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公开(公告)号：US4388343A
公开(公告)日：1983-06-14
申请号：US326168
申请日：1981-11-30
申请人： Gunther Voss , Peter Gruber
发明人： Gunther Voss , Peter Gruber
CPC分类号： B30B15/0011 , B05B17/0638 , B05B5/025 , Y10S425/115
摘要： A method and apparatus for the coating of molding tools which comprises dispersing liquid or suspended lubricant in directional manner before each pressing operation in discrete, specific droplets onto the pressing zones of the molding tools, said dispersing being effected by means of f.i. piezoelectric transducers.
摘要翻译： 一种用于涂覆模制工具的方法和装置，其包括在每次按压操作之前以分散的特定液滴将液体或悬浮润滑剂以定向方式分散到模制工具的压榨区上，所述分散通过f.i进行。 压电换能器。
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2.再颁专利
公开(公告)号：USRE31764E
公开(公告)日：1984-12-11
申请号：US433848
申请日：1982-10-12
申请人： Gunther Voss , Peter Gruber
发明人： Gunther Voss , Peter Gruber
CPC分类号： A61K9/2095 , A61J3/00 , B41J3/4073 , A61J2205/20
摘要： A method for the preparation of pharmaceuticals which comprises using a piezoelectric dosing system to dot liquid, dissolved or suspended active substance onto a pharmaceutical carrier.
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3.发明授权
公开(公告)号：US4548825A
公开(公告)日：1985-10-22
申请号：US538200
申请日：1983-10-03
申请人： Gunther Voss , Peter Gruber
发明人： Gunther Voss , Peter Gruber
CPC分类号： A61K9/2095 , A61J3/00 , B41J3/4073 , A61J2205/20
摘要： This invention is directed to a method for the non-contact application of letters or symbols to the exterior surfaces of uncoated tablets or uncoated tablet cores, which comprises dotting color solution or suspension by means of an ink-jet printer in specific quantity in the form of discrete droplets of specific volume onto the exterior surfaces of the uncoated tablets or uncoated tablet cores.
摘要翻译： 本发明涉及一种用于在未涂覆片剂或未包衣片芯的外表面上非接触施加字母或符号的方法，其包括通过喷墨打印机以特定数量的形式点滴颜色溶液或悬浮液 具有特定体积的离散液滴到未包衣片剂或未包衣片芯的外表面上。
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公开(公告)号：US4323530A
公开(公告)日：1982-04-06
申请号：US119479
申请日：1980-02-07
申请人： Gunther Voss , Peter Gruber
发明人： Gunther Voss , Peter Gruber
CPC分类号： B30B15/0011
摘要： A method for spraying compression tools, for example, consisting of upper and lower die and matrix, of machines for the manufacture of molded articles, which comprises applying dissolved, molten or suspended lubricants to the tool surfaces, generally before each compression operation, by means of an intermittently and briefly spraying nozzle system.
摘要翻译： 用于喷射压缩工具的方法，例如由用于制造模制品的机器的上模和下模组成的压模，其包括通常在每次压缩操作之前通过装置将溶解的，熔融的或悬浮的润滑剂施加到工具表面 间歇地和短暂地喷涂喷嘴系统。
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5.发明授权
公开(公告)号：US4322449A
公开(公告)日：1982-03-30
申请号：US109420
申请日：1980-01-03
申请人： Gunther Voss , Peter Gruber
发明人： Gunther Voss , Peter Gruber
CPC分类号： A61K9/2095 , A61J3/00 , B41J3/4073 , A61J2205/20
摘要： A method for the preparation of pharmaceuticals which comprises using a piezoelectric dosing system to dot liquid, dissolved or suspended active substance onto a pharmaceutical carrier.
