公开(公告)号：US07888699B2

公开(公告)日：2011-02-15

申请号：US12155107

申请日：2008-05-29

申请人： Hiroaki Oshio ,  Kazuhiro Tamura ,  Masakata Koseki ,  Hiroko Tsukamoto ,  Tatsuichiro Maki

发明人： Hiroaki Oshio ,  Kazuhiro Tamura ,  Masakata Koseki ,  Hiroko Tsukamoto ,  Tatsuichiro Maki

IPC分类号： H01L33/48

CPC分类号： H01L25/167 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.

摘要翻译： 发光装置包括：树脂壳体，其具有在壳体的凹部的底部露出的，具有围绕发光元件的反射器部分的凹部，由金属形成的第一引线和第二引线， 在预定方向上彼此远离，并且填充在凹部中的树脂密封材料。 第一引线包括发光元件安装部分，第一引线连接部分，第一泄漏防止凹口和相对的凹口。 第二引线包括保护装置安装部分，第二导线连接部分和第二防止漏出凹口。 第一引线和第二引线被布置成使得在预定方向上，发光元件安装部分与第二防止泄漏槽相对，第一引线连接部分与保护装置安装部分相对，并且 相对的槽口与第二线连接部分相对。

公开(公告)号：US20080296605A1

公开(公告)日：2008-12-04

申请号：US12155107

申请日：2008-05-29

申请人： Hiroaki Oshio ,  Kazuhiro Tamura ,  Masakata Koseki ,  Hiroko Tsukamoto ,  Tatsuichiro Maki

发明人： Hiroaki Oshio ,  Kazuhiro Tamura ,  Masakata Koseki ,  Hiroko Tsukamoto ,  Tatsuichiro Maki

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.

摘要翻译： 发光装置包括：树脂壳体，其具有在壳体的凹部的底部露出的，具有围绕发光元件的反射器部分的凹部，由金属形成的第一引线和第二引线， 在预定方向上彼此远离，并且填充在凹部中的树脂密封材料。 第一引线包括发光元件安装部分，第一引线连接部分，第一泄漏防止凹口和相对的凹口。 第二引线包括保护装置安装部分，第二导线连接部分和第二防止漏出凹口。 第一引线和第二引线被布置成使得在预定方向上，发光元件安装部分与第二防止泄漏槽相对，第一引线连接部分与保护装置安装部分相对，并且 相对的槽口与第二线连接部分相对。

公开(公告)号：US08487418B2

公开(公告)日：2013-07-16

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L23/495

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US20110186875A1

公开(公告)日：2011-08-04

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US20120138967A1

公开(公告)日：2012-06-07

申请号：US13189654

申请日：2011-07-25

申请人： Satoshi Shimizu ,  Iwao Matsumoto ,  Kazuhiro Tamura ,  Takayuki Yasuzumi

发明人： Satoshi Shimizu ,  Iwao Matsumoto ,  Kazuhiro Tamura ,  Takayuki Yasuzumi

IPC分类号： H01L33/08

CPC分类号： H01L25/167 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

摘要： An LED package includes: 2n lead frames (n is a natural number); n LED chips provided above the 2n lead frames, one terminal of each of the n LED chips being connected to each of the n lead frames, another terminal of each of the n LED chips being connected to each of other n lead frames; a wire connected between the terminal and one of the lead frames; and a resin body covering the n LED chips, the wire, and a part of each of the 2n lead frames. The each of the 2n lead frames includes; a base having an upper surface and side surfaces, the upper surface and the side surfaces being covered with the resin body; and a plurality of extending portions extending from the base, one of the extending portions having tip surface which is exposed at one side surface of the resin body, another of the extending portions having tip surface which is exposed at another side surface of the resin body, the one side surface and the another side surface being perpendicular to each other, and. An outer shape of the resin body forms an outer shape of the LED package.

