公开(公告)号：US06346678B1

公开(公告)日：2002-02-12

申请号：US09229441

申请日：1999-01-13

申请人： Hiroshi Kono ,  Masaaki Matsushima ,  Yasushi Taniguchi

发明人： Hiroshi Kono ,  Masaaki Matsushima ,  Yasushi Taniguchi

IPC分类号： H05K103

CPC分类号： H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/244 ,  H05K3/28 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4644 ,  H05K2201/0112 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2203/0315 ,  H01L2924/01015 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01004 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01033

摘要： A printed circuit board is free from any residue of the carbide of resin produced on the surface of its copper foil exposed after boring a blind hole by means of a laser beam. Such a printed circuit board is adapted to have a blind hole 10 bored through an insulator 1 until the hole gets to the copper foil 3 arranged under the insulator by irradiating the insulator 1 with a laser beam. A laser beam absorbing region is provided between said insulator 1 and said copper foil 3.

摘要翻译： 印刷电路板在通过激光束钻孔盲孔后露出的铜箔表面上产生的树脂碳化物残留物不含。 这种印刷电路板适于具有穿过绝缘体1的盲孔10，直到孔通过用激光束照射绝缘体1而到达设置在绝缘体下方的铜箔3。 在所述绝缘体1和所述铜箔3之间设置激光束吸收区域。

公开(公告)号：US5380349A

公开(公告)日：1995-01-10

申请号：US226106

申请日：1994-04-11

申请人： Yasushi Taniguchi ,  Keiji Hirabayashi ,  Keiko Ikoma ,  Noriko Kurihara ,  Masaaki Matsushima ,  Kiyoshi Yamamoto

发明人： Yasushi Taniguchi ,  Keiji Hirabayashi ,  Keiko Ikoma ,  Noriko Kurihara ,  Masaaki Matsushima ,  Kiyoshi Yamamoto

IPC分类号： C03B11/08 ,  C23C16/27 ,  C03B40/00

CPC分类号： C23C16/279 ,  C03B11/084 ,  C03B11/086 ,  C23C16/27 ,  C03B2215/07 ,  C03B2215/12 ,  C03B2215/24 ,  C03B2215/32

摘要： A diamond sintered product having diamond particles sintered with a suitable sintering aid is the most suitable as the material for the mold for optical element molding, because it has in combination the advantage of diamond that no fusion with glass at high temperature occurs and oxidation occurs with difficulty to give rise to no precipitation of lead, an appropriate hardness and also the advantage that mirror polishing is possible. "There is also disclosed a mold which has a diamond layer having a (100) face, made by the CVD method utilizing gas having 1-3% methane in hydrogen."

摘要翻译： 具有用合适的烧结助剂烧结的金刚石颗粒的金刚石烧结产品是最适合用作光学元件模制用模具的材料，因为它具有金刚石的优点，即在高温下不与玻璃熔合并发生氧化， 难以产生铅的沉淀，适当的硬度以及可以进行镜面抛光的优点。 “还公开了一种具有（100）面的金刚石层的模具，其通过使用氢气中具有1-3％甲烷的气体的CVD方法制成。

公开(公告)号：US06531766B1

公开(公告)日：2003-03-11

申请号：US09718361

申请日：2000-11-24

申请人： Yasushi Taniguchi ,  Hiroshi Kono

发明人： Yasushi Taniguchi ,  Hiroshi Kono

IPC分类号： H01L2302

CPC分类号： H01L23/564 ,  H01L21/4864 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0032 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/09881 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： For providing a semiconductor package with improved moisture resistance and high reliability and a production method thereof, a solder resist is also provided in an appropriate thickness between electrodes of conductor circuits on a surface of a substrate. The resist in these portions is obtained by patterning the solder resist while leaving the solder resist between the conductor circuits by removing the unnecessary solder resist under irradiation of a laser.

