan Natarajan , Srinivasa S. N. Reddy , Manfred Sammet
发明人： Jon A. Casey , Renuka S. Divakaruni , Govindarajan Natarajan , Srinivasa S. N. Reddy , Manfred Sammet
CPC分类号： H05K1/092 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/0306
摘要： A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
摘要翻译： 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。
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6.发明授权Ceramic via composition, multilayer ceramic circuit containing same, and process for using same 失效陶瓷通孔组合物，含有其的多层陶瓷电路及其使用方法
公开(公告)号：US5336444A
公开(公告)日：1994-08-09
申请号：US890898
申请日：1992-05-29
申请人： Jon A. Casey , Renuka S. Divakaruni , Govindarajan Natarajan , Srinivasa S. N. Reddy , Manfred Sammet
发明人： Jon A. Casey , Renuka S. Divakaruni , Govindarajan Natarajan , Srinivasa S. N. Reddy , Manfred Sammet
CPC分类号： H05K1/092 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/0306
摘要： A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
摘要翻译： 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。
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公开(公告)号：US5541005A
公开(公告)日：1996-07-30
申请号：US438825
申请日：1995-05-11
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/105
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。
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公开(公告)号：US5439636A
公开(公告)日：1995-08-08
申请号：US836675
申请日：1992-02-18
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katharine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sara H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katharine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sara H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/00
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。
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公开(公告)号：US06254925B1
公开(公告)日：2001-07-03
申请号：US09123928
申请日：1998-07-28
IPC分类号： C23C1606
CPC分类号： C23C16/08
摘要： The present invention discloses at least one source metal that is embedded in at least one inert material to form a stand-alone structure and process thereof. It is preferred that the source metal is nickel or alloy thereof, and the inert material is at least one ceramic.
摘要翻译： 本发明公开了至少一种源金属，其嵌入在至少一种惰性材料中以形成独立结构及其工艺。 源金属优选为镍或其合金，惰性材料为至少一种陶瓷。
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公开(公告)号：US5613181A
公开(公告)日：1997-03-18
申请号：US360526
申请日：1994-12-21
IPC分类号： C03C17/36 , C04B41/52 , C04B41/89 , C23C26/00 , H01L21/48 , H01L23/373 , B22F7/02 , B22F7/04
CPC分类号： C03C17/3607 , C03C17/36 , C03C17/3649 , C04B41/009 , C04B41/52 , C04B41/89 , C23C26/00 , H01L21/4846 , H01L21/4853 , H01L21/4857 , H01L21/4867 , H01L23/3731 , C03C2217/40 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , Y10T428/12 , Y10T428/12007 , Y10T428/12167
摘要： A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.
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