公开(公告)号：US08853560B2

公开(公告)日：2014-10-07

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US08699234B2

公开(公告)日：2014-04-15

申请号：US12984935

申请日：2011-01-05

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K1/18

CPC分类号： H05K1/0236 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H05K3/4694

摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.

摘要翻译： 其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。 第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。 第二板部分位于第一板部分的下表面上。 电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

公开(公告)号：US08289099B2

公开(公告)日：2012-10-16

申请号：US12568362

申请日：2009-09-28

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H03H7/00

CPC分类号： H01P1/2005 ,  H01P1/203 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.

摘要翻译： 电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

公开(公告)号：US20110067914A1

公开(公告)日：2011-03-24

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US20090145646A1

公开(公告)日：2009-06-11

申请号：US12230871

申请日：2008-09-05

申请人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

发明人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

IPC分类号： H01G4/228 ,  H05K1/18

CPC分类号： H01P1/20327 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.

摘要翻译： 根据本发明，电路板可以包括电介质层; 多个导电板; 以及缝合通孔，以将两个导电板彼此电连接。 这里，缝合通孔可以分别包括通过电介质层的第一通孔和第二通孔，并且具有一个端部与两个导电板中的每一个放置在同一平面上; 连接图案，其每个端部分别连接到第一通孔和第二通孔的另一端部; 和第一延伸图案，其放置在与导电板之一相同的平面上，并且具有一个端部连接到第一通孔的一个端部，并且端部连接到导电板之一。

公开(公告)号：US08279616B2

公开(公告)日：2012-10-02

申请号：US13064541

申请日：2011-03-30

申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.

摘要翻译： 具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。

公开(公告)号：US20120162934A1

公开(公告)日：2012-06-28

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K7/00

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US20110163823A1

公开(公告)日：2011-07-07

申请号：US12983073

申请日：2010-12-31

申请人： Dae-Hyun PARK ,  Han Kim ,  Myung-Sam Kang

发明人： Dae-Hyun PARK ,  Han Kim ,  Myung-Sam Kang

IPC分类号： H04B3/28

CPC分类号： H05K1/0236 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/097

摘要： In an electromagnetic bandgap structure including a plurality of conductive plates and a stitching via part, in which the plurality of conductive plates are placed on a first planar surface, the stitching via part includes a first via having one end part connected to one of the two conductive plates, a second via having one end part connected to the other of the two conductive plates, a spiral connector forming a spirally-shaped serial link structure on at least one vertical planar surface that is perpendicular to the first planar surface, a first conductive pattern connecting one end part of the spiral connector and the other end part of the first via with each other and a second conductive connecting pattern connecting the other end part of the spiral connector and the other end part of the second via with each other.

摘要翻译： 在包括多个导电板和缝合通孔部分的电磁带隙结构中，其中多个导电板被放置在第一平坦表面上，该缝合通孔部分包括第一通孔，该第一通孔的一个端部连接到两个 导电板，具有连接到两个导电板中的另一个的一个端部的第二通孔，在垂直于第一平坦表面的至少一个垂直平面上形成螺旋形串联结构的螺旋形连接器，第一导电 螺旋连接器的一个端部和第一通孔的另一个端部彼此连接的图案，以及将螺旋形连接器的另一个端部和第二通孔的另一个端部彼此连接的第二导电连接图案。

公开(公告)号：US20110067917A1

公开(公告)日：2011-03-24

申请号：US12654526

申请日：2009-12-22

申请人： Dae-Hyun Park ,  Han Kim ,  Kang-Wook Bong

发明人： Dae-Hyun Park ,  Han Kim ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0231 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/09627 ,  H05K2201/09881 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.

摘要翻译： 公开了一种包括电磁带隙结构的印刷电路板。 包括用于层间绝缘并用于阻挡噪声的第一介电材料的电磁带隙结构被插入到印刷电路板中。 电磁带隙结构可以包括第一导电板，布置在与第一导电板不同的平面上的第二导电板，布置在与第一导电板相同的平坦表面上的第三导电板，以及缝合 通孔单元被配置为通过其上布置有第二导电板的平面连接第一导电板和第三导电板。 具有不同于第一介电材料的介电常数的第二介电材料插入在第一导电板，第二导电板和第三导电板中的任何两个之间。

公开(公告)号：US20110061925A1

公开(公告)日：2011-03-17

申请号：US12654307

申请日：2009-12-16

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K9/00

CPC分类号： H05K1/0233 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0236 ,  H05K1/112 ,  H05K2201/086 ,  H05K2201/1003 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.

摘要翻译： 公开了一种包括电磁带隙结构的印刷电路板。 用于阻挡噪声的电磁带隙结构被插入到印刷电路板中。 电磁带隙结构可以包括第一导电板; 布置在与第一导电板不同的平面上的第二导电板; 布置在与第二导电板的平面不同的平面上的第三导电板; 以及缝合通孔单元，其被配置为通过旁路布置所述第二导电板的平面并且包括第一电感器元件来连接所述第一导电板和所述第三导电板。