公开(公告)号：US06641912B2

公开(公告)日：2003-11-04

申请号：US09936578

申请日：2001-09-13

申请人： Hideaki Ishizawa ,  Munehiro Hatai ,  Masakazu Nakata ,  Motohiro Yagi

发明人： Hideaki Ishizawa ,  Munehiro Hatai ,  Masakazu Nakata ,  Motohiro Yagi

IPC分类号： C09J16700

CPC分类号： C09J167/00 ,  C09J7/10 ,  C09J7/38 ,  C09J2467/00 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2852 ,  Y10T428/287

摘要： An objective is to provide a pressure-sensitive adhesive composition which shows pressure-sensitive adhesive properties at ordinary temperature, has the ability to cure upon irradiation and after photocure exhibits improved bond strength relative to high-polarity adherends, such as PET, PVC and metals, and improved moist heat-resisting bond strength, a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet obtained from the aforementioned pressure-sensitive adhesive composition. A photocurable pressure-sensitive adhesive composition containing a polyester resin having a glass transition temperature (Tg) of 25° C. or above, a cationically photopolymerizable compound and a cationic photoinitiator.

摘要翻译： 目的是提供一种在常温下显示出压敏粘合剂性能的压敏粘合剂组合物，具有在照射下固化的能力，并且光固化后相对于高极性被粘物例如PET，PVC和金属显示出改善的粘合强度 以及改善的耐湿热粘合强度，由上述压敏粘合剂组合物获得的压敏粘合剂和压敏粘合片。1，一种光固化型压敏粘合剂组合物，其含有玻璃化转变温度（Tg ）为25℃以上，阳离子光聚合性化合物和阳离子光引发剂。

公开(公告)号：US08901207B2

公开(公告)日：2014-12-02

申请号：US13146571

申请日：2010-01-29

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： C09J171/02 ,  C09J163/00 ,  C09J133/06 ,  H01L23/29 ,  H01L23/00 ,  C08L33/06 ,  C08L63/00

CPC分类号： C09J171/02 ,  C08L33/062 ,  C08L63/00 ,  C08L2666/04 ,  C08L2666/14 ,  C09J133/062 ,  C09J163/00 ,  H01L23/295 ,  H01L24/29 ,  H01L2924/15788 ,  H01L2924/00

摘要： It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

摘要翻译： 本发明的一个目的是提供一种用于电子部件的粘合剂，即使在接合薄的电子部件的情况下也能够防止电子部件的翘曲和回流裂纹。 本发明涉及一种电子部件用粘合剂，其包含：具有脂肪族聚醚主链和缩水甘油醚基的环氧化合物; 含环氧基的丙烯酸聚合物; 环硫化合物; 和固化剂，其中相对于100重量份具有脂族聚醚主链和缩水甘油醚基团的环氧化合物，环硫化合物的量为1重量份以上，小于30重量份。

公开(公告)号：US20100197830A1

公开(公告)日：2010-08-05

申请号：US12669081

申请日：2008-07-17

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： C09J163/00

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08K3/36 ,  C09J11/04 ,  C09J163/08 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.

摘要翻译： 本发明的目的是提供一种用于电子部件的粘合剂，涂布性优异，粘合的电子部件中的污渍的防止性高，并且能够提供高可靠性的电子部件。 本发明涉及一种电子部件用液体粘合剂，其含有：固化性化合物; 固化剂; 和无机细颗粒，所述液体粘合剂中的溶解度参数（SP值）在8至11（包括8并且不包括11）的范围内的液体部分，所述无机细颗粒至少包括无机细颗粒 A）和无机微粒（B），平均一次粒径为50nm以下的疏水化度（M值）为30〜50（包括30〜50）的无机微粒（A） 和平均一次粒径为50nm以下，疏水度（M值）为60以上的无机微粒（B）。

