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72 条记录 (耗时 0.032 秒)

    Plasma processing apparatus
    6.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号：US08558460B2

    公开(公告)日：2013-10-15

    申请号：US13146086

    申请日：2010-01-25

    申请人： Masaru Nonomura ,  Hiroshi Haji ,  Kiyoshi Arita

    发明人： Masaru Nonomura ,  Hiroshi Haji ,  Kiyoshi Arita

    IPC分类号： H01J7/24

    CPC分类号： H01J37/32935

    摘要： A plasma processing apparatus includes: a vacuum chamber; a plasma processing execution portion; a discharge state detecting unit; a window portion; a camera; a first storing portion; a second storing portion; and an image data extracting unit. The image data extracting unit extracts at least moving image data, which show the generation state of the abnormal discharge, from the first storing portion and stores the extracted moving image data in the second storing portion when the discharge state detecting unit detects the abnormal discharge.

    摘要翻译： 一种等离子体处理装置，包括：真空室; 等离子体处理执行部分; 放电状态检测单元; 窗口部分; 相机; 第一存储部分; 第二存储部分; 和图像数据提取单元。 当排出状态检测单元检测到异常放电时，图像数据提取单元至少从第一存储部分中提取表示异常放电的生成状态的运动图像数据并将提取的运动图像数据存储在第二存储部分中。

    Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
    7.
    发明授权
    Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks 有权
    半导体器件的制造方法以及半导体晶片切割掩模的形成装置

    公开(公告)号：US07629228B2

    公开(公告)日：2009-12-08

    申请号：US11193487

    申请日：2005-08-01

    申请人： Hiroshi Haji ,  Kiyoshi Arita ,  Teruaki Nishinaka

    发明人： Hiroshi Haji ,  Kiyoshi Arita ,  Teruaki Nishinaka

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the respective separate semiconductor devices are defined and a surface of a flawed semiconductor device among the respective semiconductor devices is partially exposed, and then plasma etching is applied to the mask placement-side surface of the semiconductor wafer so as to dice the semiconductor wafer into the respective semiconductor devices along the defined dicing lines, and an exposed portion of the flawed semiconductor device is removed so as to form a removed portion as a flawed semiconductor device distinguishing mark.

    摘要翻译： 在其中形成有多个半导体器件的半导体晶片的掩模放置侧表面上，设置掩模，同时定义用于将半导体晶片切割成各自的分离的半导体器件的切割线和有缺陷的半导体器件的表面 在各个半导体器件中部分曝光，然后将等离子体蚀刻施加到半导体晶片的掩模放置侧表面，以便沿着限定的切割线将半导体晶片切割成各个半导体器件，并且将暴露部分 去除有缺陷的半导体器件，以形成作为有缺陷的半导体器件区分标记的去除部分。

    Electronic Component Mounting Apparatus And method Of Mounting Electronic Components
    8.
    发明申请
    Electronic Component Mounting Apparatus And method Of Mounting Electronic Components 有权
    电子元件安装装置及其安装方法

    公开(公告)号：US20080104831A1

    公开(公告)日：2008-05-08

    申请号：US10571289

    申请日：2005-04-08

    申请人： Hiroshi Haji ,  Mitsuru Ozono

    发明人： Hiroshi Haji ,  Mitsuru Ozono

    IPC分类号： H05K13/04 ,  H05K13/00 ,  H05K3/30

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/681 ,  H01L21/6838 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： In an electronic component mounting process for mounting electronic components (6) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual heater, and a time taken for the mounting operation is so allotted that a first heating time of a duration from a moment when the suction nozzle comes into contact with the electronic component for picking it up till another moment immediately before it begins a mounting motion to the substrate is longer than a second heating time of a duration from the moment when the suction nozzle begins the mounting motion till another moment when it leaves the electronic component mounted to the substrate.

    摘要翻译： 在将电子部件（6）安装到基板的电子部件安装工序中，将具有粘接于基板的表面上的粘接层的各电子部件用设置有各个加热器的吸嘴进行拾取， 因为安装操作被分配成使得从吸嘴与电子部件接触的时刻的持续时间的第一加热时间直到其开始向基板的安装运动之前的另一时刻长于 从吸嘴开始安装运动的时刻到其离开安装在基板上的电子部件的另一时刻的持续时间的第二加热时间。

    Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device
    9.
    发明授权
    Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device 失效
    等离子体处理装置，等离子体处理方法及制造半导体装置的方法

    公开(公告)号：US07074720B2

    公开(公告)日：2006-07-11

    申请号：US10178444

    申请日：2002-06-21

    申请人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Hiroshi Haji ,  Shoji Sakemi

    发明人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Hiroshi Haji ,  Shoji Sakemi

    IPC分类号： H01L21/302 ,  H01L21/3065

    CPC分类号： H01L21/6835 ,  H01J37/3244 ,  H01J37/32532 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

    摘要： In a plasma treating apparatus, a ceramic porous substance having a three-dimensional network structure in which a frame portion 18a formed of ceramic containing alumina is provided continuously like a three-dimensional network is used for the material of an electrode member 17 for the plasma treating apparatus to be attached to the front surface of a gas supplying port of an electrode for plasma generation, and a gas for plasma generation is caused to pass through a hole portion 18b formed irregularly in the three-dimensional network structure. Consequently, the distribution of the gas to be supplied is made uniform to prevent an abnormal discharge so that uniform etching having no variation can be carried out.

    摘要翻译： 在等离子体处理装置中，将具有三维网状结构的陶瓷多孔物质用于电极部件17的材料，其中三维网状结构的三维网状连续地设置有由含有氧化铝的陶瓷构成的框架部分18a， 等离子体产生用电极的气体供给口的前表面的等离子体处理装置和等离子体产生用气体通过三维网状结构中不规则形成的孔部18b。 因此，供给气体的分布均匀，以防止异常放电，从而可以进行不变化的均匀蚀刻。

    Electronic component mounting apparatus and electronic component mounting method
    10.
    发明授权
    Electronic component mounting apparatus and electronic component mounting method 失效

    公开(公告)号：US07025244B2

    公开(公告)日：2006-04-11

    申请号：US10774239

    申请日：2004-02-06

    申请人： Hiroshi Haji

    发明人： Hiroshi Haji

    IPC分类号： B23K20/00

    CPC分类号： H01L24/81 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/49131

    摘要： In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electronic component mounting portion so as to be mounted thereon while the detected relative positional relationship is reflected.