公开(公告)号：US20140001514A1

公开(公告)日：2014-01-02

申请号：US13539944

申请日：2012-07-02

申请人： Hans-Joachim Schulze ,  Franz Hirler ,  Anton Mauder ,  Helmut Strack ,  Frank Kahlmann ,  Gerhard Miller

发明人： Hans-Joachim Schulze ,  Franz Hirler ,  Anton Mauder ,  Helmut Strack ,  Frank Kahlmann ,  Gerhard Miller

IPC分类号： H01L29/36 ,  H01L21/225

CPC分类号： H01L29/66348 ,  H01L21/2205 ,  H01L21/2658 ,  H01L29/0619 ,  H01L29/0634 ,  H01L29/0638 ,  H01L29/0878 ,  H01L29/102 ,  H01L29/1095 ,  H01L29/165 ,  H01L29/167 ,  H01L29/36 ,  H01L29/402 ,  H01L29/404 ,  H01L29/407 ,  H01L29/7397 ,  H01L29/7428 ,  H01L29/7802 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7816 ,  H01L29/861 ,  H01L29/872

摘要： A semiconductor device includes a device region. The device region includes at least one device region section including dopant atoms of a first doping type and with a first doping concentration of at least 1E16 cm−3 and dopant atoms of a second doping type and with a second doping concentration of at least 1E16 cm−3.

摘要翻译： 半导体器件包括器件区域。 器件区域包括至少一个器件区域部分，其包括第一掺杂类型的掺杂剂原子和具有至少1E16cm-3的第一掺杂浓度和第二掺杂类型的掺杂剂原子，并且具有至少1E16cm的第二掺杂浓度 -3。

公开(公告)号：US20120256250A1

公开(公告)日：2012-10-11

申请号：US13082679

申请日：2011-04-08

申请人： Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Franz Hirler

发明人： Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Franz Hirler

IPC分类号： H01L27/06 ,  H01L21/336

CPC分类号： H01L21/823487 ,  H01L27/0694 ,  H01L27/1207 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor component includes a sequence of layers, the sequence of layers including a first insulator layer, a first semiconductor layer disposed on the first insulator layer, a second insulator layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the second insulator layer. The semiconductor component also includes a plurality of devices at least partly formed in the first semiconductor layer. A first one of the plurality of devices is a power transistor formed in a first region of the first semiconductor layer and a first region of the second semiconductor layer. The first region of the first and second semiconductor layers are in electrical contact with one another through a first opening in the second insulator layer.

摘要翻译： 半导体部件包括一层层，所述层序列包括第一绝缘体层，设置在第一绝缘体层上的第一半导体层，设置在第一半导体层上的第二绝缘体层，以及设置在第二绝缘体层上的第二半导体层 绝缘体层。 半导体部件还包括至少部分地形成在第一半导体层中的多个器件。 多个器件中的第一个是在第一半导体层的第一区域和第二半导体层的第一区域中形成的功率晶体管。 第一和第二半导体层的第一区域通过第二绝缘体层中的第一开口彼此电接触。

公开(公告)号：US20080067626A1

公开(公告)日：2008-03-20

申请号：US11834154

申请日：2007-08-06

申请人： Franz Hirler ,  Thoralf Kautzsch ,  Anton Mauder ,  Michael Rueb ,  Hans-Joachim Schulze ,  Helmut Strack ,  Armin Willmeroth

发明人： Franz Hirler ,  Thoralf Kautzsch ,  Anton Mauder ,  Michael Rueb ,  Hans-Joachim Schulze ,  Helmut Strack ,  Armin Willmeroth

IPC分类号： H01L29/94 ,  H01L21/76

CPC分类号： H01L21/76224 ,  H01L21/3247 ,  H01L29/0653 ,  H01L29/407 ,  H01L29/66621 ,  H01L29/7803 ,  H01L29/7804

摘要： A semiconductor device, in which a first trench section is produced proceeding from a surface of a semiconductor body into the semiconductor body. A semiconductor layer is produced above the surface and above the first trench section. A further trench section is produced in the semiconductor layer in such a way that the first trench section and the further trench section form a continuous trench structure.

