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公开(公告)号：US10597485B2
公开(公告)日：2020-03-24
申请号：US16477353
申请日：2017-10-17
发明人： Shingo Tanaka , Tomoko Higashiuchi , Naoki Maruyama , Kazumasa Fukuda , Yoshitaka Takezawa , Fusao Hojo
摘要： A production method for a glassy liquid-crystalline epoxy resin, comprising a process of cooling a liquid-crystalline epoxy resin to cause transition into a glassy state.
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公开(公告)号：US09634210B2
公开(公告)日：2017-04-25
申请号：US14405933
申请日：2013-06-06
CPC分类号： H01L33/62 , H01L33/44 , H01L33/486 , H01L33/52 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
摘要： There is provided a production method for an optical semiconductor device including a substrate having a silver plating layer formed on a surface and a light emitting diode bonded to the silver plating layer. The production method includes a film formation step of forming a clay film covering the silver plating layer and a connection step of electrically connecting the light emitting diode and the silver plating layer covered with the clay film by wire bonding, after the film formation step.
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3.发明授权公开(公告)号：US09334573B2
公开(公告)日：2016-05-10
申请号：US14372519
申请日：2013-01-16
发明人： Tomoko Higashiuchi , Nobuaki Takane , Masashi Yamaura , Maki Inada , Hiroshi Yokota , Kazuyuki Kamo
IPC分类号： C23F11/00 , C09D1/00 , C09D201/00 , C23F11/18 , H01L33/44 , H01L33/56 , H01L33/60 , C09D1/02 , C09D7/12 , C01B33/26 , C08K3/34 , C08K7/10
CPC分类号： C23F11/00 , C01B33/26 , C08K3/34 , C08K7/10 , C09D1/00 , C09D1/02 , C09D7/70 , C09D201/00 , C23F11/182 , H01L33/44 , H01L33/56 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/8592 , H01L2924/0002 , H01L2924/00 , H01L2924/00014
摘要： The silver surface treatment agent of the present invention contains a layered silicate compound. The light-emitting device of the present invention comprises a substrate having a silver-plated layer; a light-emitting diode mounted on the substrate; and a film, provided on a surface of the silver-plated layer, containing a layered silicate compound.
摘要翻译： 本发明的银表面处理剂含有层状硅酸盐化合物。 本发明的发光装置包括具有镀银层的基板; 安装在所述基板上的发光二极管; 以及设置在镀银层的表面上的含有层状硅酸盐化合物的膜。
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4.发明授权公开(公告)号：US11840600B2
公开(公告)日：2023-12-12
申请号：US16642532
申请日：2017-08-30
CPC分类号： C08G59/245 , C08G59/4085 , C08G59/5033 , C08L63/00 , C08L2201/08 , C08L2203/30
摘要： A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.
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5.发明申请SILVER-SULFIDATION-PREVENTING MATERIAL AND METHOD FOR FORMING SILVER-SULFIDATION-PREVENTING FILM, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE 审中-公开用于形成防硫化防止膜的防硫磺预防材料和方法，以及用于生产发光装置和发光装置的方法公开(公告)号：US20150175811A1
公开(公告)日：2015-06-25
申请号：US14415815
申请日：2013-07-17
CPC分类号： C09D5/084 , C08K3/346 , C09D7/61 , C09D175/08 , H01L33/44 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/8592 , H01L2933/0025 , H01L2933/0058 , H01L2924/00014
摘要： A silver-sulfidation-preventing material of the present invention comprises clay and a binder.
摘要翻译： 本发明的耐银防硫材料包括粘土和粘合剂。
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公开(公告)号：US10800872B2
公开(公告)日：2020-10-13
申请号：US16341559
申请日：2017-10-13
摘要： An epoxy resin, comprising an epoxy compound having a mesogen structure, wherein, when performing a process of decreasing a temperature of the epoxy resin from 150° C. to 30° C. at a rate of 2° C./min, and a process of increasing the temperature of the epoxy resin from 30° C. to 150° C. at a rate of 2° C./min, in this order, the epoxy resin has a maximum value of η′2/η′1 of 20 or less within a temperature range of from 30° C. to 150° C., wherein η′1 is a dynamic shear viscosity (Pa·s) measured in the process of decreasing the temperature, and η′2 is a dynamic shear viscosity (Pa·s) measured in the process of increasing the temperature, η′1 and η′2 being measured at the same temperature, and a value η′2 measured at 100° C. is 1000 Pa·s or less.