公开(公告)号：US20060035995A1

公开(公告)日：2006-02-16

申请号：US11204635

申请日：2005-08-16

申请人： Hideaki Ishizawa ,  Hiroji Fukui ,  Takeo Kuroda

发明人： Hideaki Ishizawa ,  Hiroji Fukui ,  Takeo Kuroda

IPC分类号： C08F2/46

CPC分类号： C09J175/16 ,  C07C271/60 ,  C08G18/10 ,  C08G18/12 ,  C08G18/3206 ,  C08G18/3253 ,  C08G18/8116 ,  C09J175/02 ,  Y10S522/904 ,  C08G18/286 ,  C08G18/8077

摘要： The invention provides compounds which can generate amine by irradiation with light and are excellent both in photodecomposability and in reactivity and compatibility with amine-curable compounds, and photo-setting compositions containing the compounds. The compounds are carbamoyloxyimino compounds represented by the structural formula (I); and the compositions each comprise one or more of the carbamoyloxyimino compounds and an amine-curable compound. In the formula (I), R1 is an n-valent organic group; R2 and R3 are each hydrogen or an aromatic or aliphatic group; and n is an integer of 1 or above.

公开(公告)号：US06864300B2

公开(公告)日：2005-03-08

申请号：US10239890

申请日：2001-03-27

申请人： Hideaki Ishizawa

发明人： Hideaki Ishizawa

IPC分类号： C08F2/46 ,  C08G18/10 ,  C08G18/28 ,  C08G18/32 ,  C08G18/80 ,  C09J175/12 ,  C08J3/00 ,  C08J3/28 ,  C08K3/20 ,  C08L75/00

CPC分类号： C09J175/12 ,  C08G18/10 ,  C08G18/281 ,  C08G18/3253 ,  C08G18/807 ,  C08G18/3225

摘要： A photoreactive adhesive composition which is of the one-pack type, has excellent workability, cures upon irradiation with light, and can have sufficient initial adhesion strength and heat resistance immediately after bonding. The photoreactive adhesive composition comprises a urethane prepolymer and a compound which generates an amine upon irradiation with light, wherein the amine-generating compound is a cobalt/amine complex, O-acyloxime, or carbamic acid derivative.

摘要翻译： 一种单组分型的光反应性粘合剂组合物具有优异的可加工性，在用光照射时固化，并且可以在接合后立即具有足够的初始粘合强度和耐热性。 光反应性粘合剂组合物包含氨基甲酸酯预聚物和在光照射时产生胺的化合物，其中产生胺的化合物是钴/胺络合物，O-酰氧基肟或氨基甲酸衍生物。

公开(公告)号：US08563362B2

公开(公告)日：2013-10-22

申请号：US13255799

申请日：2010-03-10

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： H01L21/44

CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32057 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method for producing a semiconductor chip laminate, which comprises applying an adhesive to a substrate or other semiconductor chip; laminating the semiconductor chip on the substrate or other semiconductor chip via the adhesive; uniformly wetting and spreading the adhesive on an entire region for bonding the semiconductor chip on the substrate or other semiconductor chip; and curing the adhesive. In the application step, an area for applying adhesive is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or other semiconductor chip, immediately after laminating, an area with the adhesive thereon is 60% to less than 100% of the region for bonding the semiconductor chip on the substrate or other semiconductor chip, and in wetting and spreading the adhesive, a viscosity of adhesive between the substrate or other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pas to 30 Pas.

摘要翻译： 一种半导体芯片层叠体的制造方法，其特征在于，在基板或其他半导体芯片上涂布粘合剂; 通过粘合剂将半导体芯片层叠在基板或其他半导体芯片上; 在粘合半导体芯片的基板或其他半导体芯片的整个区域均匀地润湿和铺展粘合剂; 并固化粘合剂。 在涂敷工序中，涂布粘合剂的区域是层叠后的刚刚层叠后的位于基板或其他半导体芯片上的半导体芯片的区域的40〜90％，粘合剂的面积为60〜小于100 用于将半导体芯片接合在基板或其他半导体芯片上的区域的％，并且在润湿和扩散粘合剂时，基板或其它半导体芯片与半导体芯片之间的粘合剂的粘度为0.5rpm为1Pa·s至30Pa·s。