摘要翻译： 一种制备药物的方法，其包括使用压电剂量系统将液体，溶解或悬浮的活性物质点滴在药物载体上。
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6.发明申请公开(公告)号：US20080317848A2
公开(公告)日：2008-12-25
申请号：US10492270
申请日：2004-04-08
申请人： Thomas Gramatte , Peter Gruber , Michael Heschel , Dirk Pamperin , Jan Ploen , Steffen Scheithauer , Wolfgang Wehner , Peter Guldner
发明人： Thomas Gramatte , Peter Gruber , Michael Heschel , Dirk Pamperin , Jan Ploen , Steffen Scheithauer , Wolfgang Wehner , Peter Guldner
IPC分类号： A61K31/445 , A61K9/20
CPC分类号： A61K9/2009 , A61K9/2054 , A61K9/2846 , A61K9/5026 , A61K9/5078 , A61K31/445
摘要： By suitable retardation oral pharmaceutical compositions containing propiverine or one or several pharmaceutically acceptable salts thereof in an amount of 4 mg to 60 mg propiverine and having a prolonged release of the active agent are produced. Preferably a blend of active agent and optionally one or more acidic substances having a pKa value of less than 6.65 are provided with a retarding coating or are embedded in a matrix which is then optionally coated with further retarding layers.
摘要翻译： 通过合适的阻滞剂，可以制备含有丙哌嗪或其一种或多种药学上可接受的盐的药物组合物，其量为4mg至60mg propiverine并且具有延长的活性剂释放。 优选地，具有pKa值小于6.65的活性剂和任选的一种或多种酸性物质的混合物具有延迟涂层或嵌入基质中，然后任选地涂覆有进一步的阻滞层。
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公开(公告)号：US20070246518A1
公开(公告)日：2007-10-25
申请号：US11409233
申请日：2006-04-21
CPC分类号： B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
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公开(公告)号：US20070246516A1
公开(公告)日：2007-10-25
申请号：US11409242
申请日：2006-04-21
CPC分类号： B23K3/0638 , B23K1/0016 , B23K3/0623 , B23K2101/40 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K3/3478 , H05K3/3484 , H05K2201/09945 , H05K2203/0113 , H05K2203/043 , H01L2924/00
摘要： A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.
摘要翻译： 公开了一种用于将导电接合材料施加到基底的系统，方法和装置。 该方法包括在模具的多个空腔中提供导电接合材料。 多个空腔中的空腔的总数大于对应于模具的电路支撑衬底的至少一个导电焊盘的总数。 将模具中的导电接合材料加热至导电接合材料的回流温度。 在至少一个空腔中至少一个可润湿表面被放置成与被加热的导电接合材料基本接触。 模具和相应的电路支撑衬底彼此靠近，使得至少一个空腔中的加热的导电接合材料与相应的电路支撑衬底的至少一个导电焊盘接触。
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公开(公告)号：US20070029277A1
公开(公告)日：2007-02-08
申请号：US11195147
申请日：2005-08-02
CPC分类号： H01L27/14685 , B29D11/00365 , B29D11/00461 , B82Y30/00 , G02B3/0018 , G02B3/0056 , G02F1/137 , G02F1/29 , H01L27/14627 , H01L31/02327 , H01L33/58
摘要： A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.
摘要翻译： 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。
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10.发明申请公开(公告)号：US20060124927A1
公开(公告)日：2006-06-15
申请号：US10905013
申请日：2004-12-09
申请人： Robert Groves , Peter Gruber , Kevin Petrarca , Richard Volant , George Walker
发明人： Robert Groves , Peter Gruber , Kevin Petrarca , Richard Volant , George Walker
CPC分类号： H05K3/3468 , G01R1/07314 , G01R3/00 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L2224/13099 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H05K3/325 , H05K2201/09745 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/128 , H05K2203/162 , H05K2203/167 , H01L2224/0401
摘要： Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.
摘要翻译： 公开了在封装之前在基板上形成导电结构的方法和根据该方法生成的测试探针结构。 导电结构包括通过注射成型的焊料形成的高纵横比结构。 本发明可以应用于在典型的BEOL之后以及在封装之前在常规半导体衬底上形成无源元件和互连。 该方法可以为导电结构提供更好的电迁移特性，较低的电阻率和更高的Q因子。 此外，该方法可以向后兼容并可定制。
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