公开(公告)号：US20050110161A1

公开(公告)日：2005-05-26

申请号：US10958246

申请日：2004-10-06

申请人： Hiroyuki Naito ,  Satoshi Shida ,  Hiroshi Haji ,  Makoto Morikawa

发明人： Hiroyuki Naito ,  Satoshi Shida ,  Hiroshi Haji ,  Makoto Morikawa

IPC分类号： H01L21/607 ,  H01L23/485 ,  H01L23/498 ,  H01L33/62 ,  H01L23/48

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/1131 ,  H01L2224/1134 ,  H01L2224/11505 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81194 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85424 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： By arranging bonding members formed of a gold nanopaste between chip-electrodes and board-electrodes, making the chip-electrodes are brought in contact with the respective board-electrodes via the bonding members and applying ultrasonic vibrations to the bonding members in the contact state, the bonding members are bonded to the board-electrodes and the chip-electrodes.

摘要翻译： 通过在芯片电极和板电极之间设置由金纳米糊状物形成的接合部件，通过接合部件使芯片电极与各个基板电极接触，并且在接触状态下对接合部件施加超声波振动， 接合部件与基板电极和芯片电极接合。

公开(公告)号：US20090020586A1

公开(公告)日：2009-01-22

申请号：US11815623

申请日：2006-06-07

申请人： Hiroyuki Naito ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa

发明人： Hiroyuki Naito ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa

IPC分类号： B23K20/10 ,  B23K1/06

CPC分类号： B23K20/10 ,  H01L21/67138 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.

摘要翻译： 本发明的半导体器件接合装置1包括：在半导体器件10和基板11之间设置凸点14的状态下将半导体器件10向基板11侧按压的按压部件15; 通过对半导体装置10和基板11中的至少一个施加超声波振动来使半导体装置10和基板11相对振动的超声波振动施加部件16; 时间测量部件17，其测量从开始施加超声波振动的时刻到半导体器件10被按压预定距离的时间所需的时间段; 以及控制构件18，其基于由时间测量构件17测量的时间段来控制后续接合期间的超声波振动的输出。

公开(公告)号：US07902568B2

公开(公告)日：2011-03-08

申请号：US11993729

申请日：2006-07-10

申请人： Makoto Morikawa ,  Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Yasuharu Ueno ,  Hiroyuki Naito

发明人： Makoto Morikawa ,  Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Yasuharu Ueno ,  Hiroyuki Naito

IPC分类号： H01L33/00

CPC分类号： F21K9/00 ,  F21Y2105/10 ,  F21Y2105/12 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.

摘要翻译： 发光模块（2）包括具有导体图案的安装板（1）和经由导线（21）安装在导体图案上的多个发光元件（15）。 当垂直于安装板（1）观察时，每根导线（21）朝向导体图案的延伸方向定向成定向。 这可以防止电线（21）的阴影重叠，从而可以抑制亮度不均匀。

公开(公告)号：US07591409B2

公开(公告)日：2009-09-22

申请号：US11815623

申请日：2006-06-07

申请人： Hiroyuki Naito ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa

发明人： Hiroyuki Naito ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： B23K20/10 ,  H01L21/67138 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.

摘要翻译： 本发明的半导体器件接合装置1包括：在半导体器件10和基板11之间设置凸点14的状态下将半导体器件10向基板11侧按压的按压部件15; 通过对半导体装置10和基板11中的至少一个施加超声波振动来使半导体装置10和基板11相对振动的超声波振动施加部件16; 时间测量部件17，其测量从开始施加超声波振动的时刻到半导体器件10被按压预定距离的时间所需的时间段; 以及控制构件18，其基于由时间测量构件17测量的时间段来控制后续接合期间的超声波振动的输出。

公开(公告)号：US07992516B2

公开(公告)日：2011-08-09

申请号：US11722854

申请日：2006-05-11

申请人： Satoshi Shida ,  Hiroyuki Naito ,  Noriyasu Tanimoto ,  Yasuharu Ueno ,  Makoto Morikawa

发明人： Satoshi Shida ,  Hiroyuki Naito ,  Noriyasu Tanimoto ,  Yasuharu Ueno ,  Makoto Morikawa

IPC分类号： B05C5/02

CPC分类号： H05B33/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A phosphor layer forming apparatus (1) in which a paste (21) containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements (11) mounted on a substrate (10) includes the following: a discharge portion (12) for discharging the paste (21) in the form of droplets onto each of the light-emitting elements (11); a measurement portion (13) for measuring the thickness of individual phosphor layers that are formed of the paste (21) covering each of the light-emitting elements (11); and a discharge control portion (14) for controlling the amount of the paste (21) to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (13). This phosphor layer forming apparatus can reduce the manufacturing time.