摘要翻译： LED封装包括：2n引线框（n为自然数）; n个LED芯片设置在2n引线框架之上，n个LED芯片中的每一个的一个端子连接到n个引线框架中的每一个，n个LED芯片中的每一个的另一个端子连接到每个其他n个引线框架; 连接在所述端子和所述引线框架中的一个之间的导线; 以及覆盖n个LED芯片，导线以及2n个引线框架中的每一个的一部分的树脂体。 2n引线框架中的每一个包括： 具有上表面和侧面的基部，上表面和侧表面被树脂体覆盖; 以及从所述基部延伸的多个延伸部，所述延伸部中的一个具有在所述树脂体的一个侧面露出的末端面，另一个所述延伸部具有在所述树脂体的另一侧面露出的前端面 ，一侧表面和另一侧表面彼此垂直，并且。 树脂体的外形形成LED封装的外形。

公开(公告)号：US06419584B1

公开(公告)日：2002-07-16

申请号：US09714664

申请日：2000-11-17

申请人： Yoshio Sakamoto ,  Norikatsu Furuta ,  Makoto Katayama ,  Kenji Imai ,  Koichi Kishi ,  Kazuhiro Tamura

发明人： Yoshio Sakamoto ,  Norikatsu Furuta ,  Makoto Katayama ,  Kenji Imai ,  Koichi Kishi ,  Kazuhiro Tamura

IPC分类号： A63F1300

CPC分类号： A63F13/822 ,  A63F3/00075 ,  A63F3/00643 ,  A63F13/005 ,  A63F13/537 ,  A63F13/92 ,  A63F2300/204 ,  A63F2300/8094

摘要： A card game apparatus includes a display to display a game scene. In the game scene, a first master display site and a second master display site are formed to respectively display therein a first master as the other self of a game player and a second master as the other self of an opponent. The game player is allowed to select a monster card from a card hand display site and present it to a monster card presenting site. Responsive to an instruction of attack with a monster card, an attack power of the monster card is compared with the HP of a designated second master or the monster presented in the monster card presenting site, thereby arithmetically determining a battle result.

摘要翻译： 纸牌游戏装置包括显示游戏场景的显示器。 在游戏场景中，形成第一主显示位置和第二主显示位置，以分别在其中显示作为游戏者的另一个自身的第一主人和作为对手的另一个自己的第二主人。 允许游戏玩家从卡片手牌显示网站中选择一个怪物卡，并将其呈现给一个怪物卡片呈现站点。 对于使用怪物卡进行攻击的指令，将怪物卡的攻击强度与指定的第二主人的HP或在怪物卡呈现站点中呈现的怪物进行比较，从而算术地确定战斗结果。

公开(公告)号：US06894363B2

公开(公告)日：2005-05-17

申请号：US10260484

申请日：2002-09-30

申请人： Kazuhiro Tamura

发明人： Kazuhiro Tamura

IPC分类号： H01L21/76 ,  H01L21/762 ,  H01L29/00

CPC分类号： H01L21/76224 ,  Y10S438/981

摘要： A semiconductor device adopting shallow trench isolation for reducing an internal stress of a semiconductor substrate. The semiconductor device is composed of a semiconductor substrate provided with a trench for isolation, and an insulating film formed to cover the trench for relaxing an internal stress of the semiconductor substrate. The insulating film includes a first portion disposed to be opposed to a bottom of the trench, and a second portion disposed to be opposed to a side of the trench. A first thickness of the first portion is different from a second thickness of the second portion.

