公开(公告)号：US20070251324A1

公开(公告)日：2007-11-01

申请号：US11790298

申请日：2007-04-24

申请人： Hiroyuki Wado ,  Makiko Sugiura

发明人： Hiroyuki Wado ,  Makiko Sugiura

IPC分类号： G01H11/00

CPC分类号： B06B1/0688 ,  H01L41/0973

摘要： An ultrasonic sensor is provided with a substrate unit where a thin-walled portion is arranged and a piezoelectric oscillator which is formed at the substrate unit. The piezoelectric oscillator includes two electrodes and a piezoelectric film positioned between the two electrodes. The thin-walled portion and the piezoelectric oscillator construct a membrane structure which will resonate at a predetermined frequency.

摘要翻译： 超声波传感器设置有布置有薄壁部分的基板单元和形成在基板单元处的压电振荡器。 压电振荡器包括两个电极和位于两个电极之间的压电薄膜。 薄壁部分和压电振荡器构成将以预定频率谐振的膜结构。

公开(公告)号：US07730785B2

公开(公告)日：2010-06-08

申请号：US11790298

申请日：2007-04-24

申请人： Hiroyuki Wado ,  Makiko Sugiura

发明人： Hiroyuki Wado ,  Makiko Sugiura

IPC分类号： G01N9/24 ,  H01L41/00

CPC分类号： B06B1/0688 ,  H01L41/0973

摘要： An ultrasonic sensor is provided with a substrate unit where a thin-walled portion is arranged and a piezoelectric oscillator which is formed at the substrate unit. The piezoelectric oscillator includes two electrodes and a piezoelectric film positioned between the two electrodes. The thin-walled portion and the piezoelectric oscillator construct a membrane structure which will resonate at a predetermined frequency.

摘要翻译： 超声波传感器设置有布置有薄壁部分的基板单元和形成在基板单元处的压电振荡器。 压电振荡器包括两个电极和位于两个电极之间的压电薄膜。 薄壁部分和压电振荡器构成将以预定频率谐振的膜结构。

公开(公告)号：US06602428B2

公开(公告)日：2003-08-05

申请号：US09991986

申请日：2001-11-26

申请人： Hiroyuki Wado ,  Makiko Sugiura ,  Toshimasa Yamamoto ,  Yukihiro Takeuchi ,  Yasushi Kohno

发明人： Hiroyuki Wado ,  Makiko Sugiura ,  Toshimasa Yamamoto ,  Yukihiro Takeuchi ,  Yasushi Kohno

IPC分类号： H01L2100

CPC分类号： G01F1/6845 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00182 ,  B81C2201/014 ,  B81C2201/0169 ,  G01L9/0042

摘要： A sensor for measuring a physical amount such as an amount of air includes a membrane structure composed of metal stripes sandwiched between first and second insulating layers. A metal layer made of platinum or the like is formed on the first insulating layer and then heat-treated to improve its properties. Then, the metal layer is etched into a form of the metal stripes. The second insulating layer made of a material such as silicon dioxide is formed on the etched metal stripes. Since the metal layer is heat-treated before it is etched into the form of metal stripes, the metal stripes are not deformed by the heat-treatment. The second insulating layer can be formed on the metal stripes without generating cracks in the second insulating layer.

公开(公告)号：US20060194332A1

公开(公告)日：2006-08-31

申请号：US11410093

申请日：2006-04-25

申请人： Hiroyuki Wado ,  Makiko Sugiura ,  Yukihiro Takeuchi ,  Takao Iwaki

发明人： Hiroyuki Wado ,  Makiko Sugiura ,  Yukihiro Takeuchi ,  Takao Iwaki

IPC分类号： G01N33/00

CPC分类号： G01N27/124

摘要： A more reliable gas sensor includes a support film formed on a surface of a substrate and a heater electrode. Surrounding the heater electrode is a heater electrical insulation layer 4. Detection electrodes are formed above the electrical insulation layer. A flat insulating layer is formed over the heater insulation layer, and surfaces of the detection electrodes are exposed and flush with the upper surface of the flat insulating layer. A sensitive film is formed above the flat insulating layer in contact with the surfaces of the detection electrodes. A hollow cavity is formed in the substrate.