摘要翻译： 一种半导体器件，其中制造从半导体本体的表面进入半导体本体的第一沟槽部分。 在表面上方和第一沟槽部分之上产生半导体层。 在半导体层中产生另一沟槽部分，使得第一沟槽部分和另外的沟槽部分形成连续的沟槽结构。

公开(公告)号：US08541833B2

公开(公告)日：2013-09-24

申请号：US13082679

申请日：2011-04-08

申请人： Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Franz Hirler

发明人： Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Franz Hirler

IPC分类号： H01L29/66 ,  H01L21/70

CPC分类号： H01L21/823487 ,  H01L27/0694 ,  H01L27/1207 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor component includes a sequence of layers, the sequence of layers including a first insulator layer, a first semiconductor layer disposed on the first insulator layer, a second insulator layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the second insulator layer. The semiconductor component also includes a plurality of devices at least partly formed in the first semiconductor layer. A first one of the plurality of devices is a power transistor formed in a first region of the first semiconductor layer and a first region of the second semiconductor layer. The first region of the first and second semiconductor layers are in electrical contact with one another through a first opening in the second insulator layer.

摘要翻译： 半导体部件包括一层层，所述层序列包括第一绝缘体层，设置在第一绝缘体层上的第一半导体层，设置在第一半导体层上的第二绝缘体层，以及设置在第二绝缘体层上的第二半导体层 绝缘体层。 半导体部件还包括至少部分地形成在第一半导体层中的多个器件。 多个器件中的第一个是在第一半导体层的第一区域和第二半导体层的第一区域中形成的功率晶体管。 第一和第二半导体层的第一区域通过第二绝缘体层中的第一开口彼此电接触。

公开(公告)号：US08786012B2

公开(公告)日：2014-07-22

申请号：US13542737

申请日：2012-07-06

申请人： Anton Mauder ,  Franz Hirler ,  Wolfgang Lehnert ,  Rudolf Berger ,  Klemens Pruegl ,  Hans-Joachim Schulze ,  Helmut Strack

发明人： Anton Mauder ,  Franz Hirler ,  Wolfgang Lehnert ,  Rudolf Berger ,  Klemens Pruegl ,  Hans-Joachim Schulze ,  Helmut Strack

IPC分类号： H01L29/66

CPC分类号： H01L21/28194 ,  H01L21/02109 ,  H01L21/02145 ,  H01L21/0228 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/407 ,  H01L29/408 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/51 ,  H01L29/513 ,  H01L29/66734 ,  H01L29/7393 ,  H01L29/7394 ,  H01L29/7397 ,  H01L29/7803 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7835 ,  H01L29/792 ,  H01L29/8611

摘要： A power semiconductor device has a semiconductor body which includes an active area and a peripheral area which both define a horizontal main surface of the semiconductor body. The semiconductor body further includes an n-type semiconductor layer, a pn junction and at least one trench. The n-type semiconductor layer is embedded in the semiconductor body and extends to the main surface in the peripheral area. The pn junction is arranged between the n-type semiconductor layer and the main surface in the active area. The at least one trench extends in the peripheral area from the main surface into the n-type semiconductor layer and includes a dielectric layer with fixed negative charges. In the vertical direction, the dielectric layer is arranged both below and above the pn junction. The dielectric layer with fixed negative charges typically has a negative net charge. Further, a method for forming a semiconductor device is provided.

