公开(公告)号：US20120301450A1

公开(公告)日：2012-11-29

申请号：US13577314

申请日：2011-02-09

申请人： Hirokuni Miyamoto ,  Hiroaki Kodama ,  Takumi Nishiuchi ,  Teruo Matsushita ,  Hisashi Miyamoto ,  Sankichi Horiuchi ,  Manami Seta ,  Kenichi Mori ,  Masahira Hattori ,  Kazuo Ogawa

发明人： Hirokuni Miyamoto ,  Hiroaki Kodama ,  Takumi Nishiuchi ,  Teruo Matsushita ,  Hisashi Miyamoto ,  Sankichi Horiuchi ,  Manami Seta ,  Kenichi Mori ,  Masahira Hattori ,  Kazuo Ogawa

IPC分类号： A61K35/74 ,  A61P37/04 ,  A61P3/00

CPC分类号： A61K35/741 ,  C12R1/01 ,  C12R1/07

摘要： To provide a mixture, a dissolving solution and a pharmaceutical agent, which contain a thermophilic microorganism to make it possible to regulate a mucous membrane immune system gene cluster and metabolism-related gene clusters of the intestines and the liver. Each of them is prepared by fermentation of an organic material containing a thermophilic microorganism at a temperature of 50° C. or more and 90° C. or less. By being administered to the animal, it regulates at least one of a mucous membrane immune system gene cluster, a metabolism-related gene cluster in the intestines, and a metabolism-related gene cluster in the liver of the animal. The microorganism includes at least one species of the genus Bacillus, Oceanobacillus, Paenibacillus, Anoxybacillus, Lysinibacillus, Methanopyrus, Geogemma, Pyrolobus, Pyrodictium, Hyperthermus, Pyrococcus, Pyrobaculum, Thermococcus, Aeropyrum, Aquifex, Thermotoga, Thermodesulfobacterium, Thermus, Geobacillus, and Thermomyces.

摘要翻译： 提供含有嗜热微生物的混合物，溶解溶液和药剂，以便调节粘膜免疫系统基因簇和代谢相关的肠和肝的基因簇。 它们各自通过在50℃以上且90℃以下的温度下发酵含有嗜热微生物的有机材料来制备。 通过施用于动物，其调节粘膜免疫系统基因簇，肠中代谢相关基因簇和动物肝脏中代谢相关基因簇中的至少一种。 微生物包括芽孢杆菌属，海洋芽孢杆菌属，芽孢杆菌属，厌氧杆菌属，嗜热芽孢杆菌属，甲烷us霉，地热质属，火焰菌属，火炬菌属，热原，热球菌属，火腿菌属，热球菌属，艾氏梭菌属，Aquifex菌，热酵母菌，热链球菌属，栖热菌属，土芽孢杆菌属和Thermomyces 。

公开(公告)号：US08249402B2

公开(公告)日：2012-08-21

申请号：US12697646

申请日：2010-02-01

申请人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

发明人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

IPC分类号： G02B6/12 ,  G02B6/10

CPC分类号： G02B6/43 ,  H01L2224/16225 ,  H05K1/0274 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061

摘要： A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.

摘要翻译： 根据本发明的多层印刷电路板是多层印刷电路板，其中形成多个绝缘层，导体电路和光电路并层叠并安装光学元件，其中上述光电路形成在 上述绝缘层。

公开(公告)号：US08106186B2

公开(公告)日：2012-01-31

申请号：US11911911

申请日：2006-04-17

申请人： Hiroaki Kodama ,  Keisuke Ohto ,  Nobuhiko Oohara ,  Kazuhiro Nakatsui ,  Yoshirou Kaneda

发明人： Hiroaki Kodama ,  Keisuke Ohto ,  Nobuhiko Oohara ,  Kazuhiro Nakatsui ,  Yoshirou Kaneda

IPC分类号： C07B47/00 ,  C07D487/22 ,  A01N43/36

CPC分类号： C07F1/005 ,  C07F9/5027 ,  C07F9/5045 ,  C07F9/58 ,  C07F9/6512 ,  C07F15/0093 ,  Y10T428/12396 ,  Y10T428/12444

摘要： There is provided a novel transition metal phosphine complex having excellent anticancer activity. The transition metal phosphine complex is represented by general formula (1): (wherein R1s and R3s each represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a pyridyl group, or a pyrimidyl group; R2s and R4s each represent an alkyl group or a cycloalkyl group, provided that each R1 and each R2 are not the same group and that each R3 and each R4 are not the same group; As each represent a linear alkylene group or a cis-vinylene group; M represents a gold atom, a silver atom, a copper atom, or a platinum atom; and B represents an anionic species).

