公开(公告)号：US20120169786A1

公开(公告)日：2012-07-05

申请号：US13332635

申请日：2011-12-21

申请人： Hiroyuki Okuyama ,  Katsuhiro Tomoda ,  Naoki Hirao

发明人： Hiroyuki Okuyama ,  Katsuhiro Tomoda ,  Naoki Hirao

IPC分类号： G09G5/10 ,  F21V21/00

CPC分类号： H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A light emitting device includes: one or plural light emitting elements having plural electrodes; a chip-like insulator surrounding the one or plural light emitting elements from a side surface side of the one or plural light emitting elements; and plural terminal electrodes electrically connected one-to-one with the plural electrodes, and having protrusions each protruding from a peripheral edge of the chip-like insulator.

摘要翻译： 发光器件包括：一个或多个具有多个电极的发光元件; 围绕所述一个或多个发光元件的所述一个或多个发光元件的侧表面侧的芯片状绝缘体; 以及与多个电极一一对应地电连接的多个端子电极，并且具有从芯片状绝缘体的周缘突出的突起。

公开(公告)号：US08928009B2

公开(公告)日：2015-01-06

申请号：US13332635

申请日：2011-12-21

申请人： Hiroyuki Okuyama ,  Katsuhiro Tomoda ,  Naoki Hirao

发明人： Hiroyuki Okuyama ,  Katsuhiro Tomoda ,  Naoki Hirao

IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L33/62 ,  H01L33/54

CPC分类号： H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A light emitting device includes: one or plural light emitting elements having plural electrodes; a chip-like insulator surrounding the one or plural light emitting elements from a side surface side of the one or plural light emitting elements; and plural terminal electrodes electrically connected one-to-one with the plural electrodes, and having protrusions each protruding from a peripheral edge of the chip-like insulator.

摘要翻译： 发光器件包括：一个或多个具有多个电极的发光元件; 围绕所述一个或多个发光元件的所述一个或多个发光元件的侧表面侧的芯片状绝缘体; 以及与多个电极一一对应地电连接的多个端子电极，并且具有从芯片状绝缘体的周缘突出的突起。

公开(公告)号：US08686447B2

公开(公告)日：2014-04-01

申请号：US13402137

申请日：2012-02-22

申请人： Katsuhiro Tomoda ,  Naoki Hirao ,  Goshi Biwa

发明人： Katsuhiro Tomoda ,  Naoki Hirao ,  Goshi Biwa

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/20 ,  H01L33/44 ,  H01L33/46 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting unit including plural kinds of light emitting elements with different light emitting wavelengths, wherein, among the light emitting elements, at least one kind of light emitting element includes a semiconductor layer configured by laminating a first conductive layer, an active layer and a second conductive layer and having a side surface exposed by the first conductive layer, the active layer and the second conductive layer; a first electrode electrically connected to the first conductive layer; a second electrode electrically connected to the second conductive layer; a first insulation layer contacting at least an exposed surface of the active layer in the surface of the semiconductor layer; and a metal layer contacting at least a surface, which is opposite to the exposed surface of the active layer, in the surface of the first insulation layer, and electrically separated from the first electrode and the second electrode.

摘要翻译： 一种发光单元，包括具有不同发光波长的多种发光元件，其中，在发光元件中，至少一种发光元件包括通过层叠第一导电层，有源层和 第二导电层，并且具有由第一导电层，有源层和第二导电层暴露的侧表面; 电连接到第一导电层的第一电极; 电连接到第二导电层的第二电极; 第一绝缘层，与所述半导体层的表面中的所述有源层的至少暴露表面接触; 以及在所述第一绝缘层的表面中至少与所述有源层的暴露表面相对的表面接触的金属层，并且与所述第一电极和所述第二电极电隔离。

公开(公告)号：US07838410B2

公开(公告)日：2010-11-23

申请号：US12163636

申请日：2008-06-27

申请人： Naoki Hirao ,  Yasunobu Iwakoshi ,  Katsuhiro Tomoda ,  Huy Sam

发明人： Naoki Hirao ,  Yasunobu Iwakoshi ,  Katsuhiro Tomoda ,  Huy Sam

IPC分类号： H01L21/44

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L33/385 ,  H01L2221/68368 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

摘要： A method of electrically connecting an element to wiring includes the steps of forming a conductive fixing member precursor layer at least on wiring provided on a base; and arranging an element having a connecting portion on the wiring such that the connecting portion contacts the conductive fixing member precursor layer, and then heating the conductive fixing member precursor layer to form a conductive fixing member latter, thereby fixing the connecting portion of the element to the wiring, with the conductive fixing member layer therebetween, wherein the conductive fixing member precursor layer is composed of a solution-tape conductive material.