摘要翻译： 采用浅沟槽隔离以减小半导体衬底的内部应力的半导体器件。 半导体器件由设置有用于隔离的沟槽的半导体衬底和形成为覆盖沟槽以用于缓和半导体衬底的内部应力的绝缘膜组成。 绝缘膜包括设置成与沟槽的底部相对的第一部分和设置成与沟槽的一侧相对的第二部分。 第一部分的第一厚度不同于第二部分的第二厚度。

公开(公告)号：US5990497A

公开(公告)日：1999-11-23

申请号：US920003

申请日：1997-08-29

申请人： Takanobu Kamakura ,  Takafumi Nakamura ,  Makoto Yamamura ,  Yoshio Ariizumi ,  Kazuhiro Tamura ,  Shinichi Sanda ,  Takumi Komoto ,  Yukio Watanabe

发明人： Takanobu Kamakura ,  Takafumi Nakamura ,  Makoto Yamamura ,  Yoshio Ariizumi ,  Kazuhiro Tamura ,  Shinichi Sanda ,  Takumi Komoto ,  Yukio Watanabe

IPC分类号： H01L33/16 ,  H01L33/30 ,  H01L33/40 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L33/486 ,  H01L33/16 ,  H01L33/20 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/10156

摘要： A semiconductor light emitting element exhibiting a characteristic of deflected luminous intensity distribution, a semiconductor light emitting device capable of making, even when the element is off the center, a luminous center close to the center, and an element scribing method having a high element separation rate without causing a crack and chipping of pellet edges. The semiconductor light emitting element involves the use of a scribed pellet 10 into which a wafer including a semiconductor layer such as a luminous layer that is stacked on a compound semiconductor substrate inclined at 5.degree. through 20.degree. to a surface (100) in a orientation [011], is subjected to an element separation process by a scribing method.

摘要翻译： 具有偏转的发光强度分布的特性的半导体发光元件，即使当元件离开中心时也能够制造靠近中心的发光中心的半导体发光器件，以及具有高元件分离的元件划线方法 速率，而不会引起颗粒边缘的裂纹和碎裂。 半导体发光元件涉及使用划片片10，其中将包括半导体层的半导体层（例如发光层叠置在化合物半导体衬底上的方向倾斜5°至20°）的表面（100）的方向 通过划线方法进行元件分离处理。

公开(公告)号：US20090274400A1

公开(公告)日：2009-11-05

申请号：US12226187

申请日：2007-06-26

申请人： Katsuya Yamashita ,  Chiaki Yasuda ,  Kazuhiro Tamura ,  Hitoshi Kaguchi ,  Yoshitake Kasubata ,  Akio Kambe

发明人： Katsuya Yamashita ,  Chiaki Yasuda ,  Kazuhiro Tamura ,  Hitoshi Kaguchi ,  Yoshitake Kasubata ,  Akio Kambe

IPC分类号： F16C27/02 ,  F16C35/00

CPC分类号： F16F15/023 ,  F16C17/02 ,  F16C17/24 ,  F16C27/02 ,  F16C27/063

摘要： The present invention provides a rotating-body support structure that is capable of obtaining a damping effect of a rotating body with a simple configuration. To this end, the rotating-body support structure is configured to include a housing (21) and a bush portion (24) which is supported by the housing (21) and which rotatably supports a boring bar (11); and to have oil filled between the housing (21) and the bush portion (24).

摘要翻译： 本发明提供能够以简单的结构获得旋转体的阻尼效果的旋转体支撑结构。 为此，旋转体支撑结构被构造成包括由壳体（21）支撑并且可旋转地支撑镗杆（11）的壳体（21）和衬套部分（24）。 并且在所述壳体（21）和所述衬套部（24）之间具有填充油。

公开(公告)号：US07060588B2

公开(公告)日：2006-06-13

申请号：US10731747

申请日：2003-12-09

申请人： Kazuhiro Tamura

发明人： Kazuhiro Tamura

IPC分类号： H01L21/76

CPC分类号： H01L21/76224 ,  Y10S438/981

摘要： A semiconductor device adopting shallow trench isolation for reducing an internal stress of a semiconductor substrate. The semiconductor device is composed of a semiconductor substrate provided with a trench for isolation, and an insulating film formed to cover the trench for relaxing an internal stress of the semiconductor substrate. The insulating film includes a first portion disposed to be opposed to a bottom of the trench, and a second portion disposed to be opposed to a side of the trench. A first thickness of the first portion is different from a second thickness of the second portion.