摘要翻译： 提供了具有优异的抗癌活性的新型过渡金属膦络合物。 过渡金属膦络合物由通式（1）表示：（其中R 1和R 3各自表示烷基，环烷基，芳基，芳烷基，吡啶基或嘧啶基;各自的R 2和R 4各自 表示烷基或环烷基，条件是每个R 1和R 2不是相同的基团，并且每个R 3和R 4不是相同的基团;各自表示直链亚烷基或顺式 - 亚乙烯基; M表示 金原子，银原子，铜原子或铂原子; B表示阴离子物质）。

公开(公告)号：US07655810B2

公开(公告)日：2010-02-02

申请号：US12096316

申请日：2006-11-30

申请人： Hiroaki Kodama ,  Keisuke Ohto ,  Nobuhiko Oohara ,  Kazuhiro Nakatsui ,  Yoshirou Kaneda

发明人： Hiroaki Kodama ,  Keisuke Ohto ,  Nobuhiko Oohara ,  Kazuhiro Nakatsui ,  Yoshirou Kaneda

IPC分类号： A61K31/28 ,  C07F15/00

CPC分类号： C07F9/65683 ,  C07F15/0093

摘要： A phosphine transition metal complex is expressed by general formula (1): wherein A represents a groups selected from among alkylene, phenylene, and cis-vinylene; M represents an atom selected from the group consisting of gold, silver, copper, and platinum; B1 and B2 each represent a substituted or unsubstituted heterocyclic group containing a trivalent phosphorus atom forming a covalent bond with A and coordinating with M; and C represents an anionic atom.

摘要翻译： 膦过渡金属络合物由通式（1）表示：其中A表示选自亚烷基，亚苯基和顺式 - 亚乙烯基的基团; M表示选自金，银，铜和铂的原子; B1和B2各自表示含有与A形成共价键并与M配位的三价磷原子的取代或未取代的杂环基; C表示阴离子原子。

公开(公告)号：US07526152B2

公开(公告)日：2009-04-28

申请号：US11964761

申请日：2007-12-27

申请人： Motoo Asai ,  Hiroaki Kodama

发明人： Motoo Asai ,  Hiroaki Kodama

IPC分类号： G02B6/14

CPC分类号： G02B6/4204 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/43 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H05K1/0274 ,  H05K3/4602 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

摘要翻译： 本发明的目的在于提供一种用于安装IC芯片的基板，其上形成有光信号通过区域，并且可以抑制光信号中的传输损耗并且以高可靠性更积极地发送光信号。 根据本发明的用于安装IC芯片的基板是用于安装IC芯片的基板，其中导体电路和绝缘层在基板的两个表面上以交替的方式并且重复地层叠并且安装有光学元件 在基板上。 这里，用于安装IC芯片的基板包括光信号通过区域和布置在与光学元件相反侧的光信号通过区域的端部上的微透镜。

公开(公告)号：US20060012967A1

公开(公告)日：2006-01-19

申请号：US10509899

申请日：2003-03-28

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H05K1/18

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

摘要翻译： 本发明的目的是提供一种用于安装IC芯片的基板，IC芯片是用于光通信的部件，其具有一体地设置在其上的IC芯片和光学部件，其可以确保IC芯片和光学部件之间的短距离， 其电信号传输可靠性优异，可以通过用于发送光信号的光路传输光信号。 用于安装本发明的IC芯片的基板是用于安装IC芯片的基板，其包括：基板，并且在其两个表面上串联构成导体电路和层间绝缘层，并且重复; 形成为最外层的阻焊层; 以及安装在其上的光学元件，其中设置用于透射光信号的光路，其穿透用于安装IC芯片的基板。