摘要翻译： 将元件电连接到布线的方法包括以下步骤：至少在设置在基座上的布线上形成导电固定构件前体层; 并且在所述布线上布置具有连接部分的元件，使得所述连接部分接触所述导电固定构件前体层，然后加热所述导电固定构件前体层以形成导电固定构件，从而将所述元件的连接部分固定到 布线，其间具有导电固定构件层，其中导电固定构件前体层由溶液带导电材料构成。

公开(公告)号：US09065029B2

公开(公告)日：2015-06-23

申请号：US13361264

申请日：2012-01-30

申请人： Naoki Hirao ,  Katsuhiro Tomoda

发明人： Naoki Hirao ,  Katsuhiro Tomoda

IPC分类号： H01L27/15 ,  H01L21/00 ,  H01L33/62 ,  H01L23/00 ,  H01L33/60

CPC分类号： H01L25/0753 ,  G09G5/10 ,  H01L24/24 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/82 ,  H01L33/385 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40245 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/84

摘要： Disclosed herein is a light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.

摘要翻译： 本发明公开了一种发光装置，包括：一个或多个发光装置，每个发光装置具有多个电极，并且每个发光装置从发光装置的上表面发射光; 多个端子电极，其设置在发光器件的下侧，与发光器件处于位置关系，并电连接到发光器件的电极; 第一金属线与发光器件的上表面和一个端子电极接触，设置在远离发光器件的侧表面的位置，并在电影制作过程中产生; 以及其中嵌入有发光器件和第一金属线的绝缘体。

公开(公告)号：US20120223345A1

公开(公告)日：2012-09-06

申请号：US13402137

申请日：2012-02-22

申请人： Katsuhiro Tomoda ,  Naoki Hirao ,  Goshi Biwa

发明人： Katsuhiro Tomoda ,  Naoki Hirao ,  Goshi Biwa

IPC分类号： H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/20 ,  H01L33/44 ,  H01L33/46 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting unit including plural kinds of light emitting elements with different light emitting wavelengths, wherein, among the light emitting elements, at least one kind of light emitting element includes a semiconductor layer configured by laminating a first conductive layer, an active layer and a second conductive layer and having a side surface exposed by the first conductive layer, the active layer and the second conductive layer; a first electrode electrically connected to the first conductive layer; a second electrode electrically connected to the second conductive layer; a first insulation layer contacting at least an exposed surface of the active layer in the surface of the semiconductor layer; and a metal layer contacting at least a surface, which is opposite to the exposed surface of the active layer, in the surface of the first insulation layer, and electrically separated from the first electrode and the second electrode.

摘要翻译： 一种发光单元，包括具有不同发光波长的多种发光元件，其中，在发光元件中，至少一种发光元件包括通过层叠第一导电层，有源层和 第二导电层，并且具有由第一导电层，有源层和第二导电层暴露的侧表面; 电连接到第一导电层的第一电极; 电连接到第二导电层的第二电极; 第一绝缘层，与所述半导体层的表面中的所述有源层的至少暴露表面接触; 以及在所述第一绝缘层的表面中至少与所述有源层的暴露表面相对的表面接触的金属层，并且与所述第一电极和所述第二电极电隔离。

公开(公告)号：US08476826B2

公开(公告)日：2013-07-02

申请号：US12731857

申请日：2010-03-25

申请人： Toyoharu Oohata ,  Katsuhiro Tomoda ,  Naoki Hirao ,  Masato Doi

发明人： Toyoharu Oohata ,  Katsuhiro Tomoda ,  Naoki Hirao ,  Masato Doi

IPC分类号： H01J1/62 ,  H01J9/20

CPC分类号： H01L25/0753 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2224/83 ,  H01L2924/00

摘要： A manufacturing method of a display device, includes: a first step of collectively transferring light-emitting elements arranged at every specified number of light-emitting elements formed and arranged on a first substrate to a transfer area set on a second substrate; and a second step of transferring light-emitting elements remaining on the first substrate to between the plural light-emitting elements mounted on the second substrate in at least one of a state where the first substrate is moved with respect to the transfer area on the second substrate and a state where the first substrate is rotated in a plane.

