摘要:
A semiconductor device includes a substrate, a plurality of bump electrodes disposed on the substrate, and a support area for supporting the substrate in case of carrying the substrate. The support area is disposed on a surface of the substrate, on which the bump electrode is disposed, and is disposed at a predetermined position, which is dotted on the surface of the substrate. In this device, the support area is sufficiently small, and the number of the bump electrodes can increase. Moreover, degree of freedom in a configuration of the support area increases.
摘要:
In a voltage booster, a voltage detection circuit detects a battery voltage as an input voltage. If the input voltage is lower than a threshold level, an oscillation circuit outputs a gate signal having a relatively high frequency to increase the driving performance of a driving circuit. If the input voltage is higher than the threshold level, the frequency of the gate signal is lowered so as to prevent the driving performance of the driving circuit from rising to an excessively high value. As a result, a predetermined boosted voltage can be obtained regardless of variations in input voltage without using a filter for eliminating noise.
摘要:
A semiconductor device for driving a load includes a first semiconductor switching element interposed between a power supply terminal and a load, a second semiconductor switching element interposed between the load and a ground terminal, a high-side driver, a low-side driver, and a voltage regulator. The voltage regulator reduces a voltage applied to a control terminal of the second switching element, when a voltage of a load terminal of the second switching element is lower than a predetermined voltage. Then, a voltage applied between the load terminal and the ground terminal of the second switching element increases, and accordingly a voltage applied between the power supply terminal and the load terminal of the first switching element decreases.
摘要:
A semiconductor device for driving a load includes a first semiconductor switching element interposed between a power supply terminal and a load, a second semiconductor switching element interposed between the load and a ground terminal, a high-side driver, a low-side driver, and a voltage regulator. The voltage regulator reduces a voltage applied to a control terminal of the second switching element, when a voltage of a load terminal of the second switching element is lower than a predetermined voltage. Then, a voltage applied between the load terminal and the ground terminal of the second switching element increases, and accordingly a voltage applied between the power supply terminal and the load terminal of the first switching element decreases.
摘要:
A comparator, having an offset of 0.1V, compares a terminal voltage Vin1 with a clamp voltage VCL (5.1V). When an overvoltage input exceeding the VCL is entered to an input terminal, the comparator turns on a transistor Q11. The current flows across an externally provided resistor R11, the input terminal, and the transistor Q11, and flows into an output terminal of an operational amplifier. With a voltage drop at the resistor R11, the terminal voltage Vin1 starts decreasing toward an output voltage Vc of the operational amplifier.
摘要:
A fuse fusible type semiconductor device capable of reducing energy required for fusing and a production method of the semiconductor device. In a semiconductor device equipped with a heat-fusible thin film resistor, the thin film resistor formed on a substrate 1 through an insulating film 2 is made of chromium, silicon and tungsten, and films 7 and 8 of a insulator including silicon laminated on the upper surface of the fusing surface, aluminum films 5 are disposed on both sides of the fusing surface and a barrier film 4. This semiconductor device is produced by a lamination step of sequentially forming a first insulating film 2, a thin film resistor 3, a barrier film 4 and an aluminum film 5 on a substrate 1 for reducing drastically fusing energy, an etching step of removing the barrier film 4 and the aluminum film 5 from the fusing region 31 of the thin film resistor 3, and an oxide film formation step of depositing the insulator including silicon films 7 and 8.
摘要:
An object of the present invention is to provide a DRAM of a special form, a non-volatile memory cell incorporating the DRAM, and a semiconductor device which incorporates a DRAM structure and a non-volatile memory cell and where data can be written and erased with high accuracy. The semiconductor memory device has a sub bit line BLs1 to which the main bit line BL1 is connected via a selector transistor Tr1, and non-volatile memory cells M1-Nn, i.e., memory transistors whose drain electrodes are connected to the sub bit line Bls1. An a-c pulse generator applies an a-c voltage to the control gates of the non-volatile memory cells M1-Nn. The DRAM cell is formed of a capacitor element formed of parasitic capacitance of the sub bit line BLs1 and the drain electrodes of the non-volatile memory cells connected to the bit line BLs1. An arbitrary non-volatile memory cell Mk is connected with the memory node N of a DRAM cell, thereby implementing a non-volatile memory cell or non-volatile memory device having DRAM functions. The DRAM cells may operate independently of the non-volatile memory cells. Data is temporarily stored in the DRAM cell and is then transferred to the non-volatile memory cell Mk, thereby writing and erasing data with high accuracy at higher speeds, and allowing miniaturization of a memory device.
摘要:
A photographic light-sensitive material having a support having a thickness of from 160 to 225 μm is processed with an automatic developing apparatus, in which at least one of rollers of a developing part, a fixing part and a rinsing rack part of the automatic developing apparatus has a surface mainly containing a nonpolar polymer substance and having a center line surface roughness (Ra) of 20 μm or less. By using the automatic developing apparatus, dusts generated in the apparatus can be easily removed with a cleaning film.
摘要:
The semiconductor output circuit of the invention has an insulated gate transistor including a first terminal, a second terminal and a gate terminal, a conductive state of the insulated gate transistor being controlled by a drive circuit connected to the gate terminal, a capacitive element and a first resistor connected in series between the second terminal and the gate terminal, and a second resistor connected between the gate terminal and the first terminal. The insulated gate transistor has a cell area formed on a semiconductor substrate, in which a plurality of unit cells each defining a unit transistor connected between the first and second terminals are laid out. The second resistor has such a resistance that all of the unit transistors defined by the unit cells are turned on uniformly when electrostatic discharge is applied to the first or second terminal.
摘要:
Semiconductor equipment includes a semiconductor substrate, a plurality of transistors having a source cell and a drain cell disposed alternately on the substrate, and upper and lower layer wirings for electrically connecting the source cells and the drain cells. The lower layer wiring includes a first source wiring for connecting the neighboring source cells and a first drain wiring for connecting the neighboring drain cells. The upper layer wiring includes a second source wiring for connecting to the first source wiring and a second drain wiring for connecting to the first drain wiring. A width of the second source wiring is wider than that of the first source wiring, and a width of the second drain wiring is wider than that of the first drain wiring. The second source wiring and the second drain wiring are disposed alternately.