摘要翻译： 功率半导体器件具有半导体本体，该半导体本体包括有源区域和限定半导体本体的水平主表面的周边区域。 半导体本体还包括n型半导体层，pn结和至少一个沟槽。 n型半导体层嵌入半导体本体中并延伸到周边区域的主表面。 pn结布置在有源区域中的n型半导体层和主表面之间。 至少一个沟槽在外围区域中从主表面延伸到n型半导体层中，并且包括具有固定的负电荷的电介质层。 在垂直方向上，介电层布置在pn结的下方和上方。 具有固定负电荷的电介质层通常具有负的净电荷。 此外，提供了一种用于形成半导体器件的方法。

公开(公告)号：US08748974B2

公开(公告)日：2014-06-10

申请号：US13542737

申请日：2012-07-06

申请人： Anton Mauder ,  Franz Hirler ,  Wolfgang Lehnert ,  Rudolf Berger ,  Klemens Pruegl ,  Hans-Joachim Schulze ,  Helmut Strack

发明人： Anton Mauder ,  Franz Hirler ,  Wolfgang Lehnert ,  Rudolf Berger ,  Klemens Pruegl ,  Hans-Joachim Schulze ,  Helmut Strack

IPC分类号： H01L29/66

摘要： A power semiconductor device has a semiconductor body which includes an active area and a peripheral area which both define a horizontal main surface of the semiconductor body. The semiconductor body further includes an n-type semiconductor layer, a pn junction and at least one trench. The n-type semiconductor layer is embedded in the semiconductor body and extends to the main surface in the peripheral area. The pn junction is arranged between the n-type semiconductor layer and the main surface in the active area. The at least one trench extends in the peripheral area from the main surface into the n-type semiconductor layer and includes a dielectric layer with fixed negative charges. In the vertical direction, the dielectric layer is arranged both below and above the pn junction. The dielectric layer with fixed negative charges typically has a negative net charge. Further, a method for forming a semiconductor device is provided.

公开(公告)号：US20120286355A1

公开(公告)日：2012-11-15

申请号：US13542737

申请日：2012-07-06

申请人： Anton Mauder ,  Franz Hirler ,  Wolfgang Lehnert ,  Rudolf Berger ,  Klemens Pruegl ,  Hans-Joachim Schulze ,  Helmut Strack

发明人： Anton Mauder ,  Franz Hirler ,  Wolfgang Lehnert ,  Rudolf Berger ,  Klemens Pruegl ,  Hans-Joachim Schulze ,  Helmut Strack

IPC分类号： H01L29/78 ,  H01L21/302 ,  H01L29/02

CPC分类号： H01L21/28194 ,  H01L21/02109 ,  H01L21/02145 ,  H01L21/0228 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/407 ,  H01L29/408 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/51 ,  H01L29/513 ,  H01L29/66734 ,  H01L29/7393 ,  H01L29/7394 ,  H01L29/7397 ,  H01L29/7803 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7835 ,  H01L29/792 ,  H01L29/8611

摘要： A power semiconductor device has a semiconductor body which includes an active area and a peripheral area which both define a horizontal main surface of the semiconductor body. The semiconductor body further includes an n-type semiconductor layer, a pn junction and at least one trench. The n-type semiconductor layer is embedded in the semiconductor body and extends to the main surface in the peripheral area. The pn junction is arranged between the n-type semiconductor layer and the main surface in the active area. The at least one trench extends in the peripheral area from the main surface into the n-type semiconductor layer and includes a dielectric layer with fixed negative charges. In the vertical direction, the dielectric layer is arranged both below and above the pn junction. The dielectric layer with fixed negative charges typically has a negative net charge. Further, a method for forming a semiconductor device is provided.

摘要翻译： 功率半导体器件具有半导体本体，该半导体本体包括有源区域和限定半导体本体的水平主表面的周边区域。 半导体本体还包括n型半导体层，pn结和至少一个沟槽。 n型半导体层嵌入半导体本体中并延伸到周边区域的主表面。 pn结布置在有源区域中的n型半导体层和主表面之间。 至少一个沟槽在外围区域中从主表面延伸到n型半导体层中，并且包括具有固定的负电荷的电介质层。 在垂直方向上，介电层布置在pn结的下方和上方。 具有固定负电荷的电介质层通常具有负的净电荷。 此外，提供了一种用于形成半导体器件的方法。