摘要翻译： 更可靠的气体传感器包括形成在基板的表面上的支撑膜和加热器电极。 加热器电极周围是加热器电绝缘层4。 检测电极形成在电绝缘层的上方。 在加热器绝缘层之上形成平坦的绝缘层，并且检测电极的表面暴露并与平坦绝缘层的上表面齐平。 敏感膜形成在与检测电极的表面接触的平坦绝缘层的上方。 在基板中形成中空腔。

公开(公告)号：US06768291B2

公开(公告)日：2004-07-27

申请号：US10107443

申请日：2002-03-28

申请人： Toshiki Isogai ,  Yasushi Kohno ,  Toshimasa Yamamoto ,  Hiroyuki Wado

发明人： Toshiki Isogai ,  Yasushi Kohno ,  Toshimasa Yamamoto ,  Hiroyuki Wado

IPC分类号： G01N2700

CPC分类号： G01F1/6845

摘要： In a sensor chip for a fluid flow sensor, a thin film portion is formed above a hollow cavity portion while leaving thin film layers formed on the surface of a substrate. A conductor is provided on the inner wall face of a through hole formed to penetrate the substrate to thereby electrically connect a detecting portion constituted by a conductor film in the thin film layers and a substrate conductor portion formed on the rear face side of the through hole. The surface of a circuit board is formed with a control circuit and a base conductor portion electrically connected to the control circuit. The sensor chip and the circuit board are layered and the substrate conductor portion and the base conductor portion are electrically connected.

摘要翻译： 在用于流体流量传感器的传感器芯片中，在中空空腔部分的上方形成薄膜部分，同时留下形成在基板表面上的薄膜层。 在形成为穿透基板的通孔的内壁面上设置有导体，由此将由薄膜层中的导体膜构成的检测部和形成在通孔的背面侧的基板导体部电连接 。 电路板的表面形成有电连接到控制电路的控制电路和基底导体部分。 传感器芯片和电路板被层叠，并且基板导体部分和基底导体部分电连接。

公开(公告)号：US07807061B2

公开(公告)日：2010-10-05

申请号：US11822748

申请日：2007-07-10

申请人： Hiroyuki Wado ,  Kazuhiko Kanoh

发明人： Hiroyuki Wado ,  Kazuhiko Kanoh

IPC分类号： C23F1/00

CPC分类号： G01N21/031 ,  G01N21/3504

摘要： A method of producing a structure by three-dimensionally processing a flat member includes a preparing, a first forming and a second forming. In the preparing, a substrate is prepared. In the first forming, an etching mask is formed on the substrate. The etching mask has at least two openings, and areas of the two openings are different from each other. In the second forming, at least a part of a three-dimension surface shape of the structure is formed on a surface of the substrate by a dry-etching on the substrate in accordance with the area of the opening of the etching mask.

摘要翻译： 通过三维处理平坦部件制造结构的方法包括准备，第一成形和第二成形。 在制备中，制备底物。 在第一次成形中，在基板上形成蚀刻掩模。 蚀刻掩模具有至少两个开口，并且两个开口的区域彼此不同。 在第二次成形中，通过根据蚀刻掩模的开口面积在基板上通过干法蚀刻在基板的表面上形成三维表面形状的至少一部分。

公开(公告)号：US20080190175A1

公开(公告)日：2008-08-14

申请号：US11822748

申请日：2007-07-10

申请人： Hiroyuki Wado ,  Kazuhiko Kanoh

发明人： Hiroyuki Wado ,  Kazuhiko Kanoh

IPC分类号： G01N7/00

CPC分类号： G01N21/031 ,  G01N21/3504

摘要： A method of producing a structure by three-dimensionally processing a flat member includes a preparing, a first forming and a second forming. In the preparing, a substrate is prepared. In the first forming, an etching mask is formed on the substrate. The etching mask has at least two openings, and areas of the two openings are different from each other. In the second forming, at least a part of a three-dimension surface shape of the structure is formed on a surface of the substrate by a dry-etching on the substrate in accordance with the area of the opening of the etching mask.