摘要翻译： 一种显示装置的制造方法，其特征在于，包括：将形成在第一基板上的每隔规定数量的发光元件配置的发光元件集中转移到设置在第二基板上的转印区域的第一工序; 以及第二步骤，将剩余在第一基板上的发光元件转移到安装在第二基板上的多个发光元件之间的至少一个状态，其中第一基板相对于第二基板上的转印区域移动 衬底和第一衬底在平面中旋转的状态。

公开(公告)号：US20120218318A1

公开(公告)日：2012-08-30

申请号：US13361264

申请日：2012-01-30

申请人： Naoki Hirao ,  Katsuhiro Tomoda

发明人： Naoki Hirao ,  Katsuhiro Tomoda

IPC分类号： G09G5/10 ,  H01L33/36 ,  H01L33/52 ,  H01L27/15

CPC分类号： H01L25/0753 ,  G09G5/10 ,  H01L24/24 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/82 ,  H01L33/385 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40245 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/84

摘要： Disclosed herein is a light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.

摘要翻译： 本发明公开了一种发光装置，包括：一个或多个发光装置，每个发光装置具有多个电极，并且每个发光装置从发光装置的上表面发射光; 多个端子电极，其设置在发光器件的下侧，与发光器件处于位置关系，并电连接到发光器件的电极; 第一金属线与发光器件的上表面和一个端子电极接触，设置在远离发光器件的侧表面的位置，并在电影制作过程中产生; 以及其中嵌入有发光器件和第一金属线的绝缘体。

公开(公告)号：US20100259164A1

公开(公告)日：2010-10-14

申请号：US12731857

申请日：2010-03-25

申请人： Toyoharu Oohata ,  Katsuhiro Tomoda ,  Naoki Hirao ,  Masato Doi

发明人： Toyoharu Oohata ,  Katsuhiro Tomoda ,  Naoki Hirao ,  Masato Doi

IPC分类号： H01J1/62 ,  H01J9/20

CPC分类号： H01L25/0753 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2224/83 ,  H01L2924/00

摘要： A manufacturing method of a display device, includes: a first step of collectively transferring light-emitting elements arranged at every specified number of light-emitting elements formed and arranged on a first substrate to a transfer area set on a second substrate; and a second step of transferring light-emitting elements remaining on the first substrate to between the plural light-emitting elements mounted on the second substrate in at least one of a state where the first substrate is moved with respect to the transfer area on the second substrate and a state where the first substrate is rotated in a plane.

摘要翻译： 一种显示装置的制造方法，其特征在于，包括：将形成在第一基板上的每隔规定数量的发光元件配置的发光元件集中转移到设置在第二基板上的转印区域的第一工序; 以及第二步骤，将剩余在第一基板上的发光元件转移到安装在第二基板上的多个发光元件之间的至少一个状态，其中第一基板相对于第二基板上的转印区域移动 衬底和第一衬底在平面中旋转的状态。

公开(公告)号：US20090014748A1

公开(公告)日：2009-01-15

申请号：US12163636

申请日：2008-06-27

申请人： Naoki Hirao ,  Yasunobu Iwakoshi ,  Katsuhiro Tomoda ,  Huy Sam

发明人： Naoki Hirao ,  Yasunobu Iwakoshi ,  Katsuhiro Tomoda ,  Huy Sam

IPC分类号： H01L33/00 ,  H01L21/58

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L33/385 ,  H01L2221/68368 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

摘要： A method of electrically connecting an element to wiring includes the steps of forming a conductive fixing member precursor layer at least on wiring provided on a base, and arranging an element having a connecting portion on the wiring such that the connecting portion contacts the conductive fixing member precursor layer, and then heating the conductive fixing member precursor layer to form a conductive fixing member latter, thereby fixing the connecting portion of the element to the wiring, with the conductive fixing member layer therebetween, wherein the conductive fixing member precursor layer is composed of a solution-tape conductive material.

摘要翻译： 将元件电连接到布线的方法包括以下步骤：至少在设置在基座上的布线上形成导电固定构件前体层，并且在布线上布置具有连接部分的元件，使得连接部分接触导电固定构件 前驱体层，然后加热导电性固定构件前体层，形成后者的导电性固定构件，由此将导电性固定构件层固定在配线上，其中导电性固定构件前体层由 溶液带导电材料。