公开(公告)号：US20100076119A1

公开(公告)日：2010-03-25

申请号：US12522755

申请日：2008-01-11

申请人： Hideaki Ishizawa ,  Akinobu Hayakawa ,  Kohei Takeda

发明人： Hideaki Ishizawa ,  Akinobu Hayakawa ,  Kohei Takeda

IPC分类号： C09J163/00

CPC分类号： H01L24/83 ,  C08G59/226 ,  C08G59/38 ,  C08L63/00 ,  C08L2666/22 ,  C09J163/00 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/83136 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention has its object to provide an adhesive for bonding electronic components with a constant distance between them, which makes it possible to maintain a distance between bonded electronic components at high accuracy and to provide a highly reliable electronic apparatus, and which can be stably and continuously applied with a jet dispenser. The present invention is an adhesive for bonding electronic components, including spacer particles, an epoxy compound (A), and a curing agent. The spacer particles have a CV value of 10% or less. The epoxy compound (A) has a molecular structure including 10 or less monomer units with an aromatic ring in each repeating unit, is in a state of crystalline solid at 25° C., and has a viscosity of 1 Pa·s or less measured by an E-type viscometer at a temperature of 50 to 80° C.

摘要翻译： 本发明的目的是提供一种用于将它们之间具有恒定距离的电子部件接合的粘合剂，这使得可以以高精度保持接合的电子部件之间的距离并提供高可靠性的电子设备，并且其可以是稳定的 并连续地使用喷射器。 本发明是用于粘合电子部件的粘合剂，包括间隔剂颗粒，环氧化合物（A）和固化剂。 间隔物颗粒的CV值为10％以下。 环氧化合物（A）在每个重复单元中具有包含10个或更少个具有芳环的单体单元的分子结构，在25℃下处于结晶固体的状态，并且具有1Pa·s以下的粘度 通过E型粘度计在50〜80℃的温度下进行。

公开(公告)号：US20090311827A1

公开(公告)日：2009-12-17

申请号：US12309324

申请日：2007-07-19

申请人： Hideaki Ishizawa ,  Akinobu Hayakawa

发明人： Hideaki Ishizawa ,  Akinobu Hayakawa

IPC分类号： H01L21/50 ,  C09J163/02 ,  C09J163/00

CPC分类号： C09J11/04 ,  C08G59/42 ,  C08L63/00 ,  C09J11/08 ,  C09J163/00 ,  C09J2203/326 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/26135 ,  H01L2224/26165 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83138 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199

摘要： It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts.The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25° C. by using an E type viscometer, and a viscosity at 0.5 rpm being 1.4 to 3 times as large as the viscosity at 1 rpm, and the viscosity at 1 rpm being 2 to 5 times as large as the viscosity at 10 rpm.

摘要翻译： 本发明的目的是提供：一种用于电子部件的粘合剂，其可以在连接诸如两个或更多个半导体芯片的电子部件之后准确地保持电子部件之间的距离，并且还获得可靠的电子部件，例如半导体 设备; 一种使用电子部件用粘合剂制造半导体芯片层叠体的方法; 以及使用电子部件用粘合剂的半导体装置。 本发明是一种用于连接电子部件的电子部件的粘合剂，其包含：包含固化化合物和固化剂的粘合剂组合物; CV值为10％以下的间隔物颗粒，在25℃，25℃下测定时，1rpm下的粘度为200Pa·s以下，10rpm下的粘度为100Pa·s以下。 E型粘度计，0.5rpm时的粘度为1rpm时的粘度的1.4〜3倍，1rpm的粘度为10rpm时的粘度的2〜5倍。

