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    Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
    5.
    发明授权
    Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device 有权
    热固性光反射树脂组合物，其制造的光半导体元件安装板，其制造方法和光半导体装置

    公开(公告)号：US08785525B2

    公开(公告)日：2014-07-22

    申请号：US12679749

    申请日：2008-09-25

    申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

    发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

    IPC分类号： C08K7/24 ,  C08K3/22 ,  C08L63/00

    CPC分类号： C08G59/3245 ,  C08G77/445 ,  C08L63/00 ,  C08L83/10 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10T428/1068 ,  C08L83/00 ,  H01L2924/00 ,  H01L2224/0401

    摘要： There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

    摘要翻译： 提供了具有光学半导体元件安装板所需的各种特性的高水平的热固性光反射树脂组合物，例如光学性质和耐热变色性，在模塑过程中提供高的脱模性，例如传递模塑，并且允许成型工艺 连续执行。 还提供了一种高可靠性的光学半导体元件安装板和各自用树脂组合物制造的光学半导体装置及其有效生产的方法。 制备并使用热固性光反射树脂组合物，其包括（A）环氧树脂，（B）固化剂，（C）固化催化剂，（D）无机填料，（E）白色颜料， F）添加剂和（G）脱模剂作为主要成分，其中，所述树脂组合物在固化后在400nm的光波长下具有80％以上的漫反射率; 并且树脂组合物可以连续进行100次以上的传递成型。

    THERMOSETTING LIGHT-REFLECTING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT MOUNTING BOARD PRODUCED THEREWITH, METHOD FOR MANUFACTURE THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE
    9.
    发明申请
    THERMOSETTING LIGHT-REFLECTING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT MOUNTING BOARD PRODUCED THEREWITH, METHOD FOR MANUFACTURE THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE 有权
    热成型光聚合树脂组合物，其制造的光学半导体元件安装板，其制造方法和光学半导体器件

    公开(公告)号：US20100200882A1

    公开(公告)日：2010-08-12

    申请号：US12679749

    申请日：2008-09-25

    申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

    发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

    IPC分类号： H01L33/52 ,  G02F1/361 ,  C09K19/38 ,  H01L33/20

    CPC分类号： C08G59/3245 ,  C08G77/445 ,  C08L63/00 ,  C08L83/10 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10T428/1068 ,  C08L83/00 ,  H01L2924/00 ,  H01L2224/0401

    摘要： There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

    摘要翻译： 提供了具有光学半导体元件安装板所需的各种特性的高水平的热固性光反射树脂组合物，例如光学性能和耐热变色性，在模制过程中提供高的脱模性，例如传递模塑，并且允许成型工艺 连续执行。 还提供了一种高可靠性的光学半导体元件安装板和各自用树脂组合物制造的光学半导体装置及其有效生产的方法。 制备并使用热固性光反射树脂组合物，其包括（A）环氧树脂，（B）固化剂，（C）固化催化剂，（D）无机填料，（E）白色颜料， F）添加剂和（G）脱模剂作为主要成分，其中，所述树脂组合物在固化后在400nm的光波长下具有80％以上的漫反射率; 并且树脂组合物可以连续进行100次以上的传递成型。

    WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION OF THE SAME
    10.
    发明申请
    WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION OF THE SAME 审中-公开
    接线板，电子设备包装及其生产方法

    公开(公告)号：US20110297424A1

    公开(公告)日：2011-12-08

    申请号：US13202800

    申请日：2010-02-22

    申请人： Hideki Yoshida ,  Satoshi Isoda ,  Naoyuki Urasaki ,  Hayato Kotani

    发明人： Hideki Yoshida ,  Satoshi Isoda ,  Naoyuki Urasaki ,  Hayato Kotani

    IPC分类号： H05K1/02 ,  H05K3/02

    CPC分类号： G02B5/12 ,  G02F1/133553 ,  G02F1/136286 ,  G02F2203/12 ,  H05K1/0274 ,  H05K3/244 ,  H05K3/28 ,  H05K3/285 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/025 ,  Y10T29/49156

    摘要： A wiring board which uses both conductor patterns and reflection members provided at gaps therebetween to suppress unevenness in the reflection rate so as to raise the overall reflection rate and provide a reflection function on the surface of the wiring board at the side where an electronic device is mounted; facilitates shaping of the reflection members, controlling of the thickness of the reflection members, and controlling of the surface shape of the reflection members so as to stabilize the reflection rate; and secures close contact between the reflection members and sealing members so as to improve reliability. The wiring board comprises a plurality of wiring layers provided with conductor patterns disposed on base members, and base members which electrically insulate the plurality of wiring layers. At the outermost wiring layer among the plurality of wiring layers, reflection members are formed on the portions of the base member where there are no conductor patterns, the surface of these reflection members and the surface of the conductor patterns are made level and the surface of the conductor patterns are exposed from the reflection members.

    摘要翻译： 一种布线板，其使用两个导体图案和设置在其间的间隙的反射构件，以抑制反射率的不均匀性，以提高整体反射率，并且在电子设备的一侧在布线板的表面上提供反射功能 安装; 有助于反射构件的成形，反射构件的厚度的控制，以及反射构件的表面形状的控制以使反射率稳定; 并且确保反射构件和密封构件之间的紧密接触，从而提高可靠性。 布线板包括设置在基底构件上的导体图案的多个布线层和使多个布线层电绝缘的基底构件。 在多个布线层中的最外面布线层处，在不存在导体图形的基底部件上形成有反射部件，这些反射部件的表面和导体图案的表面形成为水平面， 导体图案从反射构件露出。