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公开(公告)号：US10646851B2
公开(公告)日：2020-05-12
申请号：US15544414
申请日：2016-01-19
IPC分类号： B01J20/32 , G01N30/88 , C08J7/04 , B01J20/24 , B01D15/36 , B01J20/26 , B01J20/28 , B01J20/285 , B01J20/30 , B01J41/14 , C07K1/18 , B01J20/281 , C07K1/16
摘要： The present invention provides a separation material comprising porous polymer particles that comprise a styrene-based monomer as a monomer unit; and a coating layer that comprises a macromolecule having hydroxyl groups and covers at least a portion of the surface of the porous polymer particles, wherein the rupture strength is 10 mN or higher.
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公开(公告)号：US09525114B2
公开(公告)日：2016-12-20
申请号：US14405946
申请日：2013-06-06
CPC分类号： H01L33/60 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/00
摘要： An optical semiconductor device includes a substrate that has a silver plating layer formed on a surface, a light emitting diode that is bonded to the silver plating layer, a light reflecting portion that surrounds the light emitting diode, a transparent sealing portion that is filled into the light reflecting portion and seals the light emitting diode, and a clay film that covers the silver plating layer. The transparent sealing portion and the light reflecting portion are bonded to each other.
摘要翻译： 光学半导体器件包括：表面形成有银镀层的基板，与镀银层接合的发光二极管，围绕发光二极管的光反射部，填充于该发光二极管的透光密封部 光反射部分并密封发光二极管，以及覆盖银镀层的粘土膜。 透明密封部和光反射部彼此接合。
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9.发明申请OPTICAL SEMICONDUCTOR DEVICE PRODUCTION METHOD AND OPTICAL SEMICONDUCTOR DEVICE 有权光学半导体器件生产方法和光学半导体器件公开(公告)号：US20150194584A1
公开(公告)日：2015-07-09
申请号：US14405933
申请日：2013-06-06
CPC分类号： H01L33/62 , H01L33/44 , H01L33/486 , H01L33/52 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
摘要： There is provided a production method for an optical semiconductor device including a substrate having a silver plating layer formed on a surface and a light emitting diode bonded to the silver plating layer. The production method includes a film formation step of forming a clay film covering the silver plating layer and a connection step of electrically connecting the light emitting diode and the silver plating layer covered with the clay film by wire bonding, after the film formation step.
摘要翻译： 提供了一种用于光学半导体器件的制造方法，该光学半导体器件包括具有形成在表面上的镀银层的基板和结合到镀银层的发光二极管。 该制造方法包括：成膜步骤，其形成覆盖银镀层的粘土膜，以及在成膜步骤之后，通过引线键合将发光二极管和覆盖有粘土膜的镀银层电连接的连接步骤。
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公开(公告)号：US20150171293A1
公开(公告)日：2015-06-18
申请号：US14405946
申请日：2013-06-06
CPC分类号： H01L33/60 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/00
摘要： An optical semiconductor device includes a substrate that has a silver plating layer formed on a surface, a light emitting diode that is bonded to the silver plating layer, a light reflecting portion that surrounds the light emitting diode, a transparent sealing portion that is filled into the light reflecting portion and seals the light emitting diode, and a clay film that covers the silver plating layer. The transparent sealing portion and the light reflecting portion are bonded to each other.
摘要翻译： 光学半导体器件包括：表面形成有银镀层的基板，与镀银层接合的发光二极管，围绕发光二极管的光反射部，填充于该发光二极管的透光密封部 光反射部分并密封发光二极管，以及覆盖银镀层的粘土膜。 透明密封部和光反射部彼此接合。
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