公开(公告)号：US08238700B2

公开(公告)日：2012-08-07

申请号：US12757418

申请日：2010-04-09

申请人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

发明人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

IPC分类号： G02B6/12 ,  G02B6/10

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/09536

摘要： A multilayer printed circuit board including insulating layers, conductor circuits formed between the insulating layers, and optical circuits formed between the insulating layers and including a first optical circuit. The first optical circuit is positioned on a first outermost insulating layer of the insulating layers, and the insulating layers, conductor circuits and optical circuits are layered to form a multilayer structure having a first surface and a second surface on an opposite side of the first surface such that the multilayer structure is structured to mount optical elements on the first surface and second surface of the multilayer structure, respectively.

摘要翻译： 一种多层印刷电路板，包括绝缘层，形成在绝缘层之间的导体电路以及形成在绝缘层之间并包括第一光学电路的光电路。 第一光电路位于绝缘层的第一绝缘绝缘层上，绝缘层，导体电路和光电路被层叠形成具有第一表面和第二表面的第一表面的第二表面的多层结构 使得多层结构被分别安装在多层结构的第一表面和第二表面上的光学元件。

公开(公告)号：US08120040B2

公开(公告)日：2012-02-21

申请号：US12785786

申请日：2010-05-24

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H01L29/04

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.

摘要翻译： 一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。 在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

公开(公告)号：US07724989B2

公开(公告)日：2010-05-25

申请号：US12118344

申请日：2008-05-09

申请人： Hiroaki Kodama ,  Kazuhito Yamada

发明人： Hiroaki Kodama ,  Kazuhito Yamada

IPC分类号： G02B6/10 ,  G02B6/12

CPC分类号： G02B6/12002 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/005 ,  H05K3/107 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2203/0108

摘要： The optical/electrical composite wiring board comprises a lower insulating layer that also serves as a lower clad; a upper insulating layer that also serves as an upper clad; a core that is placed between the lower insulating layer and the upper insulating layer and has a predetermined optical wiring pattern; and a conductor layer that is placed along with the core between the lower insulating layer and the upper insulating layer and has a predetermined electrical wiring pattern. Herein, the core and the conductor layer are formed via a short manufacturing method, whereby the concave portion for optical wiring and the concave portion for electrical wiring are formed on the lower insulating layer by press process, and a core material and conductor material are filled into each of the concave portions, and afterward, the core material and conductor material are ground until they are flush with the upper surface of the lower insulating layer.

摘要翻译： 光电复合布线板包括也用作下包层的下绝缘层; 也用作上部包层的上部绝缘层; 放置在下绝缘层和上绝缘层之间并具有预定光布线图案的芯; 以及导体层，其与所述芯在所述下绝缘层和所述上绝缘层之间放置并且具有预定的电布线图案。 这里，通过短的制造方法形成芯和导体层，由此通过冲压加工在下绝缘层上形成用于光布线的凹部和电布线用凹部，并且填充芯材和导体材料 在每个凹部中分离，然后将芯材和导体材料研磨成与下绝缘层的上表面齐平。

公开(公告)号：US20080247704A1

公开(公告)日：2008-10-09

申请号：US11696436

申请日：2007-04-04

申请人： Hiroaki Kodama ,  Kazuhito Yamada

发明人： Hiroaki Kodama ,  Kazuhito Yamada

IPC分类号： G02B6/12

CPC分类号： G02B6/4204 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/43 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/305 ,  H05K3/4602 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A package substrate according to an embodiment of the present invention comprises: at least a conductor circuit and an insulating layer formed and laminated to form a laminated body; at least one solder resist layer further formed and laminated on both sides of the laminated body; an optical element; and an optical path for transmitting an optical signal, wherein at least one outermost layer of the solder resist layers formed and laminated on the laminated body has a transmittance for light having a wavelength for communication of about 60% or more at a thickness of 30 μm.

摘要翻译： 根据本发明实施例的封装基板包括至少形成并层叠以形成层叠体的导体电路和绝缘层; 进一步形成并层叠在所述层叠体的两侧的至少一个阻焊层; 光学元件; 以及用于透射光信号的光路，其中形成并层叠在层叠体上的阻焊层的至少一个最外层对于厚度为30μm的通信波长为约60％以上的光具有透射率 。