摘要翻译： 通过三维处理平坦部件制造结构的方法包括准备，第一成形和第二成形。 在制备中，制备底物。 在第一次成形中，在基板上形成蚀刻掩模。 蚀刻掩模具有至少两个开口，并且两个开口的区域彼此不同。 在第二次成形中，通过根据蚀刻掩模的开口面积在基板上通过干法蚀刻在基板的表面上形成三维表面形状的至少一部分。

公开(公告)号：US06694811B2

公开(公告)日：2004-02-24

申请号：US10379938

申请日：2003-03-06

申请人： Yasushi Kohno ,  Toshimasa Yamamoto ,  Hiroyuki Wado ,  Tetsuo Yoshioka

发明人： Yasushi Kohno ,  Toshimasa Yamamoto ,  Hiroyuki Wado ,  Tetsuo Yoshioka

IPC分类号： G01F168

CPC分类号： G01F1/6842

摘要： A flow meter is formed with a passage for introducing and carrying air to measure and has a sensing part disposed in the passage for measuring a flow rate of the air. A contraction part is formed on an inner surface of the passage so that the contraction part faces the sensing part. The contraction part narrows the flow of the air flowing near the sensing part. A flat surface of the contraction part is formed in parallel with the surface of the sensing part and at least upstream of the sensing part. Thus, collision of particles against the sensing part and adhesion of contaminants to the sensing pert are inhibited. Meanwhile, the flow rate of the air is measured stably and accurately.

摘要翻译： 流量计形成有用于引入和携带空气进行测量的通道，并且具有设置在通道中的用于测量空气流量的感测部分。 收缩部分形成在通道的内表面上，使得收缩部分面向感测部分。 收缩部分使感应部分附近的空气流动变窄。 收缩部分的平坦表面形成为与感测部分的表面平行并且至少在感测部分的上游。 因此，抑制了颗粒与传感部分的碰撞以及污染物与传感污染物的粘附。 同时，稳定且准确地测量空气的流量。

公开(公告)号：US08558375B2

公开(公告)日：2013-10-15

申请号：US13170475

申请日：2011-06-28

申请人： Kuniaki Mamitsu ,  Takahisa Kaneko ,  Masaya Tonomoto ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Chikage Noritake ,  Eiji Nomura ,  Toshiki Itoh

发明人： Kuniaki Mamitsu ,  Takahisa Kaneko ,  Masaya Tonomoto ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Chikage Noritake ,  Eiji Nomura ,  Toshiki Itoh

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

摘要翻译： 半导体器件包括封装和冷却器。 半导体封装包括半导体元件，金属构件和用于封装半导体元件和金属构件的模制构件。 金属构件具有热连接到半导体元件的金属部分，金属部分上的绝缘层和绝缘层上的导电层。 导电层至少部分地暴露在模制构件的外部，并且用作用于辐射半导体元件的热的辐射表面。 冷却器具有冷却剂通道，冷却剂通过该通道冷却导电层。 导电层和冷却器电连接在一起。

公开(公告)号：US20120001308A1

公开(公告)日：2012-01-05

申请号：US13173248

申请日：2011-06-30

申请人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

发明人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/32 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

摘要翻译： 在半导体模块中，第一散热器设置在构成上臂的第一半导体芯片的后表面上，第二散热器通过第一端子设置在第一半导体芯片的前表面上。 第三散热器设置在构成下臂的第二半导体芯片的后表面上，第四散热器通过第二端子设置在第二半导体芯片的前表面上。 用于连接上臂和下臂的连接部分与第一端子成一体，并且相对于第一端子倾斜地连接到第三散热器。