公开(公告)号：US10651037B2

公开(公告)日：2020-05-12

申请号：US11232735

申请日：2005-09-22

申请人： Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Holger Schulze

发明人： Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Holger Schulze

IPC分类号： H01L21/265 ,  H01L29/66 ,  H01L21/304 ,  H01L29/10 ,  H01L21/324 ,  H01L21/263 ,  H01L29/08

摘要： One embodiment of the invention relates to a method for fabricating a doped semiconductor zone in a semiconductor body. The method includes implanting dopant particles via one side into the semiconductor body or applying a layer containing dopant particles to one side of the semiconductor body. The method also includes irradiating the semiconductor body via the one side with further particles at least in the region containing the dopant particles. The method finally includes carrying out a thermal treatment by means of which the semiconductor body is heated, at least in the region containing the dopant particles, to a predetermined temperature in order to activate the implanted dopant particles, said temperature being less than 700° C.

公开(公告)号：US07795660B2

公开(公告)日：2010-09-14

申请号：US11223210

申请日：2005-09-12

申请人： Anton Mauder ,  Hans-Joachim Schulze ,  Helmut Strack

发明人： Anton Mauder ,  Hans-Joachim Schulze ,  Helmut Strack

IPC分类号： H01L29/94

CPC分类号： H01L29/66181 ,  H01L27/10861 ,  H01L28/82

摘要： A capacitor structure includes: a number of conductive regions of metallic and/or semiconducting materials and/or conductive metal compounds thereof, the conductive regions being arranged as stacked layers in a trench structure of a semiconductor device; and a dielectric surrounding the conductive regions.

摘要翻译： 电容器结构包括：多个金属和/或半导体材料的导电区域和/或其导电金属化合物，所述导电区域被布置为半导体器件的沟槽结构中的堆叠层; 以及围绕导电区域的电介质。

公开(公告)号：US07554137B2

公开(公告)日：2009-06-30

申请号：US11552804

申请日：2006-10-25

申请人： Stefan Sedlmaier ,  Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Armin Willmeroth ,  Frank Pfirsch

发明人： Stefan Sedlmaier ,  Hans-Joachim Schulze ,  Anton Mauder ,  Helmut Strack ,  Armin Willmeroth ,  Frank Pfirsch

IPC分类号： H01L29/732 ,  H01L29/423

CPC分类号： H01L29/7811 ,  H01L21/2205 ,  H01L21/2252 ,  H01L21/2255 ,  H01L23/291 ,  H01L23/298 ,  H01L29/0634 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/1604 ,  H01L29/1608 ,  H01L29/165 ,  H01L29/66712 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor component (1) with charge compensation structure (3) has a semiconductor body (4) having a drift path (5) between two electrodes (6, 7). The drift path (5) has drift zones of a first conduction type, which provide a current path between the electrodes (6, 7) in the drift path, while charge compensation zones (11) of a complementary conduction type constrict the current path of the drift path (5). For this purpose, the drift path (5) has two alternately arranged, epitaxially grown diffusion zone types (9, 10), the first drift zone type (9) having monocrystalline semiconductor material on a monocrystalline substrate (12), and a second drift zone type (10) having monocrystalline semiconductor material in a trench structure (13), with complementarily doped walls (14, 15), the complementarily doped walls (14, 15) forming the charge compensation zones (11).

摘要翻译： 具有电荷补偿结构（3）的半导体部件（1）具有在两个电极（6,7）之间具有漂移路径（5）的半导体本体（4）。 漂移路径（5）具有第一导电类型的漂移区，其在漂移路径中的电极（6,7）之间提供电流路径，而互补导电类型的电荷补偿区域（11） 漂移路径（5）。 为此，漂移路径（5）具有两个交替布置的外延生长的扩散区类型（9,10），在单晶衬底（12）上具有单晶半导体材料的第一漂移区类型（9）和第二漂移 在沟槽结构（13）中具有单晶半导体材料的具有互补掺杂壁（14,15）的区域型（10），形成电荷补偿区（11）的互补掺杂壁（14,15）。