摘要翻译： 为了提供具有改善的耐湿性和高可靠性的半导体封装及其制造方法，在衬底的表面上的导体电路的电极之间也设置适当厚度的阻焊剂。 这些部分中的抗蚀剂是通过图案化阻焊剂而获得的，同时通过在激光照射下去除不需要的阻焊剂而在导体电路之间留下阻焊剂。

公开(公告)号：US06221690B1

公开(公告)日：2001-04-24

申请号：US09215190

申请日：1998-12-18

申请人： Yasushi Taniguchi ,  Hiroshi Kono

发明人： Yasushi Taniguchi ,  Hiroshi Kono

IPC分类号： H01L2144

CPC分类号： H01L23/564 ,  H01L21/4864 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0032 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/09881 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： For providing a semiconductor package with improved moisture resistance and high reliability and a production method thereof, a solder resist is also provided in an appropriate thickness between electrodes of conductor circuits on a surface of a substrate. The resist in these portions is obtained by patterning the solder resist while leaving the solder resist between the conductor circuits by removing the unnecessary solder resist under irradiation of a laser.

摘要翻译： 为了提供具有改善的耐湿性和高可靠性的半导体封装及其制造方法，在衬底的表面上的导体电路的电极之间也设置适当厚度的阻焊剂。 这些部分中的抗蚀剂是通过图案化阻焊剂而获得的，同时通过在激光照射下去除不需要的阻焊剂而在导体电路之间留下阻焊剂。

公开(公告)号：US20090229120A1

公开(公告)日：2009-09-17

申请号：US12280907

申请日：2007-02-22

申请人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

发明人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

IPC分类号： H05K3/00 ,  B23P19/00

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0776 ,  H05K2203/087 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/532 ,  Y10T29/53204 ,  H01L2924/00

摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线基板31的电极32上形成凸块19的方法中，将含有导电粒子16和气泡生成剂的流体14供给到布线基板31上的包含电极32的第一区域17上。然后， 40具有与第一区域17具有相同面积并形成在具有比第一区域17的面积大的面积的基板40的主表面18上的突出表面13，使得突出表面13面向 然后，流体14被加热，从包含在流体14中的气泡发生剂产生气泡30。

公开(公告)号：US5382274A

公开(公告)日：1995-01-17

申请号：US999124

申请日：1992-12-31

申请人： Kiyoshi Yamamoto ,  Keiji Hirabayashi ,  Noriko Kurihara ,  Yasushi Taniguchi ,  Keiko Ikoma

发明人： Kiyoshi Yamamoto ,  Keiji Hirabayashi ,  Noriko Kurihara ,  Yasushi Taniguchi ,  Keiko Ikoma

IPC分类号： C03B11/08 ,  C03B40/02 ,  C04B41/50 ,  C04B41/85 ,  C22C29/08 ,  C23C14/06 ,  C23C16/26

CPC分类号： C04B41/85 ,  C03B11/086 ,  C03B40/02 ,  C04B41/009 ,  C04B41/5001 ,  C22C29/08 ,  C23C14/0605 ,  C23C16/26 ,  C03B2215/12 ,  C03B2215/24 ,  C03B2215/34 ,  C04B2111/00939 ,  Y10S425/808

摘要： A mold for use for press-molding an optical element, in which a molding surface of a mold base material is coated with a hard carbon film containing 0-5 atom% of hydrogen. It has a spin density of 1.times.10.sup.18 spin/cm.sup.3 or less and a film density of at least 1.5 g/cm.sup.3.

摘要翻译： 一种用于模压光学元件的模具，其中模具基材的模制表面涂覆有含有0-5原子％氢的硬碳膜。 其自旋密度为1×1018 spin / cm 3以下，膜密度为1.5g / cm 3以上。

公开(公告)号：US4643518A

公开(公告)日：1987-02-17

申请号：US710061

申请日：1985-03-11

申请人： Yasushi Taniguchi

发明人： Yasushi Taniguchi

IPC分类号： G02B26/12 ,  G02B1/00 ,  G02B5/04 ,  G02B5/08 ,  G02B5/09 ,  G02B6/24 ,  G02B26/10

CPC分类号： G02B5/0875 ,  G02B5/09 ,  G02B26/12

摘要： This specification discloses a metallic rotational polygon mirror having a metallic member formed of aluminum or an alloy thereof, a thin film formed of at least one of chromium, tungsten and nickel on the metallic member, and a thin metal film of high reflection factor formed of at least one of gold, silver and copper on the thin film. The metallic rotational polygon mirror has a high reflection factor and a strong intimate contact property between the metallic member and the thin film and between the thin films, and has excellent corrosion resistance and durability.