摘要翻译： 一种荧光体层形成装置（1），其中包含荧光体的浆料（21）被排出以覆盖安装在基板（10）上的多个发光元件（11）中的每一个，包括：排出部分 （12），用于以液滴的形式将糊状物（21）排出到每个发光元件（11）上; 测量部分（13），用于测量由覆盖每个发光元件（11）的浆料（21）形成的各个荧光体层的厚度; 以及放电控制部分（14），用于根据由测量部分（13）测量的各个荧光体层的厚度来控制针对每个荧光体层重新放电的糊状物（21）的量。 该荧光体层形成装置可以减少制造时间。

公开(公告)号：US20100129525A1

公开(公告)日：2010-05-27

申请号：US11722854

申请日：2006-05-11

申请人： Satoshi Shida ,  Hiroyuki Naito ,  Noriyasu Tanimoto ,  Yasuharu Ueno ,  Makoto Morikawa

发明人： Satoshi Shida ,  Hiroyuki Naito ,  Noriyasu Tanimoto ,  Yasuharu Ueno ,  Makoto Morikawa

IPC分类号： B05D5/06 ,  B05C11/00

CPC分类号： H05B33/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A phosphor layer forming apparatus (1) in which a paste (21) containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements (11) mounted on a substrate (10) includes the following: a discharge portion (12) for discharging the paste (21) in the form of droplets onto each of the light-emitting elements (11); a measurement portion (13) for measuring the thickness of individual phosphor layers that are formed of the paste (21) covering each of the light-emitting elements (11); and a discharge control portion (14) for controlling the amount of the paste (21) to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (13). This phosphor layer forming apparatus can reduce the manufacturing time.

摘要翻译： 一种荧光体层形成装置（1），其中包含荧光体的浆料（21）被排出以覆盖安装在基板（10）上的多个发光元件（11）中的每一个，包括：排出部分 （12），用于以液滴的形式将糊状物（21）排出到每个发光元件（11）上; 测量部分（13），用于测量由覆盖每个发光元件（11）的浆料（21）形成的各个荧光体层的厚度; 以及放电控制部分（14），用于根据由测量部分（13）测量的各个荧光体层的厚度来控制针对每个荧光体层重新放电的糊状物（21）的量。 该荧光体层形成装置可以减少制造时间。

公开(公告)号：US20100079997A1

公开(公告)日：2010-04-01

申请号：US11993729

申请日：2006-07-10

申请人： Makoto Morikawa ,  Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Yasuharu Ueno ,  Hiroyuki Naito

发明人： Makoto Morikawa ,  Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Yasuharu Ueno ,  Hiroyuki Naito

IPC分类号： F21S4/00

CPC分类号： F21K9/00 ,  F21Y2105/10 ,  F21Y2105/12 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.

摘要翻译： 发光模块（2）包括具有导体图案的安装板（1）和经由导线（21）安装在导体图案上的多个发光元件（15）。 当垂直于安装板（1）观察时，每根导线（21）朝向导体图案的延伸方向定向成定向。 这可以防止电线（21）的阴影重叠，从而可以抑制亮度不均匀。

公开(公告)号：USD576576S1

公开(公告)日：2008-09-09

申请号：US29296870

申请日：2007-10-30

申请人： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

设计人： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

公开(公告)号：US07650691B2

公开(公告)日：2010-01-26

申请号：US11596577

申请日：2005-05-16

申请人： Shoriki Narita ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa ,  Hironori Kobayashi ,  Shuichi Hirata

发明人： Shoriki Narita ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa ,  Hironori Kobayashi ,  Shuichi Hirata

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/6838 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/01087 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.

摘要翻译： 反转头装置（22）的吸嘴（65）具有在其内开有吸孔（65b）的前端面（65a）和与吸引孔（65b）一端连通的吸入通路（65c） 其中。 吸入孔（65b）外侧的远端面（65a）的一部分与电子部件（12）的凸块（39）抵接。 抽吸孔（65b）与没有凸起（39）的安装侧表面（12a）的一部分相对。 真空泵（65）通过吸入孔（65b）产生从吸入孔（65b）和安装侧面（12a）之间的间隙流入吸入通路（65c）的空气流。 电子部件（12）由空气流产生的负压保持在前端面（65a）。

公开(公告)号：USD588077S1

公开(公告)日：2009-03-10

申请号：US29320602

申请日：2008-06-30

申请人： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

设计人： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa