公开(公告)号：US06413339B1

公开(公告)日：2002-07-02

申请号：US09470457

申请日：1999-12-22

申请人： Govindarajan Natarajan ,  Jon A. Casey ,  Martin E. Klepeis ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Robert A. Rita ,  Subhash L. Shinde

发明人： Govindarajan Natarajan ,  Jon A. Casey ,  Martin E. Klepeis ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Robert A. Rita ,  Subhash L. Shinde

IPC分类号： B32B3116

CPC分类号： C04B35/2683 ,  C04B35/64 ,  H01F1/0027 ,  H01F41/0253 ,  Y10T156/1056 ,  Y10T156/1057

摘要： The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.

摘要翻译： 本发明一般涉及具有通孔的新的金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。

公开(公告)号：US5304517A

公开(公告)日：1994-04-19

申请号：US11577

申请日：1993-02-01

申请人： Jon A. Casey ,  Sylvia M. DeCarr ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Vivek M. Sura ,  Rao R. Tummala

发明人： Jon A. Casey ,  Sylvia M. DeCarr ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Vivek M. Sura ,  Rao R. Tummala

IPC分类号： C03C14/00 ,  C04B35/195 ,  H01L23/08 ,  C03C8/18

CPC分类号： C03C14/004 ,  C03C2214/08 ,  C03C2214/20

摘要： A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of:______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________ The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000.degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.

摘要翻译： 使用包含合金粉末或选自由以下组成的合金的薄片的玻璃 - 陶瓷浆料来描述烧结工艺：-Fe-CrCu-Ti-Fe-Cr-NiAg-Ti-Cr-AlNb-Al-Ni-CrCu -Al-Ni-AlCu-Al-Cr-Fe-Al-该浆料被模制，随后在约1000℃的温度下在蒸汽气氛中烧结，以产生增韧的抗裂纹扩展的玻璃陶瓷基体，并且可用于 半导体器件芯片的封装。

公开(公告)号：US06974358B2

公开(公告)日：2005-12-13

申请号：US10462275

申请日：2003-06-16

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01F1/09 ,  H01F41/02 ,  H01J1/62 ,  H01J29/64 ,  H01J29/68

CPC分类号： H01J29/68

摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

摘要翻译： 本发明一般涉及一种新的电介质形成金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成电介质形成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。

公开(公告)号：US06653776B1

公开(公告)日：2003-11-25

申请号：US09605694

申请日：2000-06-28

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01J2964

CPC分类号： H01J29/68

摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

公开(公告)号：US06494758B1

公开(公告)日：2002-12-17

申请号：US09364842

申请日：1999-07-30

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01J924

CPC分类号： H01F1/0027 ,  H01J9/244

摘要： The present invention relates generally to a new metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

摘要翻译： 本发明一般涉及新的金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。

公开(公告)号：US5139851A

公开(公告)日：1992-08-18

申请号：US503493

申请日：1990-03-30

申请人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC分类号： C04B41/4961 ,  C04B41/488 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US5468445A

公开(公告)日：1995-11-21

申请号：US281716

申请日：1994-07-28

申请人： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

发明人： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

IPC分类号： C04B37/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/46 ,  B22F7/08

CPC分类号： H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306

摘要： A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

摘要翻译： 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。

公开(公告)号：US5336444A

公开(公告)日：1994-08-09

申请号：US890898

申请日：1992-05-29

申请人： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

发明人： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

IPC分类号： C04B37/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/46 ,  H01B1/00 ,  H01B1/02

CPC分类号： H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306

摘要： A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

摘要翻译： 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。