摘要翻译： 本说明书公开了一种金属旋转多面镜，其具有由铝或其合金构成的金属构件，金属构件上由铬，钨和镍中的至少一种形成的薄膜，以及由高反射率形成的金属薄膜 薄膜上的金，银和铜中的至少一种。 金属旋转多面镜在金属构件和薄膜之间以及薄膜之间具有高反射率和强烈的紧密接触性，并且具有优异的耐腐蚀性和耐久性。

公开(公告)号：US20140020750A1

公开(公告)日：2014-01-23

申请号：US14006357

申请日：2012-03-28

申请人： Yasushi Taniguchi ,  Shigeru Sankawa ,  Kouji Arai ,  Hiroshi Tanabe ,  Ichiro Nakayama ,  Naoshi Yamaguchi

发明人： Yasushi Taniguchi ,  Shigeru Sankawa ,  Kouji Arai ,  Hiroshi Tanabe ,  Ichiro Nakayama ,  Naoshi Yamaguchi

IPC分类号： H01L31/0236 ,  H01L21/306 ,  H01L29/04

CPC分类号： H01L31/02363 ,  H01L21/30604 ,  H01L29/045 ,  Y02E10/50

摘要： The present invention addresses the problem of providing a novel silicon substrate having a textured surface by dry-etching the surface of a silicon substrate having (111) orientation and thereby forming a texture thereon. The present invention provides a silicon substrate having (111) orientation, said silicon substrate having a textured surface that includes multiple protrusions which each comprise three slant faces and have heights of 100 to 8000 nm. This process for producing a silicon substrate includes: a step of preparing a silicon substrate having (111) orientation; and a step of blowing an etching gas onto the surface of the silicon substrate, said etching gas containing one or more gases selected from the group consisting of ClF3, XeF2, BrF3, BrF5 and NF3.

摘要翻译： 本发明解决了通过干法蚀刻具有（111）取向的硅衬底的表面从而在其上形成纹理来提供具有纹理表面的新型硅衬底的问题。 本发明提供具有（111）取向的硅衬底，所述硅衬底具有纹理化表面，其包括多个突起，每个突出部包括三个倾斜面并且具有100至8000nm的高度。 该制造硅衬底的工艺包括：制备具有（111）取向的硅衬底的步骤; 以及将蚀刻气体吹送到硅衬底的表面上的步骤，所述蚀刻气体含有选自ClF 3，XeF 2，BrF 3，BrF 5和NF 3中的一种或多种气体。

公开(公告)号：US20090078746A1

公开(公告)日：2009-03-26

申请号：US12282774

申请日：2007-02-22

申请人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： B23K1/20 ,  B23K3/00

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2924/00

摘要： A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡生成剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。

公开(公告)号：US06993833B2

公开(公告)日：2006-02-07

申请号：US10755340

申请日：2004-01-13

申请人： Takashi Inada ,  Koji Kaneda ,  Yasushi Taniguchi ,  Masashi Fujino ,  Fusatoshi Araki ,  Toyokazu Machida

发明人： Takashi Inada ,  Koji Kaneda ,  Yasushi Taniguchi ,  Masashi Fujino ,  Fusatoshi Araki ,  Toyokazu Machida

IPC分类号： H01B43/00

CPC分类号： H01R43/20 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/5187 ,  Y10T29/53078 ,  Y10T29/53083 ,  Y10T29/53213 ,  Y10T29/53235 ,  Y10T29/53239 ,  Y10T29/53243

摘要： A method for manufacturing a sub-harness comprises the steps of: holding a first connector housing in a guiding device for terminal insertion; holding a second connector housing in a continuity check tool; bringing a terminal at a first end of an electric wire with terminals at the both ends thereof into contact with a touch contact to make a specified light emitter of light emitters in the guiding device emit, said touch contact being connected to the guiding device via a main control device, said touch contact having a curved contact surface; inserting the terminal at the first end into a specified terminal-receiving chamber of terminal-receiving chambers in the first connector housing to bring the terminal at the first end into contact with a specified terminal contact of terminal contacts in the guiding device, said specified chamber being illuminated by said light emitter; and checking continuity between terminals at the first end and at a second end of the electric wire with a continuity check control device which is connected to the continuity check tool and the specified terminal contact, said terminal at the second end having been inserted into the second connector housing.

摘要翻译： 一种用于制造子束的方法包括以下步骤