公开(公告)号：US20130000964A1

公开(公告)日：2013-01-03

申请号：US13634225

申请日：2011-04-19

申请人： Hiroshi Kobayashi ,  Akihiko Tateno ,  Hideaki Ishizawa ,  Satoshi Saitou

发明人： Hiroshi Kobayashi ,  Akihiko Tateno ,  Hideaki Ishizawa ,  Satoshi Saitou

IPC分类号： B23K35/14 ,  H05K1/09

CPC分类号： H01B1/22

摘要： The present invention provides an anisotropic conductive material that facilitates connection between electrodes to enhance the conduction reliability when used for connecting the electrodes, and a connection structure produced from the anisotropic conductive material. The present invention is an anisotropic conductive material comprising: conductive particles (1) each including a resin particle (2) and a conductive layer (3) coating the surface (2a) of the resin particle (2); and a binder resin; wherein at least an exterior surface layer of the conductive layer is a solder layer (5). The present invention is a connection structure comprising: a first connection target member; a second connection target member; and a connection part connecting the first connection target member and the second connection target member, wherein the connection part is formed of the anisotropic conductive material.

摘要翻译： 本发明提供一种各向异性导电材料，其用于电极之间的连接，以提高用于连接电极的导电可靠性，以及由各向异性导电材料制成的连接结构。 本发明是一种各向异性导电材料，其特征在于，包括：包含树脂颗粒（2）和覆盖树脂颗粒（2）的表面（2a）的导电层（3）的导电颗粒（1）。 和粘合剂树脂; 其中所述导电层的至少外表面层是焊料层（5）。 本发明是一种连接结构，包括：第一连接目标构件; 第二连接目标构件; 以及连接所述第一连接对象部件和所述第二连接对象部件的连接部，所述连接部由所述各向异性导电材料形成。

公开(公告)号：US08119323B2

公开(公告)日：2012-02-21

申请号：US12304262

申请日：2006-10-19

申请人： Hiroji Fukui ,  Kenichi Aoki ,  Kunihiro Ichimura ,  Minoru Suezaki ,  Toshio Enami ,  Hideaki Ishizawa ,  Takao Unate ,  Hiroshi Kobayashi

发明人： Hiroji Fukui ,  Kenichi Aoki ,  Kunihiro Ichimura ,  Minoru Suezaki ,  Toshio Enami ,  Hideaki Ishizawa ,  Takao Unate ,  Hiroshi Kobayashi

IPC分类号： G03F7/00 ,  G03F7/004

CPC分类号： G03F7/36 ,  G03F7/0045 ,  G03F7/038

摘要： A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern. There is provided a process for producing a patterned film, comprising the steps of preparing a photosensitive resin composition that upon light irradiation, generates an acid or a base and is hardened; coating substrate (2) with the photosensitive resin composition to thereby form photosensitive resin composition layer (1) of given thickness; and exposing the photosensitive resin composition layer (1) selectively through mask (3) to light so as to travel at least portion of the photosensitive resin composition at unexposed regions toward the exposed regions and further effect hardening thereof, thereby obtaining patterned film (1A) furnished on its surface with protrusion/depression pattern.

摘要翻译： 一种薄膜图案的制造方法，其中在基板上形成感光性树脂组合物层，并且通过掩模选择性地曝光于光，从而获得在其表面上设置有突起和凹陷的膜图案，而不需要去除层 感光性树脂组合物在未曝光区域或曝光区域的显影; 以及用于上述制造薄膜图案的方法的感光性树脂组合物。 提供一种图案化膜的制造方法，包括以下步骤：制备在光照射时产生酸或碱并被硬化的感光性树脂组合物; 用感光性树脂组合物涂布基材（2），形成规定厚度的感光性树脂组合物层（1） 通过掩模（3）选择性地使感光性树脂组合物层（1）发光，使未曝光区域的感光性树脂组合物的至少一部分向露出区域移动，进一步进行硬化，得到图案化膜（1A） 其表面上具有突起/凹陷图案。